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SN74AHC273PWRE4

Texas Instruments

SN74AHC273PWRE4 by Texas Instruments

SN74AHC273PWRE4 by Texas Instruments is an 8-bit latch with a propagation delay of 12.5 ns at 3.3V, suitable for industrial applications. It operates b/w -40 to 85°C, has a max frequency of 70 MHz, and supports surface mount installation with a small outline package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,896 parts In-Stock

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7,896

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Digiode

USA . 3,863 parts In-Stock

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3,863

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Nova Conductors

Japan . 700 parts In-Stock

1+ parts

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700

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,162 parts In-Stock

1+ parts

$9.284

100+ parts

-

1k+ parts

$9.913

10k+ parts

-

2,162

$9.284

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$9.913

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ChromeModa Solutions

Germany . 3,352 parts In-Stock

1+ parts

$10.431

100+ parts

$8.553

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-

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3,352

$10.431

$8.553

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IDEA Electronic Components Group

UK . 2,252 parts In-Stock

1+ parts

$10.431

100+ parts

$9.909

1k+ parts

$9.388

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-

2,252

$10.431

$9.909

$9.388

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Semicontronic

India . 1,524 parts In-Stock

1+ parts

$14.000

100+ parts

$13.650

1k+ parts

$13.580

10k+ parts

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1,524

$14.000

$13.650

$13.580

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AZTECH Wire

Italy . 800 parts In-Stock

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$16.845

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800

$16.845

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Corohmni

South Africa . 19 parts In-Stock

1+ parts

$17.307

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19

$17.307

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Ampacity Inc.

Singapore . 592 parts In-Stock

1+ parts

$43.000

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592

$43.000

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One Stop Electronics

USA . 700 parts In-Stock

1+ parts

$50.000

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700

$50.000

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Corphita

USA . 3,199 parts In-Stock

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Continental Prestige Electronics

USA . 3,180 parts In-Stock

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Argo Parts USA

USA . 1,843 parts In-Stock

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1,843

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DigiPath Technology Company

USA . 524 parts In-Stock

1+ parts

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100+ parts

$9.405

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524

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$9.405

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Bastille Electronics

Australia . 300 parts In-Stock

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300

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Overview

Discover the cutting-edge SN74AHC273PWRE4 by Texas Instruments, a top-of-the-line latch and flip-flop component that sets the industry standard for quality and reliability. With Texas Instruments' renowned reputation for excellence in manufacturing, this versatile product is ideal for a wide range of applications. Whether you're designing consumer electronics, industrial machinery, or automotive systems, this advanced component offers unparalleled value, efficiency, and performance. Upgrade your project with the SN74AHC273PWRE4 and experience the difference that Texas Instruments brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good durability and protection for the internal components of the latch/flip-flop.

Propagation Delay At Nominal Supply: 12.5 ns

Low propagation delay allows for fast signal processing, making this latch/flip-flop suitable for high-speed applications.

Surface Mount: YES

Surface mount capability makes it easy to integrate this latch/flip-flop onto PCBs, saving space and simplifying assembly.

No. of Bits: 8

This latch/flip-flop can handle up to 8 bits of data, making it suitable for applications that require processing multiple bits simultaneously.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a common supply voltage of 3.3V, ensuring compatibility with a wide range of systems.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures, making it suitable for industrial applications where heat may be a factor.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this latch/flip-flop efficient and reliable.

Technical Specifications

Latches & Flip-Flops SN74AHC273PWRE4 attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

AHC/VHC/H/U/V

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

70000000 Hz

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

12.5 ns

Propagation Delay (tpd):

19.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

4.4 mm

Minimum fmax:

100 MHz

Trade Compliance

SN74AHC273PWRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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