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MM74HC273SJX

Onsemi

MM74HC273SJX by Onsemi

MM74HC273SJX by Onsemi is an 8-bit latch with a propagation delay of 34ns at 5V. It operates in the industrial temperature range (-40 to 85°C) and supports a max frequency of 21MHz. Ideal for applications requiring positive edge triggering and low power consumption.

Median Price

$0.632

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 58,256 parts In-Stock

1+ parts

-

100+ parts

$0.620

1k+ parts

$0.515

10k+ parts

$0.459

58,256

-

$0.620

$0.515

$0.459

Flip Electronics (Authorized)

USA . 32,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

32,000

-

-

-

-

DigiKey

USA . 22,341 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.810

10k+ parts

-

22,341

-

-

$0.810

-

Verical

USA . 20,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.643

10k+ parts

$0.574

20,000

-

-

$0.643

$0.574

Mouser Electronics

USA . 1,324 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.419

1,324

-

-

-

$0.419

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 366 parts In-Stock

1+ parts

$0.506

100+ parts

-

1k+ parts

-

10k+ parts

-

366

$0.506

-

-

-

Nova Conductors

Japan . 1,000 parts In-Stock

1+ parts

$0.552

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

$0.552

-

-

-

Flip Electronics

USA . 32,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

-

10k+ parts

-

32,000

-

-

-

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DigiKey Marketplace

USA . 32,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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32,000

-

-

-

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Vyrian

USA . 26,122 parts In-Stock

1+ parts

-

100+ parts

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26,122

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-

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Semi Source

USA . 4,000 parts In-Stock

1+ parts

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4,000

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R&J Components

USA . 2,000 parts In-Stock

1+ parts

-

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2,000

-

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 26,698 parts In-Stock

1+ parts

$0.356

100+ parts

-

1k+ parts

-

10k+ parts

-

26,698

$0.356

-

-

-

Semicontronic

India . 26,536 parts In-Stock

1+ parts

$0.356

100+ parts

$0.347

1k+ parts

$0.345

10k+ parts

-

26,536

$0.356

$0.347

$0.345

-

Corohmni

South Africa . 233 parts In-Stock

1+ parts

$0.419

100+ parts

-

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233

$0.419

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Corphita

USA . 2,679 parts In-Stock

1+ parts

$0.480

100+ parts

-

1k+ parts

-

10k+ parts

-

2,679

$0.480

-

-

-

Continental Prestige Electronics

USA . 1,388 parts In-Stock

1+ parts

$0.552

100+ parts

-

1k+ parts

-

10k+ parts

$0.541

1,388

$0.552

-

-

$0.541

Argo Parts USA

USA . 1,075 parts In-Stock

1+ parts

$0.552

100+ parts

-

1k+ parts

-

10k+ parts

$0.536

1,075

$0.552

-

-

$0.536

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$0.552

100+ parts

-

1k+ parts

$0.525

10k+ parts

$0.514

1,000

$0.552

-

$0.525

$0.514

A-Z Elektronik GmbH

Germany . 7,326 parts In-Stock

1+ parts

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100+ parts

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7,326

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SupplyDigital Components

Austria . 7,003 parts In-Stock

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7,003

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Perfect Parts

USA . 6,933 parts In-Stock

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6,933

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Problanco Electronics

Mexico . 6,589 parts In-Stock

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6,589

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Microchip USA

USA . 3,523 parts In-Stock

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3,523

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TANS Electronics

Latvia . 3,324 parts In-Stock

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3,324

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Supply Digital

USA . 1,568 parts In-Stock

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1,568

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Kulean Microsystems

USA . 501 parts In-Stock

1+ parts

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501

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UHIMA Technologies

Türkiye . 265 parts In-Stock

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265

-

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-

Overview

Upgrade your electronics with the MM74HC273SJX from Onsemi! As a leading manufacturer in the industry, Onsemi delivers top-notch quality and reliability. This latch & flip-flop device is perfect for a wide range of applications, offering fast propagation delay and low power consumption. With a compact design and easy surface mounting, this product provides excellent value and performance. Trust Onsemi to provide you with the best in electronic components for your projects.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - The use of plastic/epoxy material ensures durability and reliability of the product.

Propagation Delay At Nominal Supply:

34 ns - The fast propagation delay makes this latch/flip-flop suitable for high-speed applications.

Surface Mount:

YES - The surface mount feature allows for easy and convenient installation on PCBs.

Package Shape:

RECTANGULAR - The rectangular shape makes it easy to integrate into existing circuit designs.

No. of Bits:

8 - With 8 bits, this latch/flip-flop can handle a wide range of data processing tasks.

Nominal Supply Voltage / Vsup (V):

5 - The 5V supply voltage is common and readily available in most electronic systems.

Load Capacitance (CL):

50 pF - The low load capacitance ensures efficient operation and minimal power consumption.

Power Supplies (V):

2/6 - Support for both 2V and 6V power supplies offers flexibility in system design.

No. of Terminals:

20 - The 20 terminals provide ample connectivity options for various applications.

Package Style (Meter):

SMALL OUTLINE - The small outline package style saves space on the PCB.

Maximum I (ol):

4 Amp - The high output current capacity allows this latch/flip-flop to drive demanding loads.

Propagation Delay (tpd):

170 ns - The short propagation delay ensures quick response time in data transmission.

Maximum Operating Temperature:

85 °C - With a high operating temperature range, this latch/flip-flop is suitable for industrial environments.

Trigger Type:

POSITIVE EDGE - The positive edge trigger type enables precise control in data capturing.

Minimum Operating Temperature:

40 °C - The wide temperature range ensures reliable operation even in extreme conditions.

Terminal Finish:

TIN - The tin terminal finish provides corrosion resistance for long-term reliability.

Terminal Position:

DUAL - Dual terminal position offers flexibility in PCB layout and connectivity.

Maximum Seated Height:

2.1 mm - The low seated height saves space in compact designs.

Width:

5.3 mm - The small width allows for dense packing of components on the PCB.

Output Polarity:

TRUE - The true output polarity simplifies logic operations and signal processing.

Minimum Supply Voltage (Vsup):

2 V - The low minimum supply voltage allows for operation in low-power applications.

Maximum Time At Peak Reflow Temperature (s):

30 - With a short reflow time, the product can be quickly and efficiently soldered onto the PCB.

Peak Reflow Temperature °C:

260 - The high peak reflow temperature ensures secure and reliable solder joints.

Length:

12.6 mm - The compact length makes this latch/flip-flop suitable for space-constrained applications.

Temperature Grade:

INDUSTRIAL - The industrial temperature grade ensures reliable operation in harsh environments.

Maximum Frequency At Nominal Supply:

21000000 Hz - The high frequency capability makes this latch/flip-flop ideal for high-speed data processing.

Technology:

CMOS - The CMOS technology offers low power consumption and high noise immunity.

Terminal Form:

GULL WING - The gull wing terminal form provides mechanical strength and ease of soldering.

Packing Method:

TR - The TR packing method offers convenience and protection during shipping and storage.

Terminal Pitch:

1.27 mm - The small terminal pitch allows for high-density packaging on the PCB.

Minimum fmax:

24 MHz - The minimum fmax ensures reliable operation at high frequencies.

Maximum Supply Voltage (Vsup):

6 V - The high maximum supply voltage offers compatibility with a wide range of systems.

Maximum Power Supply Current (ICC):

0.16 mA - The low power supply current ensures energy-efficient operation.

Technical Specifications

Latches & Flip-Flops MM74HC273SJX attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3

Length:

12.6 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

21000000 Hz

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Maximum Power Supply Current (ICC):

.16 mA

Propagation Delay At Nominal Supply:

34 ns

Propagation Delay (tpd):

170 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.1 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

5.3 mm

Minimum fmax:

24 MHz

Trade Compliance

MM74HC273SJX Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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