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SN74LVC1G79DCKR

Texas Instruments

SN74LVC1G79DCKR by Texas Instruments

SN74LVC1G79DCKR by Texas Instruments is a latch with 5ns propagation delay, operating at 1.8V to 3.3V. It features a small outline package and can handle up to 32A output current. Ideal for automotive applications due to its wide temperature range and high frequency capability of up to 160MHz.

Median Price

$0.122

Lifecycle Status

Suppliers In-Stock

31

In-Stock Inventory

1k+

Distributors (Authorized)

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Newark

USA . 180 parts In-Stock

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Texas Instruments

USA . 206,118 parts In-Stock

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Arrow

USA . 2,894 parts In-Stock

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DigiKey

USA . 10,687 parts In-Stock

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Mouser Electronics

USA . 9,585 parts In-Stock

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Verical

USA . 2,894 parts In-Stock

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Farnell

UK . 1,328 parts In-Stock

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Rochester

USA . 408 parts In-Stock

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Element14

Singapore . 23 parts In-Stock

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Chip1Stop

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Digiode

USA . 1,339 parts In-Stock

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Ozdisan Elektronik

Türkiye . 2,990 parts In-Stock

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Nova Conductors

Japan . 200 parts In-Stock

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Cyclops Electronics Ltd

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Chip Stock

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Vyrian

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Bristol Electronics

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NAC Semi

USA . 2,380 parts In-Stock

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Prism Electronics

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ComSIT Distribution GmbH

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A2Z Electronics, Inc.

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PC Components Company LLC

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First Choice Components Inc.

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Resion

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Semtec, LLC

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Semicontronic

India . 23,054 parts In-Stock

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Ampacity Inc.

Singapore . 23,637 parts In-Stock

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Component Stockers USA

USA . 33,694 parts In-Stock

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Corphita

USA . 3,055 parts In-Stock

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CoreStaff

Japan . 9 parts In-Stock

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Aranea Global

USA . 500 parts In-Stock

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Argo Parts USA

USA . 1,595 parts In-Stock

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Advanced Electronics

New Zealand . 50 parts In-Stock

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Continental Prestige Electronics

USA . 2,838 parts In-Stock

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$0.097

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$0.062

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$0.041

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$0.041

Parana Technologies

USA . 294 parts In-Stock

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$18.951

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$19.017

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Corohmni

South Africa . 308 parts In-Stock

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DigiPath Technology Company

USA . 2,073 parts In-Stock

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ChromeModa Solutions

Germany . 4,281 parts In-Stock

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IDEA Electronic Components Group

UK . 1,122 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 15,247 parts In-Stock

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GreenTree Electronics

Israel . 15,173 parts In-Stock

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Lixinc

USA . 12,989 parts In-Stock

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Kepictronics

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Overview

Unlock endless possibilities with the SN74LVC1G79DCKR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality latches & flip-flops that provide reliable performance in a variety of applications. With a nominal supply voltage of 1.8V and a propagation delay of just 5ns, this product offers superior speed and efficiency. Experience the value of seamless operation, precise output characteristics, and a wide temperature range. Elevate your designs with the SN74LVC1G79DCKR and discover a world of innovation at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable and long-lasting applications.

Propagation Delay At Nominal Supply: 5 ns

The low propagation delay ensures fast response times, making the product suitable for high-speed operations.

Surface Mount: YES

Being surface mountable saves space and simplifies the installation process, making it convenient for compact device designs.

Package Shape: RECTANGULAR

The rectangular shape allows for easy placement and integration into circuit boards, enhancing overall design flexibility.

Nominal Supply Voltage / Vsup (V): 1.8

The low nominal supply voltage minimizes power consumption and is compatible with various low-power applications.

Load Capacitance (CL): 50 pF

The specified load capacitance ensures stable and reliable performance, especially in applications with external capacitive loads.

Power Supplies (V): 3.3

The product is designed to operate efficiently with a nominal power supply voltage of 3.3V, suitable for a wide range of electronic devices.

No. of Terminals: 5

Having a sufficient number of terminals allows for diverse connection options and compatibility with various circuit configurations.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The compact and slim package style saves space on the PCB, making it an excellent choice for densely populated electronic assemblies.

Maximum I (ol): 32 Amp

With a high maximum output current, the product can drive heavy loads or multiple components simultaneously without compromising performance.

Propagation Delay (tpd): 20.5 ns

The moderate propagation delay strikes a balance between speed and stability, suitable for a wide range of timing-critical applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliable performance in harsh thermal environments, making the product suitable for industrial and automotive applications.

Output Characteristics: 3-STATE

The 3-STATE output feature allows the product to enter a high-impedance state, improving signal integrity and facilitating bus sharing applications.

Trigger Type: POSITIVE EDGE

The positive edge trigger type ensures precise timing control and reliable operation, making it suitable for synchronous applications and data processing.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the product to withstand extreme cold conditions, making it suitable for outdoor and automotive applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The use of nickel, palladium, and gold terminal finish ensures excellent conductivity, corrosion resistance, and solderability, enhancing the product's reliability and longevity.

Terminal Position: DUAL

The dual terminal position provides flexibility in PCB layout and connection orientation, making it easier to integrate the product into existing designs.

Maximum Seated Height: 1.1 mm

The low maximum seated height minimizes the overall profile of the product, making it suitable for slim and compact device designs.

Width: 1.25 mm

The narrow width of the product allows for efficient space utilization on the PCB, especially in applications where board space is limited.

Output Polarity: TRUE

The true output polarity ensures accurate signal representation, eliminating the need for additional inversion circuitry and simplifying design complexity.

Minimum Supply Voltage (Vsup): 1.65 V

The low minimum supply voltage enables the product to operate efficiently in low-power conditions, extending battery life and enhancing energy efficiency.

Peak Reflow Temperature °C: 260

The high peak reflow temperature allows for reliable soldering during manufacturing processes, ensuring robust and durable connections for long-term performance.

Length: 2 mm

The compact length of the product minimizes the footprint on the PCB, allowing for efficient use of board space in space-constrained applications.

Temperature Grade: AUTOMOTIVE

The automotive-grade temperature range ensures reliable operation in extreme environmental conditions, making the product suitable for automotive electronics and rugged applications.

Maximum Frequency At Nominal Supply: 160000000 Hz

The high maximum frequency capability allows for fast data processing and signal transmission, making the product suitable for high-speed digital applications.

Technology: CMOS

The CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, making the product energy-efficient and reliable for various applications.

Terminal Form: GULL WING

The gull-wing terminal form simplifies soldering and inspection processes, ensuring reliable connections and efficient manufacturing of electronic assemblies.

Packing Method: TR

The TR packing method provides convenient handling and storage of the product, ensuring protection during transportation and easy identification in bulk quantities.

Terminal Pitch: 0.65 mm

The small terminal pitch allows for high-density mounting, enabling compact and space-efficient designs for modern electronic devices.

Minimum fmax: 160 MHz

The high minimum fmax value indicates the product's capability to operate at high clock frequencies, making it suitable for advanced digital applications and data processing.

Maximum Supply Voltage (Vsup): 5.5 V

The high maximum supply voltage ensures compatibility with a wide range of power sources and voltage levels, increasing the product's versatility in different applications.

Maximum Power Supply Current (ICC): 0.01 mA

The low maximum power supply current consumption reduces energy consumption and heat dissipation, making the product ideal for low-power and battery-operated devices.

Technical Specifications

Latches & Flip-Flops SN74LVC1G79DCKR attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

160000000 Hz

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

5 ns

Propagation Delay (tpd):

20.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

1.25 mm

Minimum fmax:

160 MHz

Trade Compliance

SN74LVC1G79DCKR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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