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CD74HC75PWRG4

Texas Instruments

CD74HC75PWRG4 by Texas Instruments

CD74HC75PWRG4 by Texas Instruments is a dual-function latch with 24 ns propagation delay, suitable for military-grade applications. It operates at a supply voltage range of 2-6V and has a max power supply current of 0.08 mA. With surface mount capability and small outline package style, it is ideal for compact electronic designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,677 parts In-Stock

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Digiode

USA . 2,934 parts In-Stock

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Nova Conductors

Japan . 870 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 268 parts In-Stock

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$5.933

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268

$5.933

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Parana Technologies

USA . 758 parts In-Stock

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$29.946

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$65.080

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758

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DigiPath Technology Company

USA . 1,481 parts In-Stock

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$32.974

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ChromeModa Solutions

Germany . 3,213 parts In-Stock

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$33.647

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$27.591

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$33.647

$27.591

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IDEA Electronic Components Group

UK . 1,456 parts In-Stock

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$33.647

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$31.965

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$30.282

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$30.282

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Ampacity Inc.

Singapore . 286 parts In-Stock

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$46.000

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286

$46.000

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One Stop Electronics

USA . 799 parts In-Stock

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$51.000

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Continental Prestige Electronics

USA . 4,569 parts In-Stock

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Corphita

USA . 4,354 parts In-Stock

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Microchip USA

USA . 2,969 parts In-Stock

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Bastille Electronics

Australia . 1,000 parts In-Stock

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Argo Parts USA

USA . 294 parts In-Stock

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Overview

Unlock the potential of your electronics with the CD74HC75PWRG4 by Texas Instruments. Built with precision and quality, this latches & flip-flops category product offers unparalleled reliability and performance. Ideal for a wide range of applications, this innovative component provides customers with exceptional value, benefits, and advantages. Trust Texas Instruments to deliver cutting-edge technology that exceeds expectations. Elevate your projects with the CD74HC75PWRG4 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material for the package body ensuring longevity and reliability of the latch or flip-flop.

Propagation Delay At Nominal Supply: 24 ns

Fast propagation delay ensures quick response times for the latch or flip-flop, which is ideal for time-sensitive applications.

Surface Mount: YES

Provides easy installation and efficient use of PCB space.

No. of Functions: 2

Having multiple functions allows for versatile use and flexibility in circuit design.

Nominal Supply Voltage / Vsup (V): 4.5

Operates at a commonly used supply voltage, making it compatible with a wide range of systems.

Maximum Operating Temperature: 125 °C

High maximum operating temperature allows for reliable performance in various environments.

Minimum Operating Temperature: -55 °C

Wide temperature range ensures functionality in both extreme cold and hot conditions.

Technology: CMOS

CMOS technology offers low power consumption, making it energy-efficient and suitable for battery-operated devices.

Technical Specifications

Latches & Flip-Flops CD74HC75PWRG4 attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

5.2 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

2

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Maximum Power Supply Current (ICC):

.08 mA

Propagation Delay At Nominal Supply:

24 ns

Propagation Delay (tpd):

195 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

HIGH LEVEL

Width:

4.4 mm

Trade Compliance

CD74HC75PWRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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