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NLV14027BDR2G

Onsemi

NLV14027BDR2G by Onsemi

NLV14027BDR2G by Onsemi is a dual-function latch with 16 terminals. It operates at a supply voltage of 5V and has a propagation delay of 350ns. Ideal for military applications, it features positive edge triggering and can handle temperatures ranging from -55 to 125°C.

Median Price

$0.396

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,360 parts In-Stock

1+ parts

$0.520

100+ parts

$0.285

1k+ parts

$0.245

10k+ parts

$0.222

1,360

$0.520

$0.285

$0.245

$0.222

Mouser Electronics

USA . 72 parts In-Stock

1+ parts

$0.520

100+ parts

$0.286

1k+ parts

$0.246

10k+ parts

$0.232

72

$0.520

$0.286

$0.246

$0.232

Rochester

USA . 14,798 parts In-Stock

1+ parts

-

100+ parts

$0.272

1k+ parts

$0.226

10k+ parts

$0.201

14,798

-

$0.272

$0.226

$0.201

Verical

USA . 14,798 parts In-Stock

1+ parts

-

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$0.252

14,798

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-

-

$0.252

Distributors (In-Stock)

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Digiode

USA . 1,610 parts In-Stock

1+ parts

$0.212

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1,610

$0.212

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Vyrian

USA . 2,398 parts In-Stock

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$0.223

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2,398

$0.223

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Flip Electronics

USA . 2,500 parts In-Stock

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2,500

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Distributors (Availability)

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Corphita

USA . 1,342 parts In-Stock

1+ parts

$0.201

100+ parts

-

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1,342

$0.201

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Vigor

Singapore . 150 parts In-Stock

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$0.220

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150

$0.220

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Corohmni

South Africa . 459 parts In-Stock

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$0.223

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459

$0.223

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Microchip USA

USA . 4,247 parts In-Stock

1+ parts

$1.500

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4,247

$1.500

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iodParts Technologies Inc.

India . 22,336 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 18,677 parts In-Stock

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18,677

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TANS Electronics

Latvia . 4,473 parts In-Stock

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4,473

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SupplyDigital Components

Austria . 1,393 parts In-Stock

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Problanco Electronics

Mexico . 1,015 parts In-Stock

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Kulean Microsystems

USA . 952 parts In-Stock

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UHIMA Technologies

Türkiye . 155 parts In-Stock

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Overview

Looking for reliable latches & flip-flops for your next project? Look no further than the NLV14027BDR2G by Onsemi. With a solid reputation for quality and durability, Onsemi delivers top-notch solutions for a wide range of applications. This versatile product offers customers exceptional value with its fast propagation delay, complementary output polarity, and AEC-Q100 screening level. Trust Onsemi to provide the reliability and performance you need for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material that can withstand various environmental conditions.

Surface Mount: YES

Makes it easy to integrate into circuit boards without the need for additional mounting hardware.

No. of Functions: 2

Provides versatility and functionality in a single component.

Screening Level: AEC-Q100

Meets automotive industry standards for reliability and performance.

Package Shape: RECTANGULAR

Simplifies the integration and placement of the component on a circuit board.

Nominal Supply Voltage / Vsup (V): 5

Compatible with standard voltage levels used in electronics.

Load Capacitance (CL): 50 pF

Suitable for a wide range of applications that require a specific load capacitance.

Power Supplies (V): 5/15

Supports dual power supply options for flexibility in design.

No. of Terminals: 16

Provides ample connectivity options for integrating into circuit designs.

Package Style (Meter): SMALL OUTLINE

Compact size saves space on the circuit board.

Propagation Delay (tpd): 350 ns

Fast response time for efficient signal processing.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures in various operating environments.

Trigger Type: POSITIVE EDGE

Allows for precise timing and control of circuit operations.

Minimum Operating Temperature: -55 °C

Can operate in extremely cold environments without loss of functionality.

Terminal Finish: MATTE TIN

Provides a reliable and corrosion-resistant finish for enhanced durability.

Terminal Position: DUAL

Multiple terminal positions offer flexibility in installation and connectivity.

Maximum Seated Height: 1.75 mm

Low profile design for compact and space-saving circuit board layouts.

Width: 3.9 mm

Narrow width allows for tight spacing between components on the circuit board.

Output Polarity: COMPLEMENTARY

Provides complementary outputs for balanced signal processing.

Minimum Supply Voltage (Vsup): 3 V

Can operate at lower voltage levels for energy-efficient designs.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand high reflow temperatures during manufacturing processes.

Peak Reflow Temperature °C: 260

High enough reflow temperature for reliable soldering during assembly.

Length: 9.9 mm

Compact length for efficient use of space on the circuit board.

Temperature Grade: MILITARY

Meets rigorous standards for reliability and performance in demanding environments.

Maximum Frequency At Nominal Supply: 1500000 Hz

Supports high-frequency operations for fast signal processing.

Technology: CMOS

Uses CMOS technology for low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminals for easy soldering and secure connections.

Packing Method: TR

Tape and reel packaging for efficient handling and deployment in manufacturing.

Terminal Pitch: 1.27 mm

Standard terminal pitch for compatibility with various circuit board designs.

Maximum Supply Voltage: 18 V

Can support higher voltage levels for powering multiple components in a circuit.

Technical Specifications

Latches & Flip-Flops NLV14027BDR2G attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

1500000 Hz

Moisture Sensitivity Level (MSL):

1

No. of Bits:

2

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Propagation Delay (tpd):

350 ns

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

3.9 mm

Trade Compliance

NLV14027BDR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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