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SN74HCT273NSRE4

Texas Instruments

SN74HCT273NSRE4 by Texas Instruments

SN74HCT273NSRE4 by Texas Instruments is an 8-bit latch with a 5V supply voltage, 42ns propagation delay, and 20 terminals. It is used in industrial applications requiring positive edge triggering and operates b/w -40 to 85°C. This CMOS technology flip-flop has a max frequency of 20MHz and comes in a small outline package for surface mounting.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,437 parts In-Stock

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Digiode

USA . 912 parts In-Stock

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Nova Conductors

Japan . 55 parts In-Stock

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Parana Technologies

USA . 1,893 parts In-Stock

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$12.766

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$13.233

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DigiPath Technology Company

USA . 1,778 parts In-Stock

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$14.057

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$12.933

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ChromeModa Solutions

Germany . 5,194 parts In-Stock

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$14.344

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$11.762

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IDEA Electronic Components Group

UK . 1,122 parts In-Stock

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$14.344

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$13.627

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$12.910

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$12.910

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AZTECH Wire

Italy . 394 parts In-Stock

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$18.929

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Corohmni

South Africa . 653 parts In-Stock

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Semicontronic

India . 964 parts In-Stock

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$34.000

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$33.150

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$32.980

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Ampacity Inc.

Singapore . 679 parts In-Stock

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One Stop Electronics

USA . 958 parts In-Stock

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Corphita

USA . 3,467 parts In-Stock

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Argo Parts USA

USA . 3,350 parts In-Stock

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Continental Prestige Electronics

USA . 1,963 parts In-Stock

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Bastille Electronics

Australia . 200 parts In-Stock

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Overview

Experience the innovation and reliability of Texas Instruments with the SN74HCT273NSRE4 Latch & Flip-Flop. This versatile component offers seamless performance in a variety of applications, providing customers with unmatched value and benefits. With a focus on quality and precision, Texas Instruments ensures that this product meets the highest standards, making it an essential choice for your electronic projects. Trust Texas Instruments to deliver excellence with the SN74HCT273NSRE4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for various applications.

Surface Mount: YES

Surface mount technology allows for easy installation and helps save space on the PCB.

No. of Bits: 8

With 8 bits, this latch & flip-flop can handle more data processing tasks efficiently.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard 5V supply voltage, making it compatible with many systems.

Propagation Delay (tpd): 42 ns

Fast propagation delay ensures quick response times for data processing.

Maximum Operating Temperature: 85 °C

Can operate reliably in industrial environments with high temperatures.

Trigger Type: POSITIVE EDGE

Positive edge triggering ensures precise control of the latch & flip-flop.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Technical Specifications

Latches & Flip-Flops SN74HCT273NSRE4 attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

HCT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.6 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

20000000 Hz

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay (tpd):

42 ns

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

5.3 mm

Minimum fmax:

23 MHz

Trade Compliance

SN74HCT273NSRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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