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74LVC1G175GW

Philips Semiconductors

74LVC1G175GW by Philips Semiconductors

D FLIP-FLOP; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: TSSOP; Package Shape: RECTANGULAR;

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6

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1k+

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Chip Stock

USA . 171,800 parts In-Stock

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Vyrian

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ComSIT Distribution GmbH

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Digiode

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Anansix

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ACDS - Activité Composants Distribution Service

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Northwest PG Solutions

USA . 542 parts In-Stock

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$0.141

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$0.125

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AZTECH Wire

Italy . 6,273 parts In-Stock

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One Stop Electronics

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Microchip USA

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Futuretech Components

Singapore . 37,701 parts In-Stock

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Corphita

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A-Z Elektronik GmbH

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Glotronic Ltd.

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Supply Digital

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Native Components

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Cyclops Electronics Ltd (Excess)

UK . 24 parts In-Stock

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Technical Specifications

Latches & Flip-Flops 74LVC1G175GW attributes and parameters. Explore more Latches & Flip-Flops devices from Philips Semiconductors

Specs

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

175000000 Hz

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

7.5 ns

Qualification:

Not Qualified

Sub-Category:

FF/Latches

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Trade Compliance

74LVC1G175GW Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Philips Semiconductors

In September 2006, Philips completed the sale of an 80.1% stake in Philips Semiconductors to a consortium of private equity investors consisting of KKR, Bain Capital, Silver Lake Partners, Apax Partners and AlpInvest Partners. The new company name NXP (from Next eXPerience) was announced on August 31, 2006, and the company was officially launched during the Internationale Funkausstellung (IFA) consumer electronics show in Berlin. The newly independent NXP was ranked as one of the world's top 10 semiconductor companies

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