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CD74ACT273M96G4

Texas Instruments

CD74ACT273M96G4 by Texas Instruments

CD74ACT273M96G4 by Texas Instruments is an 8-bit latch with positive edge trigger, operating at a max frequency of 85 MHz. It has a supply voltage range of 4.5V to 5.5V and can handle load capacitance up to 50 pF. This small outline package is commonly used in military-grade applications requiring fast data storage and retrieval.

Median Price

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Lifecycle Status

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1k+

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Vyrian

USA . 8,986 parts In-Stock

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Digiode

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Nova Conductors

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AZTECH Wire

Italy . 359 parts In-Stock

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$5.885

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Parana Technologies

USA . 1,405 parts In-Stock

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$16.636

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DigiPath Technology Company

USA . 753 parts In-Stock

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IDEA Electronic Components Group

UK . 1,650 parts In-Stock

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$18.692

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$17.757

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$16.823

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ChromeModa Solutions

Germany . 30 parts In-Stock

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$18.692

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$15.327

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One Stop Electronics

USA . 1,517 parts In-Stock

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$38.000

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Ampacity Inc.

Singapore . 282 parts In-Stock

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Continental Prestige Electronics

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Corphita

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Overview

Discover the CD74ACT273M96G4 by Texas Instruments, a high-quality latch & flip-flop device that delivers exceptional performance and reliability. With its advanced CMOS technology, this product offers customers unparalleled value and benefits. Whether you're a professional in the electronics industry or an enthusiast working on a personal project, the CD74ACT273M96G4 is perfect for a wide range of applications. Its compact size, low power consumption, and impressive operating temperature range make it ideal for demanding environments. Trust Texas Instruments, a renowned manufacturer known for their innovative solutions, and unlock endless possibilities with the CD74ACT273M96G4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This product is made from a durable plastic/epoxy material, ensuring its longevity and resistance to physical damage.

Surface Mount: YES

This product is designed for surface mounting, making it easy to integrate into various electronic systems and reducing assembly time.

No. of Functions: 1

With one function, this latch or flip-flop can efficiently control a single operation or process.

Package Shape: RECTANGULAR

The rectangular shape of this package allows for easy arrangement and placement in circuit boards, optimizing space utilization.

No. of Bits: 8

With 8 bits, this latch or flip-flop has the capacity to store and manipulate multiple binary values, providing greater flexibility and functionality.

Nominal Supply Voltage / Vsup (V): 5

The nominal supply voltage of 5V ensures compatibility with standard power sources, making this product widely suitable for a variety of applications.

Load Capacitance (CL): 50 pF

With a load capacitance of 50 picofarads, this latch or flip-flop can efficiently drive external circuitry without experiencing voltage or signal degradation.

Power Supplies (V): 5

This product requires a power supply voltage of 5V, allowing it to easily integrate with common electronic systems.

No. of Terminals: 20

The 20 terminals of this product enable easy connection and signal distribution in complex circuits, providing versatility for different applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style of this latch or flip-flop offers space-saving advantages, making it suitable for compact electronic designs.

Maximum I (ol): 24 Amp

The maximum output current of 24 Amperes allows this product to drive high-power loads without compromising performance and reliability.

Propagation Delay (tpd): 13.5 ns

With a low propagation delay of 13.5 nanoseconds, this latch or flip-flop can swiftly respond to input signals, ensuring rapid and accurate data processing.

Maximum Operating Temperature: 125 °C

This product can withstand high operating temperatures up to 125°C, making it suitable for demanding industrial and automotive applications.

Trigger Type: POSITIVE EDGE

With a positive edge trigger, this latch or flip-flop receives and responds to input signals when transitioning from a low to a high voltage level, offering precise control and synchronization.

Minimum Operating Temperature: -55 °C

This product is designed to operate reliably even in extreme cold temperatures as low as -55°C, making it suitable for outdoor and harsh environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish enhances the electrical conductivity and corrosion resistance of this product, ensuring stable and reliable connections.

Terminal Position: DUAL

This product has dual terminal positions, allowing for flexible mounting orientations and providing ease of use during circuit assembly and connection.

Maximum Seated Height: 2.65 mm

The maximum seated height of 2.65 millimeters ensures compatibility with low-profile circuit board designs, maximizing space utilization.

Width: 7.5 mm

With a compact width of 7.5 millimeters, this latch or flip-flop facilitates efficient utilization of available board space in tight electronic designs.

Output Polarity: TRUE

This product outputs a "true" logic level that corresponds to its input signal, ensuring accurate and reliable data transfer throughout the system.

Minimum Supply Voltage (Vsup): 4.5 V

This product can operate at a minimum supply voltage of 4.5V, allowing it to work efficiently even with slightly lower power sources.

Maximum Time At Peak Reflow Temperature (s): 30

During the solder reflow process, this product can endure a maximum time of 30 seconds at the peak reflow temperature, ensuring its reliability and resistance to thermal stress.

Peak Reflow Temperature °C: 260

This product can withstand peak reflow temperatures of up to 260°C, making it compatible with lead-free soldering processes.

Length: 12.8 mm

With a length of 12.8 millimeters, this latch or flip-flop can easily fit into standard-sized circuit boards and accommodate various design requirements.

Temperature Grade: MILITARY

Designed to meet military standards, this product offers enhanced durability, reliability, and performance in demanding military and aerospace applications.

Maximum Frequency At Nominal Supply: 85,000,000 Hz

With a maximum frequency of 85 million Hertz, this latch or flip-flop enables high-speed data processing and supports efficient operation in advanced electronic systems.

Technology: CMOS

Utilizing complementary metal-oxide-semiconductor (CMOS) technology, this product offers low power consumption, high noise immunity, and superior performance in digital circuits.

Terminal Form: GULL WING

The gull wing terminal form of this latch or flip-flop allows for easy soldering onto the circuit board, ensuring strong and reliable electrical connections.

Packing Method: TR

This product is packed in tape and reel (TR) format, facilitating automated pick-and-place assembly processes, reducing handling time, and minimizing the risk of damage.

Terminal Pitch: 1.27 mm

With a terminal pitch of 1.27 millimeters, this product enables dense configurations and precise connections in modern circuit designs.

Minimum fmax: 85 MHz

The minimum fmax of 85 megahertz ensures that this latch or flip-flop can reliably operate in high-frequency applications and maintain signal integrity.

Moisture Sensitivity Level (MSL): 1

This product has a moisture sensitivity level of 1, indicating that it can be subjected to multiple reflow and aging cycles, making it suitable for extended product lifetimes.

Maximum Supply Voltage (Vsup): 5.5 V

This product can handle a maximum supply voltage of 5.5V, providing a tolerance range and ensuring safe operation without risk of voltage damage.

Technical Specifications

Latches & Flip-Flops CD74ACT273M96G4 attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

ACT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

85000000 Hz

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay (tpd):

13.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

7.5 mm

Minimum fmax:

85 MHz

Trade Compliance

CD74ACT273M96G4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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