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CD4044BPWG4

Texas Instruments

CD4044BPWG4 by Texas Instruments

CD4044BPWG4 by Texas Instruments is a 4-bit latch with 300 ns propagation delay at 5V. It has a small outline package and operates in temperatures ranging from -55 to 125°C. Ideal for military-grade applications requiring low-level trigger type and true output polarity.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,721 parts In-Stock

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Digiode

USA . 873 parts In-Stock

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873

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Nova Conductors

Japan . 74 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 425 parts In-Stock

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$18.372

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425

$18.372

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Ampacity Inc.

Singapore . 377 parts In-Stock

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$19.000

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377

$19.000

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Parana Technologies

USA . 840 parts In-Stock

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$21.939

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$22.451

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840

$21.939

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$22.451

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DigiPath Technology Company

USA . 289 parts In-Stock

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$24.158

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$22.225

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289

$24.158

$22.225

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Corohmni

South Africa . 909 parts In-Stock

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$24.437

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909

$24.437

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ChromeModa Solutions

Germany . 3,375 parts In-Stock

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$24.651

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$20.214

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$24.651

$20.214

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IDEA Electronic Components Group

UK . 195 parts In-Stock

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$24.651

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$23.418

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$22.186

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195

$24.651

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$22.186

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One Stop Electronics

USA . 1,262 parts In-Stock

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$48.000

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Continental Prestige Electronics

USA . 4,340 parts In-Stock

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Argo Parts USA

USA . 3,742 parts In-Stock

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Corphita

USA . 1,165 parts In-Stock

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Microchip USA

USA . 458 parts In-Stock

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Bastille Electronics

Australia . 200 parts In-Stock

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Overview

Unlock the power of seamless data transfer and control with the CD4044BPWG4 by Texas Instruments. Crafted with precision and expertise, this innovative latch & flip-flop device offers unparalleled reliability and performance. Ideal for applications requiring high-speed signal processing, this product guarantees smooth operation and efficient functionality. Elevate your projects with the unmatched quality and value that only Texas Instruments can provide. Trust in the CD4044BPWG4 to deliver exceptional results every time.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - Provides durability and reliability for long-term use.

Propagation Delay At Nominal Supply:

300 ns - Ensures fast response time for efficient operation.

Surface Mount:

YES - Allows for easy installation on circuit boards.

Package Shape:

RECTANGULAR - Fits well in standard electronic designs.

No. of Bits:

4 - Ideal for applications requiring multiple bits of data storage.

Nominal Supply Voltage / Vsup (V):

5 - Compatible with common power sources for ease of use.

Load Capacitance (CL):

50 pF - Helps in managing and stabilizing the load on the device.

Power Supplies (V):

5/15 - Offers flexibility in power options for diverse applications.

No. of Terminals:

16 - Provides ample connectivity for various input/output requirements.

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH - Saves space in compact electronic systems.

Propagation Delay (tpd):

300 ns - Ensures consistent timing for data processing.

Maximum Operating Temperature:

125 °C - Suitable for operation in high-temperature environments.

Output Characteristics:

3-STATE - Allows for multiple output options for versatile functionality.

Trigger Type:

LOW LEVEL - Provides reliable triggering for precise control.

Minimum Operating Temperature:

55 °C - Can withstand low-temperature conditions.

Terminal Position:

DUAL - Enables flexible terminal connections for different setups.

Terminal Form:

GULL WING - Facilitates easy soldering and strong terminal connections.

Temperature Grade:

MILITARY - Meets stringent military-grade standards for reliability.

Technology:

CMOS - Utilizes efficient CMOS technology for low power consumption.

Packing Method:

TUBE - Convenient packaging for easy storage and organization.

Terminal Pitch:

0.65 mm - Enables precise terminal spacing for secure connections.

Maximum Supply Voltage (Vsup):

18 V - Supports higher voltage applications for versatility.

Technical Specifications

Latches & Flip-Flops CD4044BPWG4 attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G16

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

300 ns

Propagation Delay (tpd):

300 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

LOW LEVEL

Width:

4.4 mm

Trade Compliance

CD4044BPWG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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