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SN74HC273NSRG4

Texas Instruments

SN74HC273NSRG4 by Texas Instruments

SN74HC273NSRG4 by Texas Instruments is an 8-bit latch with a supply voltage of 5V, operating temperature range of -40 to 85°C, and propagation delay of 200ns. It is used in industrial applications requiring positive edge triggering, with a max frequency of 21MHz and Gull Wing terminal form for surface mounting.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 41,800 parts In-Stock

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Vyrian

USA . 5,249 parts In-Stock

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Digiode

USA . 2,984 parts In-Stock

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Nova Conductors

Japan . 150 parts In-Stock

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150

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Semicontronic

India . 274 parts In-Stock

1+ parts

$9.000

100+ parts

$8.775

1k+ parts

$8.730

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274

$9.000

$8.775

$8.730

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Advanced Electronics

New Zealand . 29 parts In-Stock

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$14.420

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$13.699

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$13.699

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29

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$13.699

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AZTECH Wire

Italy . 295 parts In-Stock

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$15.307

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$15.307

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Corohmni

South Africa . 2 parts In-Stock

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$16.107

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Parana Technologies

USA . 740 parts In-Stock

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$25.468

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$26.097

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$25.468

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DigiPath Technology Company

USA . 209 parts In-Stock

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$28.044

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$25.800

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209

$28.044

$25.800

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ChromeModa Solutions

Germany . 3,604 parts In-Stock

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$28.616

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$23.465

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IDEA Electronic Components Group

UK . 461 parts In-Stock

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$28.616

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$27.185

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$25.754

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461

$28.616

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Ampacity Inc.

Singapore . 1,122 parts In-Stock

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$44.000

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One Stop Electronics

USA . 465 parts In-Stock

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Corphita

USA . 2,522 parts In-Stock

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Continental Prestige Electronics

USA . 1,763 parts In-Stock

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Argo Parts USA

USA . 784 parts In-Stock

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iodParts Technologies Inc.

India . 529 parts In-Stock

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529

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Bastille Electronics

Australia . 10 parts In-Stock

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Overview

Unlock the potential of your electronic projects with the SN74HC273NSRG4 by Texas Instruments. Manufactured with top-notch quality and expertise, this latch & flip-flop device offers reliable performance and versatility in various applications. From industrial automation to consumer electronics, this product provides exceptional value with its high-speed operation, low power consumption, and easy integration. Trust Texas Instruments to deliver innovative solutions that exceed expectations. Choose the SN74HC273NSRG4 for superior results every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors, making this latch reliable for long-term use.

Surface Mount: YES

Surface mount capability allows for easy and secure installation on a PCB, saving space and simplifying the assembly process.

No. of Bits: 8

With 8 bits, this latch can handle a wide range of data inputs, making it versatile for various applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage, this latch is compatible with many existing electronics systems.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliability in harsh environments or when exposed to heat-generating components nearby.

Propagation Delay (tpd): 200 ns

The low propagation delay ensures fast response times, making this latch suitable for time-sensitive applications.

Maximum Frequency At Nominal Supply: 21000000 Hz

With a high maximum frequency, this latch can handle rapid data inputs and outputs, making it ideal for high-speed applications.

Technical Specifications

Latches & Flip-Flops SN74HC273NSRG4 attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Additional Features:

DUMMY VAL

Family:

HC/UH

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.6 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

21000000 Hz

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay (tpd):

200 ns

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

5.3 mm

Minimum fmax:

25 MHz

Trade Compliance

SN74HC273NSRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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