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74LVC2G74DP,125

NXP Semiconductors

74LVC2G74DP,125 by NXP Semiconductors

74LVC2G74DP,125 by NXP Semiconductors is a CMOS latch with a propagation delay of 5.9 ns and a max frequency of 175 MHz. It is commonly used in automotive applications due to its small size (3mm width) and low power consumption (1.8V nominal voltage).

Median Price

$0.153

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986

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Rochester

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$0.336

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Verical

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Nova Conductors

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NAC Semi

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Semicontronic

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Ampacity Inc.

Singapore . 27,631 parts In-Stock

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Corphita

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AZTECH Wire

Italy . 5,241 parts In-Stock

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Continental Prestige Electronics

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Argo Parts USA

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Netroflash

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Eastek

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Glotronic Ltd.

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Lucentia Tech

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Overview

Discover the power of innovation with the 74LVC2G74DP,125 by NXP Semiconductors. As a leader in the industry, NXP Semiconductors delivers unmatched quality and reliability. This versatile latch and flip-flop device offers endless possibilities for your applications. With its compact design and advanced technology, it provides lightning-fast performance, ensuring seamless operation. Whether you're working in automotive, industrial, or consumer electronics, this product is the perfect choice. Experience the value and benefits it brings to your projects and stay ahead of the competition. Trust NXP Semiconductors for cutting-edge solutions that drive success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This product is made from durable plastic/epoxy material, ensuring long-lasting performance and solid construction.

Propagation Delay At Nominal Supply: 5.9 ns

With a low propagation delay of 5.9 ns, this latch/flip-flop offers rapid response times, enhancing overall system efficiency.

Surface Mount: YES

The surface mount capability of this product allows for easy installation and reduces space requirements, making it suitable for compact designs.

No. of Functions: 1

Featuring a single function, this latch/flip-flop simplifies circuit designs and eliminates the need for additional components, saving on costs and complexity.

Package Shape: SQUARE

The square package shape enhances space utilization and facilitates optimal integration within electronic systems.

No. of Bits: 1

Designed with a single bit configuration, this latch/flip-flop is ideal for applications requiring simple data storage or synchronization.

Nominal Supply Voltage / Vsup (V): 1.8

Operating at a nominal supply voltage of 1.8V, this latch/flip-flop offers efficient power consumption, minimizing energy usage.

Power Supplies (V): 3.3

Compatible with a wide range of power supplies with a voltage of 3.3V, this product provides flexibility in system integration.

No. of Terminals: 8

With 8 terminals, this latch/flip-flop offers various connection options, enabling versatile usage in different circuit layouts.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style ensures efficient board footprint utilization while enabling space-saving designs.

Maximum I (ol): 24 Amp

With a maximum output current of 24 Amps, this latch/flip-flop can handle high-power applications reliably and safely.

Propagation Delay (tpd): 13.4 ns

The propagation delay of 13.4 ns ensures quick response and accurate timing within the latch/flip-flop circuit, enhancing overall system performance.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this product can withstand harsh environmental conditions, making it suitable for demanding applications.

Trigger Type: POSITIVE EDGE

The positive edge trigger type provides precise control and timing synchronization, ensuring accurate data capture within the latch/flip-flop.

Minimum Operating Temperature: -40 °C

Operating smoothly even at low temperatures down to -40°C, this latch/flip-flop is designed for reliable performance in extreme environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The terminal finish of nickel/palladium/gold provides excellent corrosion resistance and optimum electrical conductivity, ensuring long-term reliability.

Terminal Position: DUAL

Featuring dual terminal positions, this latch/flip-flop allows for flexible PCB layout options, accommodating various circuit board designs.

Maximum Seated Height: 1.1 mm

With a maximum seated height of 1.1 mm, this product offers a compact profile for applications with limited vertical clearance.

Width: 3 mm

With a width of 3 mm, this latch/flip-flop can be easily integrated into space-constrained designs while maintaining functionality.

Output Polarity: COMPLEMENTARY

The complementary output polarity of this latch/flip-flop enables versatile signal manipulation, offering greater flexibility in circuit design.

Minimum Supply Voltage (Vsup): 1.65 V

With a low minimum supply voltage of 1.65V, this product is compatible with low-power applications, promoting energy efficiency.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time allowed at peak reflow temperature of 30 seconds ensures proper soldering and reliability during assembly processes.

Peak Reflow Temperature °C: 260

Designed to withstand peak reflow temperatures of up to 260°C, this latch/flip-flop can endure high-temperature manufacturing processes without sacrificing performance.

Length: 3 mm

Measuring at a length of 3 mm, this compact latch/flip-flop can be easily integrated into space-constrained designs while maintaining functionality.

Temperature Grade: AUTOMOTIVE

This latch/flip-flop is suitable for automotive applications, meeting industry standards for reliable operation in automotive environments.

Maximum Frequency At Nominal Supply: 175000000 Hz

Operating at a maximum frequency of 175,000,000 Hz, this latch/flip-flop provides high-speed data processing capabilities for demanding applications.

Technology: CMOS

Built with CMOS technology, this latch/flip-flop offers low power consumption, high noise immunity, and reliable performance in various electronic systems.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and secure electrical connections, ensuring robust interconnections within the circuit.

Packing Method: TR

Packaged in tape and reel (TR) format, this latch/flip-flop simplifies automated assembly processes and ensures convenient handling and storage.

Terminal Pitch: 0.65 mm

With a terminal pitch of 0.65 mm, this latch/flip-flop provides precise and secure connections within compact PCB layouts.

Minimum fmax: 200 MHz

With a minimum fmax of 200 MHz, this latch/flip-flop supports high-frequency applications, enabling efficient data processing and transmission.

Moisture Sensitivity Level (MSL): 1

Rated with a moisture sensitivity level of 1, this product exhibits excellent resistance to moisture absorption that ensures long-term reliability, especially during storage and reflow processes.

Maximum Supply Voltage (Vsup): 5.5 V

Operating within a maximum supply voltage of 5.5V, this latch/flip-flop can handle various power supply conditions, providing flexibility and versatility in system integration.

Technical Specifications

Latches & Flip-Flops 74LVC2G74DP,125 attributes and parameters. Explore more Latches & Flip-Flops devices from NXP Semiconductors

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Length:

3 mm

Logic IC Type:

Maximum Frequency At Nominal Supply:

175000000 Hz

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.16

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

5.9 ns

Propagation Delay (tpd):

13.4 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

3 mm

Minimum fmax:

200 MHz

Trade Compliance

74LVC2G74DP,125 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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