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CD74HCT273M

Texas Instruments

CD74HCT273M by Texas Instruments

CD74HCT273M by Texas Instruments is an 8-bit latch with a propagation delay of 45 ns at 5V. It operates on CMOS technology, has a max frequency of 16 MHz, and is suitable for military-grade applications requiring positive edge triggering. The package is small outline with surface mount capability, making it ideal for compact electronic designs.

Median Price

$1.092

Lifecycle Status

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40

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1k+

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DigiKey

USA . 54 parts In-Stock

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Mouser Electronics

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Rochester

USA . 17,923 parts In-Stock

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Verical

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Newark

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Nova Conductors

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TEDSS.com

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Component Electronics Inc.

Canada . 5 parts In-Stock

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DigiKey Marketplace

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PC Components Company LLC

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Semicontronic

India . 4,763 parts In-Stock

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$0.520

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$0.507

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$0.504

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Corphita

USA . 662 parts In-Stock

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$0.545

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Continental Prestige Electronics

USA . 6,504 parts In-Stock

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$0.578

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Argo Parts USA

USA . 3,384 parts In-Stock

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$0.590

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$0.572

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Bastille Electronics

Australia . 4,451 parts In-Stock

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$0.590

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$0.560

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$0.532

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$0.525

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Modulus Dynamics

Lithuania . 328 parts In-Stock

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$0.593

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Corohmni

South Africa . 19 parts In-Stock

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Parana Technologies

USA . 778 parts In-Stock

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DigiPath Technology Company

USA . 336 parts In-Stock

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$8.028

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$7.386

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ChromeModa Solutions

Germany . 3,641 parts In-Stock

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IDEA Electronic Components Group

UK . 1,807 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Perfect Parts

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Authorized Procurement Solutions

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Supply Digital

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Assy Fe

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Speed Components Ltd (Excess)

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Cyclops Electronics Ltd (Excess)

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Glotronic Ltd.

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Overview

Enhance your electronic projects with the high-quality CD74HCT273M latch & flip-flop by Texas Instruments. With a reputation for excellence in manufacturing, Texas Instruments delivers reliable components for a wide range of applications. This versatile product offers customers value and benefits such as fast propagation delay, true output polarity, and a wide operating temperature range. Upgrade your designs today with the CD74HCT273M and experience superior performance and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and protection for the latch or flip-flop, making it a reliable choice for various applications.

Propagation Delay At Nominal Supply: 45 ns

With a fast propagation delay, this product ensures efficient operation and timely signal processing.

Surface Mount: YES

The surface mount feature allows for easy and convenient installation, saving time and effort during assembly.

Package Shape: RECTANGULAR

The rectangular shape of the package provides a compact design, ideal for space-constrained environments.

No. of Bits: 8

With 8 bits, this latch or flip-flop can handle a wide range of data inputs, making it versatile for different applications.

Nominal Supply Voltage / Vsup (V): 5

The 5V nominal supply voltage ensures compatibility with standard power sources, making it easy to integrate into existing systems.

Load Capacitance (CL): 50 pF

The 50 pF load capacitance helps stabilize the output signal, improving the overall performance of the latch or flip-flop.

Power Supplies (V): 5

Operating at 5V, this product offers reliable and consistent power for consistent functionality.

No. of Terminals: 20

With 20 terminals, this latch or flip-flop provides ample connection points for various input and output signals.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space and allows for dense circuit layouts, ideal for compact designs.

Maximum I (ol): 4 Amp

With a maximum output current of 4A, this latch or flip-flop can handle high-power applications with ease.

Propagation Delay (tpd): 45 ns

The 45 ns propagation delay ensures fast signal processing, reducing latency in the system.

Maximum Operating Temperature: 125 °C

Operating at temperatures up to 125°C, this product is suitable for high-temperature environments.

Trigger Type: POSITIVE EDGE

The positive edge trigger type ensures precise and reliable signal detection, enhancing the overall performance of the latch or flip-flop.

Minimum Operating Temperature: -55 °C

With a minimum operating temperature of -55°C, this product can withstand cold and harsh environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides corrosion resistance and ensures reliable connections for long-term use.

Terminal Position: DUAL

Dual terminal positions offer flexibility in circuit layout and connections, accommodating various design requirements.

Technical Specifications

Latches & Flip-Flops CD74HCT273M attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

HCT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

16000000 Hz

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

.16 mA

Propagation Delay At Nominal Supply:

45 ns

Propagation Delay (tpd):

45 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

7.5 mm

Minimum fmax:

16 MHz

Trade Compliance

CD74HCT273M Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-453-4601, 5962014534601

NIIN

014534601

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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