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SN74LVC1G74RSE2

Texas Instruments

SN74LVC1G74RSE2 by Texas Instruments

SN74LVC1G74RSE2 by Texas Instruments is a CMOS latch with 5.9 ns propagation delay, suitable for automotive applications. It operates at 1.8V nominal voltage and has a max frequency of 200 MHz, making it ideal for high-speed circuit designs in compact spaces. With a low power supply current of 0.01 mA, this chip carrier is designed for surface mount assembly in tight layouts.

Median Price

$0.492

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 530,572 parts In-Stock

1+ parts

$0.293

100+ parts

$0.199

1k+ parts

$0.102

10k+ parts

-

530,572

$0.293

$0.199

$0.102

-

Mouser Electronics

USA . 4,574 parts In-Stock

1+ parts

$0.690

100+ parts

$0.386

1k+ parts

$0.339

10k+ parts

$0.307

4,574

$0.690

$0.386

$0.339

$0.307

DigiKey

USA . 3,548 parts In-Stock

1+ parts

$0.690

100+ parts

$0.386

1k+ parts

$0.338

10k+ parts

$0.301

3,548

$0.690

$0.386

$0.338

$0.301

Arrow

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.147

10,000

-

-

-

$0.147

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 154 parts In-Stock

1+ parts

$0.278

100+ parts

-

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154

$0.278

-

-

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Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$0.331

100+ parts

-

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500

$0.331

-

-

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Vyrian

USA . 141,889 parts In-Stock

1+ parts

-

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141,889

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-

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Bristol Electronics

USA . 605 parts In-Stock

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605

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Distributors (Availability)

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Semicontronic

India . 141,965 parts In-Stock

1+ parts

$0.125

100+ parts

$0.122

1k+ parts

$0.121

10k+ parts

-

141,965

$0.125

$0.122

$0.121

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Ampacity Inc.

Singapore . 141,868 parts In-Stock

1+ parts

$0.125

100+ parts

-

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141,868

$0.125

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Corphita

USA . 1,090 parts In-Stock

1+ parts

$0.264

100+ parts

-

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1,090

$0.264

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Argo Parts USA

USA . 2,626 parts In-Stock

1+ parts

$0.331

100+ parts

-

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10k+ parts

$0.321

2,626

$0.331

-

-

$0.321

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$0.331

100+ parts

$0.324

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-

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2,000

$0.331

$0.324

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Continental Prestige Electronics

USA . 287 parts In-Stock

1+ parts

$0.331

100+ parts

-

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-

10k+ parts

$0.324

287

$0.331

-

-

$0.324

Corohmni

South Africa . 1,210 parts In-Stock

1+ parts

$19.230

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1,210

$19.230

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Parana Technologies

USA . 1,539 parts In-Stock

1+ parts

$19.449

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$19.459

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1,539

$19.449

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$19.459

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DigiPath Technology Company

USA . 811 parts In-Stock

1+ parts

$21.416

100+ parts

$19.703

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811

$21.416

$19.703

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ChromeModa Solutions

Germany . 6,746 parts In-Stock

1+ parts

$21.853

100+ parts

$17.919

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6,746

$21.853

$17.919

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IDEA Electronic Components Group

UK . 1,637 parts In-Stock

1+ parts

$21.853

100+ parts

$20.760

1k+ parts

$19.668

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1,637

$21.853

$20.760

$19.668

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GreenTree Electronics

Israel . 10,000 parts In-Stock

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Kepictronics

USA . 4,462 parts In-Stock

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Lixinc

USA . 3,018 parts In-Stock

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Robosynatics

Brazil . 300 parts In-Stock

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Lucentia Tech

USA . 300 parts In-Stock

1+ parts

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$4.998

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$4.998

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$4.998

300

-

$4.998

$4.998

$4.998

Overview

Enhance your electronic projects with the SN74LVC1G74RSE2 by Texas Instruments, a top-tier manufacturer known for its quality and reliability. As part of the Latches & Flip-Flops category, this product offers lightning-fast propagation delay and a wide operating temperature range, making it ideal for various applications. With a low nominal supply voltage and high frequency capabilities, this chip carrier is perfect for automotive electronics or any project requiring precise timing and efficient power usage. Upgrade your designs today with the unparalleled performance and value of the SN74LVC1G74RSE2!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material makes the latch or flip-flop lightweight and durable, ensuring longevity and reliability in various applications.

Propagation Delay At Nominal Supply: 5.9 ns

The low propagation delay ensures fast switching times, making this latch or flip-flop suitable for applications requiring high-speed data processing.

Surface Mount: YES

The surface mount capability allows for easy and convenient integration onto circuit boards, saving space and simplifying the manufacturing process.

Nominal Supply Voltage: 1.8V

The low nominal supply voltage of 1.8V helps in reducing power consumption and makes the latch or flip-flop ideal for battery-powered devices.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C ensures that the latch or flip-flop can withstand harsh environmental conditions, making it suitable for industrial and automotive applications.

Technology: CMOS

Being based on CMOS technology, this latch or flip-flop offers low power consumption and high noise immunity, making it energy-efficient and reliable for various digital applications.

Technical Specifications

Latches & Flip-Flops SN74LVC1G74RSE2 attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

S-PQCC-N8

JESD-609 Code:

e4

Length:

1.5 mm

Logic IC Type:

Maximum Frequency At Nominal Supply:

175000000 Hz

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC8,.06SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

5.9 ns

Propagation Delay (tpd):

8.2 ns

Qualification:

Not Qualified

Maximum Seated Height:

.6 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

1.5 mm

Minimum fmax:

200 MHz

Trade Compliance

SN74LVC1G74RSE2 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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