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MC100EP131FAR2

Onsemi

MC100EP131FAR2 by Onsemi

MC100EP131FAR2 by Onsemi is a 4-bit latch with 0.6 ns propagation delay, operating at -40 to 85 °C. It has a supply voltage of 3.3V, peak reflow temp of 235C, and max frequency of 3GHz. Ideal for industrial applications requiring fast positive edge triggering in a compact flatpack design.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,722 parts In-Stock

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4,722

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Digiode

USA . 2,030 parts In-Stock

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2,030

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Nova Conductors

Japan . 69 parts In-Stock

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69

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Distributors (Availability)

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AZTECH Wire

Italy . 616 parts In-Stock

1+ parts

$18.742

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616

$18.742

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Ampacity Inc.

Singapore . 434 parts In-Stock

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$58.000

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434

$58.000

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Problanco Electronics

Mexico . 5,231 parts In-Stock

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Argo Parts USA

USA . 4,842 parts In-Stock

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SupplyDigital Components

Austria . 4,630 parts In-Stock

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4,630

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Corphita

USA . 2,362 parts In-Stock

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2,362

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TANS Electronics

Latvia . 2,347 parts In-Stock

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2,347

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Continental Prestige Electronics

USA . 1,029 parts In-Stock

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1,029

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UHIMA Technologies

Türkiye . 697 parts In-Stock

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Kulean Microsystems

USA . 489 parts In-Stock

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489

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Microchip USA

USA . 232 parts In-Stock

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232

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Corohmni

South Africa . 123 parts In-Stock

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123

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Bastille Electronics

Australia . 100 parts In-Stock

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100

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Overview

Unleash the power of precision and reliability with the MC100EP131FAR2 by Onsemi. Crafted with expertise, this latches & flip-flops device offers seamless performance in a variety of applications. With a focus on quality and innovation, Onsemi ensures that every product meets the highest standards. Experience the value and benefits of this versatile component, providing customers with unmatched advantages and efficiency. Elevate your projects with the MC100EP131FAR2 and discover a new level of excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability in various operating conditions.

Surface Mount: YES

Being surface mount allows for easy installation and space-saving on the PCB.

Package Shape: SQUARE

The square shape of the package provides stability and uniformity in design layout.

No. of Bits: 4

With 4 bits, this latch & flip-flop offers efficient memory storage capabilities for data processing.

Nominal Supply Voltage / Vsup (V): 3.3

The nominal supply voltage of 3.3V provides optimal power efficiency for the device.

Power Supplies (V): -4.5

With a range of power supplies from -4.5V to 5.5V, this product can accommodate various power sources.

No. of Terminals: 32

The 32 terminals offer versatile connectivity options for interfacing with other components.

Package Style (Meter): FLATPACK, LOW PROFILE

The flatpack low profile package style ensures space-saving and efficient heat dissipation.

Propagation Delay (tpd): 0.6 ns

The low propagation delay of 0.6 ns allows for high-speed data processing and transfer.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this device can perform reliably in harsh environments.

Trigger Type: POSITIVE EDGE

Positive edge triggering provides precise control and timing for latch & flip-flop operations.

Minimum Operating Temperature: -40 °C

The minimum operating temperature of -40°C ensures functionality even in extreme cold conditions.

Terminal Finish: TIN LEAD

The tin lead terminal finish offers excellent solderability and corrosion resistance for long-term use.

Terminal Position: QUAD

The quad terminal position allows for easy alignment and connection on the PCB.

Maximum Seated Height: 1.6 mm

The low maximum seated height of 1.6 mm enables compact design and placement in tight spaces.

Width: 7 mm

The 7 mm width provides a slim profile for efficient PCB layout and space utilization.

Output Polarity: COMPLEMENTARY

Complementary output polarity ensures accurate and reliable logic levels for signal processing.

Minimum Supply Voltage (Vsup): 3 V

The minimum supply voltage of 3V ensures reliable operation even at low power levels.

Peak Reflow Temperature °C: 235

The peak reflow temperature of 235°C allows for safe and effective soldering during assembly.

Length: 7 mm

The 7 mm length contributes to the compact and space-saving design of the latch & flip-flop.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable performance in demanding industrial environments.

Maximum Frequency At Nominal Supply: 3000000000 Hz

With a maximum frequency of 3 GHz at nominal supply, this device is suitable for high-speed applications.

Technology: ECL

Emitter-Coupled Logic (ECL) technology offers high-speed operation and low power consumption for efficient data processing.

Terminal Form: GULL WING

The gull wing terminal form provides secure and reliable connections for stable data transmission.

Packing Method: TR

The TR packing method ensures safe transportation and storage of the latch & flip-flop.

Terminal Pitch: 0.8 mm

The 0.8 mm terminal pitch allows for easy mounting and connection on the PCB.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum supply voltage of 5.5V ensures compatibility with a wide range of power sources.

Maximum Power Supply Current (ICC): 130 mA

With a maximum power supply current of 130 mA, this device offers efficient power management and consumption.

Technical Specifications

Latches & Flip-Flops MC100EP131FAR2 attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -3V TO -5.5V

Family:

100E

JESD-30 Code:

S-PQFP-G32

JESD-609 Code:

e0

Length:

7 mm

Logic IC Type:

Maximum Frequency At Nominal Supply:

3000000000 Hz

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

235

Power Supplies (V):

-4.5

Maximum Power Supply Current (ICC):

130 mA

Propagation Delay (tpd):

.6 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Trigger Type:

POSITIVE EDGE

Width:

7 mm

Trade Compliance

MC100EP131FAR2 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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