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SN74LVC1G80DCKR

Texas Instruments

SN74LVC1G80DCKR by Texas Instruments

SN74LVC1G80DCKR by Texas Instruments is a latch with 12.5 ns propagation delay, 50 pF load capacitance, and 9.9 ns propagation delay. It operates at a supply voltage of 1.8V and has a max frequency of 160 MHz. Ideal for automotive applications due to its small size and low power consumption.

Median Price

$0.140

Lifecycle Status

Suppliers In-Stock

28

In-Stock Inventory

1k+

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Texas Instruments

USA . 195,974 parts In-Stock

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Chip1Stop

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Mouser Electronics

USA . 3,959 parts In-Stock

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Arrow

USA . 46 parts In-Stock

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Rochester

USA . 8,961 parts In-Stock

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DigiKey

USA . 8,961 parts In-Stock

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Verical

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Digiode

USA . 1,643 parts In-Stock

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DF Sales Co.

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Nova Conductors

Japan . 100 parts In-Stock

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TME

Poland . 450 parts In-Stock

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Chip Stock

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DigiKey Marketplace

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Vyrian

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Bristol Electronics

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PC Components Company LLC

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Semi Source

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

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ComSIT Distribution GmbH

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ACDS - Activité Composants Distribution Service

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Atlantic Semiconductor

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First Choice Components Inc.

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Prism Electronics

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Mil-Aero Solutions, Inc.

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Sensible Micro Corp

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Ampacity Inc.

Singapore . 61,527 parts In-Stock

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Semicontronic

India . 60,855 parts In-Stock

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Corphita

USA . 698 parts In-Stock

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Component Stockers USA

USA . 180,073 parts In-Stock

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Continental Prestige Electronics

USA . 6,190 parts In-Stock

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Argo Parts USA

USA . 3,924 parts In-Stock

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Netroflash

USA . 2,000 parts In-Stock

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Microchip USA

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Corohmni

South Africa . 49 parts In-Stock

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Parana Technologies

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DigiPath Technology Company

USA . 578 parts In-Stock

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ChromeModa Solutions

Germany . 1,022 parts In-Stock

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IDEA Electronic Components Group

UK . 897 parts In-Stock

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Kepictronics

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Authorized Procurement Solutions

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Lixinc

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Cyclops Electronics Ltd (Excess)

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GreenTree Electronics

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Overview

Unlock the potential of your electronic projects with the SN74LVC1G80DCKR by Texas Instruments. Known for their top-notch quality and reliability, Texas Instruments manufactures this latches & flip-flops category product with precision and expertise. Whether you are a seasoned professional or a DIY enthusiast, this versatile component offers unmatched performance, efficiency, and ease of use. From automotive applications to consumer electronics, the SN74LVC1G80DCKR is the perfect choice for any project requiring fast propagation delay, low power consumption, and 3-state output characteristics. Elevate your creations with Texas Instruments today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and resistance to damage, making this product suitable for long-term use.

Propagation Delay At Nominal Supply: 12.5 ns

Fast propagation delay ensures quick response time, making this product ideal for high-speed applications.

Surface Mount: YES

Surface mount capability allows for easy installation on circuit boards, saving space and simplifying assembly.

Nominal Supply Voltage / Vsup (V): 1.8

Low supply voltage requirement helps in reducing power consumption, making this product energy-efficient.

Output Characteristics: 3-STATE

3-STATE output allows for tristate operation, providing flexibility in controlling the output signal.

Minimum Operating Temperature: -40 °C

Wide operating temperature range ensures product reliability in various environmental conditions, including extreme cold temperatures.

Maximum Frequency At Nominal Supply: 160000000 Hz

High maximum frequency capability allows for efficient processing of signals, making this product suitable for high-frequency applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the overall performance of this product.

Terminal Form: GULL WING

Gull wing terminal form provides reliable solder joints, ensuring secure connections on PCBs.

Technical Specifications

Latches & Flip-Flops SN74LVC1G80DCKR attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

160000000 Hz

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

12.5 ns

Propagation Delay (tpd):

9.9 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

1.25 mm

Minimum fmax:

160 MHz

Trade Compliance

SN74LVC1G80DCKR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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