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NLV14042BDG

Onsemi

NLV14042BDG by Onsemi

NLV14042BDG by Onsemi is a 4-bit latch with 440 ns propagation delay at 5V. It has a small outline package, operates in -55 to 125 °C, and is AEC-Q100 screened. Ideal for military applications requiring low-level trigger type and complementary output polarity.

Median Price

$0.409

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 6,768 parts In-Stock

1+ parts

-

100+ parts

$0.392

1k+ parts

$0.326

10k+ parts

$0.290

6,768

-

$0.392

$0.326

$0.290

Verical

USA . 6,768 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.426

10k+ parts

-

6,768

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-

$0.426

-

Distributors (In-Stock)

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Digiode

USA . 2,206 parts In-Stock

1+ parts

$0.320

100+ parts

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2,206

$0.320

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Vyrian

USA . 12,012 parts In-Stock

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12,012

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Distributors (Availability)

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Corohmni

South Africa . 422 parts In-Stock

1+ parts

$0.282

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-

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422

$0.282

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Corphita

USA . 2,492 parts In-Stock

1+ parts

$0.303

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2,492

$0.303

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Vigor

Singapore . 222 parts In-Stock

1+ parts

$0.320

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222

$0.320

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AZTECH Wire

Italy . 359 parts In-Stock

1+ parts

$12.290

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359

$12.290

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Kulean Microsystems

USA . 6,827 parts In-Stock

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6,827

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Continental Prestige Electronics

USA . 6,768 parts In-Stock

1+ parts

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$0.282

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6,768

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$0.282

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Problanco Electronics

Mexico . 3,559 parts In-Stock

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3,559

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SupplyDigital Components

Austria . 3,324 parts In-Stock

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UHIMA Technologies

Türkiye . 821 parts In-Stock

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821

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TANS Electronics

Latvia . 733 parts In-Stock

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733

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Microchip USA

USA . 468 parts In-Stock

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468

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Overview

Experience unmatched quality and reliability with the NLV14042BDG by Onsemi, a leading manufacturer in the industry. This versatile latch and flip-flop device offers exceptional performance and functionality, making it ideal for a wide range of applications. From automotive to industrial electronics, this product delivers value and benefits that cater to the unique needs of our customers. Trust in Onsemi to provide innovative solutions that elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Propagation Delay At Nominal Supply: 440 ns

Low propagation delay ensures fast and efficient operation of the latches and flip-flops, making them suitable for time-sensitive applications.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on circuit boards, saving space and simplifying the overall design.

Screening Level: AEC-Q100

AEC-Q100 screening level ensures high reliability and performance standards, making the product suitable for automotive applications where quality is crucial.

Nominal Supply Voltage / Vsup (V): 5

5V nominal supply voltage is a common standard in many electronic systems, making these latches and flip-flops compatible with a wide range of applications.

Load Capacitance (CL): 50 pF

Low load capacitance ensures minimal signal distortion and interference, leading to more accurate and reliable operation of the product.

Power Supplies (V): 5/15

Compatibility with 5V and 15V power supplies offers flexibility in power options, allowing the product to be used in a variety of voltage environments.

No. of Terminals: 16

Having 16 terminals provides ample connections for interfacing with other components, enabling versatile integration into different circuit layouts.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the circuit board, making it easier to accommodate the latches and flip-flops in compact electronic devices.

Maximum Operating Temperature: 125 °C

High maximum operating temperature range allows the product to withstand elevated heat conditions without compromising performance or reliability.

Trigger Type: LOW LEVEL

Low-level trigger type ensures precise and stable input signals for triggering the latches and flip-flops, preventing false triggers and errors in operation.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature enables the product to function reliably even in harsh cold environments, expanding its suitability for diverse applications.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides excellent solderability and corrosion resistance, enhancing the durability and lifespan of the product.

Output Polarity: COMPLEMENTARY

Complementary output polarity simplifies circuit design and signal processing, making it easier to integrate the latches and flip-flops into various digital systems.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast operation speed, making the product energy-efficient and reliable in digital applications.

Packing Method: TUBE

Tube packing method provides convenient storage and transportation of the product, ensuring protection and easy handling during shipping and installation.

Technical Specifications

Latches & Flip-Flops NLV14042BDG attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

440 ns

Propagation Delay (tpd):

440 ns

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

LOW LEVEL

Width:

3.9 mm

Trade Compliance

NLV14042BDG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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