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CD74HC112PWRG4

Texas Instruments

CD74HC112PWRG4 by Texas Instruments

CD74HC112PWRG4 by Texas Instruments is a dual-function latches & flip-flops IC with 2 bits, operating at a nominal voltage of 4.5V and max frequency of 20MHz. It features a propagation delay of 265ns, complementary output polarity, and trigger type as negative edge for applications requiring high-speed data transfer in military-grade environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,683 parts In-Stock

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Digiode

USA . 110 parts In-Stock

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Nova Conductors

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AZTECH Wire

Italy . 741 parts In-Stock

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$5.476

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Parana Technologies

USA . 1,362 parts In-Stock

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$15.251

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$15.648

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ChromeModa Solutions

Germany . 3,839 parts In-Stock

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IDEA Electronic Components Group

UK . 1,142 parts In-Stock

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$16.279

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$15.422

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One Stop Electronics

USA . 360 parts In-Stock

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$31.000

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Ampacity Inc.

Singapore . 347 parts In-Stock

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$35.000

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Continental Prestige Electronics

USA . 2,746 parts In-Stock

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Perfect Parts

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Argo Parts USA

USA . 1,531 parts In-Stock

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DigiPath Technology Company

USA . 1,290 parts In-Stock

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Bastille Electronics

Australia . 800 parts In-Stock

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Corphita

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Overview

Unlock the potential of your electronic projects with the CD74HC112PWRG4 by Texas Instruments. Built with precision and reliability in mind, this versatile latch & flip-flop component offers seamless integration and high performance. From military-grade applications to consumer electronics, this product is designed to meet your needs. Trust Texas Instruments to deliver top-notch quality and innovation, ensuring that your projects run smoothly and efficiently. Experience the benefits of cutting-edge technology and unmatched value with the CD74HC112PWRG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the latch and flip-flop lightweight and durable, ideal for portable electronic devices.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on a circuit board, saving space and simplifying assembly.

No. of Functions: 2

Having 2 functions in one component provides versatility and flexibility in circuit design and functionality.

Nominal Supply Voltage / Vsup (V): 4.5

The nominal supply voltage of 4.5V ensures compatibility with a wide range of electronic systems and devices.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C allows for reliable performance in harsh operating conditions.

Trigger Type: NEGATIVE EDGE

The negative edge trigger type ensures precise and reliable operation, reducing the risk of false triggers in the circuit.

Technology: CMOS

The use of CMOS technology results in low power consumption, making the latch and flip-flop efficient and energy-saving.

Maximum Frequency At Nominal Supply: 20000000 Hz

With a high maximum frequency, this latch and flip-flop can handle high-speed data processing and transmission, suitable for demanding applications.

Technical Specifications

Latches & Flip-Flops CD74HC112PWRG4 attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

20000000 Hz

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

2

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay (tpd):

265 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

NEGATIVE EDGE

Width:

4.4 mm

Minimum fmax:

23 MHz

Trade Compliance

CD74HC112PWRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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