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NLV14043BDG

Onsemi

NLV14043BDG by Onsemi

NLV14043BDG by Onsemi is a 4-bit latch with 350 ns propagation delay at 5V. It has a small outline package, operates b/w -55 to 125 °C, and is AEC-Q100 qualified. Ideal for military applications requiring high-level trigger type and true output polarity.

Median Price

$0.670

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 419 parts In-Stock

1+ parts

$0.670

100+ parts

$0.396

1k+ parts

-

10k+ parts

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419

$0.670

$0.396

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DigiKey

USA . 90 parts In-Stock

1+ parts

$0.670

100+ parts

$0.396

1k+ parts

$0.328

10k+ parts

$0.295

90

$0.670

$0.396

$0.328

$0.295

Flip Electronics (Authorized)

USA . 3,552 parts In-Stock

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3,552

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Rochester

USA . 33 parts In-Stock

1+ parts

-

100+ parts

$0.359

1k+ parts

$0.298

10k+ parts

$0.266

33

-

$0.359

$0.298

$0.266

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,157 parts In-Stock

1+ parts

$0.279

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2,157

$0.279

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Vyrian

USA . 11,023 parts In-Stock

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11,023

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Flip Electronics

USA . 3,600 parts In-Stock

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3,600

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ComSIT Distribution GmbH

Germany . 2,081 parts In-Stock

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2,081

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,805 parts In-Stock

1+ parts

$0.265

100+ parts

-

1k+ parts

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10k+ parts

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1,805

$0.265

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Corohmni

South Africa . 253 parts In-Stock

1+ parts

$0.294

100+ parts

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253

$0.294

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Vigor

Singapore . 347 parts In-Stock

1+ parts

$0.490

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347

$0.490

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Ampacity Inc.

Singapore . 839 parts In-Stock

1+ parts

$0.540

100+ parts

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839

$0.540

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Advanced Electronics

New Zealand . 15 parts In-Stock

1+ parts

$28.636

100+ parts

$26.059

1k+ parts

$23.482

10k+ parts

-

15

$28.636

$26.059

$23.482

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Kulean Microsystems

USA . 8,268 parts In-Stock

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8,268

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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SupplyDigital Components

Austria . 3,817 parts In-Stock

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TANS Electronics

Latvia . 3,549 parts In-Stock

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3,549

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Problanco Electronics

Mexico . 1,206 parts In-Stock

1+ parts

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1,206

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UHIMA Technologies

Türkiye . 720 parts In-Stock

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720

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Overview

Unlock a world of possibilities with the NLV14043BDG by Onsemi! Crafted with precision and quality, this latches & flip-flops device offers unparalleled performance and reliability. Ideal for various applications, this product ensures seamless operation and efficient functionality. With a compact design and advanced technology, customers can trust in the value and benefits that this product provides. Experience the advantages of Onsemi's expertise and elevate your projects to new heights with the NLV14043BDG.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the latch & flip-flop lightweight and durable, ensuring a longer lifespan.

Propagation Delay At Nominal Supply: 350 ns

The low propagation delay allows for quick response and operation, making this latch & flip-flop efficient in time-critical applications.

Surface Mount: YES

The surface mount feature makes installation and integration of this latch & flip-flop easy and convenient.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of space and easier placement on PCBs, enhancing overall design flexibility.

Nominal Supply Voltage / Vsup (V): 5

With a nominal supply voltage of 5V, this latch & flip-flop is compatible with a wide range of electronic systems and circuits.

Load Capacitance (CL): 50 pF

The low load capacitance ensures efficient operation and minimal power consumption in this latch & flip-flop.

Temperature Grade: MILITARY

The military-grade temperature rating ensures reliability and performance in extreme environmental conditions, making this latch & flip-flop suitable for a wide range of applications.

Technology: CMOS

The CMOS technology used in this latch & flip-flop provides high speed, low power consumption, and compatibility with various digital systems.

Technical Specifications

Latches & Flip-Flops NLV14043BDG attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

350 ns

Propagation Delay (tpd):

350 ns

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

HIGH LEVEL

Width:

3.9 mm

Trade Compliance

NLV14043BDG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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