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MC74HCT74ADG

Onsemi

MC74HCT74ADG by Onsemi

MC74HCT74ADG by Onsemi is a dual latches & flip-flops IC with 14 terminals. It operates at 5V, has a load capacitance of 50pF, and a max frequency of 20MHz. Ideal for military-grade applications requiring positive edge triggering and fast propagation delay of 36ns.

Median Price

$0.192

Lifecycle Status

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17

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1k+

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Arrow

USA . 316 parts In-Stock

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$0.122

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$0.122

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Mouser Electronics

USA . 1,009 parts In-Stock

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$0.320

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$0.219

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DigiKey

USA . 120 parts In-Stock

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$0.380

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$0.218

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$0.180

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$0.161

120

$0.380

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$0.161

Adafruit Industries

USA . 33 parts In-Stock

1+ parts

$33.363

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$30.360

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$27.358

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33

$33.363

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$27.358

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Farnell

UK . 84,635 parts In-Stock

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$0.192

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$0.154

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$0.129

84,635

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$0.192

$0.154

$0.129

Rochester

USA . 83,930 parts In-Stock

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$0.192

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$0.159

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$0.142

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$0.192

$0.159

$0.142

Verical

USA . 53,045 parts In-Stock

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$0.177

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$0.177

Flip Electronics (Authorized)

USA . 22,550 parts In-Stock

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Chip1Stop

Japan . 4 parts In-Stock

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Digiode

USA . 2,091 parts In-Stock

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$0.149

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$0.149

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Nova Conductors

Japan . 96 parts In-Stock

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$0.200

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Vyrian

USA . 24,308 parts In-Stock

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Flip Electronics

USA . 14,850 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 175 parts In-Stock

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Holdelec - ElecDif-Pro

France . 175 parts In-Stock

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Bristol Electronics

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Prism Electronics

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Corphita

USA . 1,683 parts In-Stock

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$0.141

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$0.141

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Corohmni

South Africa . 175 parts In-Stock

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$0.157

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$0.157

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Argo Parts USA

USA . 4,233 parts In-Stock

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$0.182

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$0.177

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Netroflash

USA . 100 parts In-Stock

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$0.200

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Continental Prestige Electronics

USA . 88,780 parts In-Stock

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$0.264

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$0.148

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$0.119

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$0.100

88,780

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$0.148

$0.119

$0.100

Advanced Electronics

New Zealand . 33 parts In-Stock

1+ parts

$33.363

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$30.360

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$27.358

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$33.363

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Perfect Parts

USA . 8,497 parts In-Stock

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Problanco Electronics

Mexico . 7,258 parts In-Stock

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TANS Electronics

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Kulean Microsystems

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SupplyDigital Components

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UHIMA Technologies

Türkiye . 850 parts In-Stock

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Lixinc

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799

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Overview

Enhance your electronic projects with the MC74HCT74ADG by Onsemi, a top-tier manufacturer known for quality and innovation. This latches & flip-flops device offers reliable performance and versatility, making it ideal for a wide range of applications. With its advanced technology and robust design, this product ensures seamless operation and maximum efficiency. Trust Onsemi to deliver exceptional products that provide value, benefits, and advantages to you, the customer. Elevate your projects with the MC74HCT74ADG and experience superior results like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this latch durable and resistant to environmental factors, ensuring long-term reliability.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation onto PCBs, saving time and effort during assembly.

No. of Functions: 2

With two functions, this latch provides versatility and flexibility in performing different operations within the circuit.

Package Shape: RECTANGULAR

The rectangular package shape makes this latch easy to handle and integrate into various electronic systems.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V, this latch is compatible with standard voltage requirements in most electronic applications.

Load Capacitance (CL): 50 pF

With a load capacitance of 50pF, this latch can efficiently drive capacitive loads within the circuit.

Power Supplies (V): 5

Having a power supply of 5V ensures consistent and stable performance of this latch in different operating conditions.

No. of Terminals: 14

With 14 terminals, this latch offers multiple connection points for interfacing with other components, enhancing overall functionality.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB and allows for dense packing of components in limited areas.

Maximum I (ol): 4 Amp

With a maximum output current of 4A, this latch can drive high-power loads without risk of overheating or failure.

Propagation Delay (tpd): 36 ns

The low propagation delay of 36ns ensures fast response time and efficient operation of this latch in time-critical applications.

Maximum Operating Temperature: 125 °C

Operating at a maximum temperature of 125°C, this latch can withstand high-temperature environments without performance degradation.

Trigger Type: POSITIVE EDGE

The positive edge trigger type ensures precise and accurate timing control for triggering the latch under specific conditions.

Minimum Operating Temperature: -55 °C

With a minimum operating temperature of -55°C, this latch remains functional even in extreme cold environments.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides a reliable and corrosion-resistant connection, ensuring long-term performance and durability.

Terminal Position: DUAL

The dual terminal position allows for versatile mounting options, improving the flexibility in incorporation of this latch into different systems.

Technical Specifications

Latches & Flip-Flops MC74HCT74ADG attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Family:

HCT

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e3

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

20000000 Hz

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay (tpd):

36 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

3.9 mm

Minimum fmax:

20 MHz

Trade Compliance

MC74HCT74ADG Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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