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SN74AUC74RGYR

Texas Instruments

SN74AUC74RGYR by Texas Instruments

SN74AUC74RGYR by Texas Instruments is a CMOS latches & flip-flops chip with 2 functions, 4ns propagation delay, and 225MHz max frequency. It operates at a supply voltage of 1.2V, has a load capacitance of 15pF, and is suitable for industrial applications requiring positive edge triggering in compact designs.

Median Price

$0.441

Lifecycle Status

Suppliers In-Stock

20

In-Stock Inventory

1k+

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Texas Instruments

USA . 69,190 parts In-Stock

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$0.563

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$0.433

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$0.228

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$0.563

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$0.228

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Mouser Electronics

USA . 3,943 parts In-Stock

1+ parts

$0.710

100+ parts

$0.398

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$0.354

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3,943

$0.710

$0.398

$0.354

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DigiKey

USA . 446,189 parts In-Stock

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$0.480

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446,189

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$0.480

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Rochester

USA . 446,189 parts In-Stock

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$0.387

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$0.321

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$0.286

446,189

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$0.387

$0.321

$0.286

Verical

USA . 433,204 parts In-Stock

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$0.402

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$0.358

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Arrow

USA . 6,000 parts In-Stock

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Digiode

USA . 4,274 parts In-Stock

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$0.301

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Nova Conductors

Japan . 100 parts In-Stock

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$0.368

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$0.368

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TME

Poland . 240 parts In-Stock

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$0.710

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$0.453

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240

$0.710

$0.453

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DigiKey Marketplace

USA . 446,189 parts In-Stock

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$0.330

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$0.330

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Vyrian

USA . 225,146 parts In-Stock

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Netsource Technology, Inc.

USA . 15,899 parts In-Stock

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Semtec, LLC

USA . 8,900 parts In-Stock

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Component Sense

UK . 3,230 parts In-Stock

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Velocity Electronics

USA . 1,000 parts In-Stock

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Electronics Depot

USA . 982 parts In-Stock

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Dan-Mar Components

USA . 549 parts In-Stock

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Bristol Electronics

USA . 524 parts In-Stock

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$0.299

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$0.255

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524

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North Shore Components

USA . 37 parts In-Stock

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Prism Electronics

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Distributors (Availability)

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Semicontronic

India . 224,917 parts In-Stock

1+ parts

$0.225

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$0.219

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$0.218

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224,917

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$0.218

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Ampacity Inc.

Singapore . 224,851 parts In-Stock

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$0.225

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Corphita

USA . 2,171 parts In-Stock

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Continental Prestige Electronics

USA . 2,473 parts In-Stock

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$0.368

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$0.360

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Argo Parts USA

USA . 1,777 parts In-Stock

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Bastille Electronics

Australia . 97 parts In-Stock

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$0.368

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$0.350

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$0.332

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$0.328

97

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Microchip USA

USA . 2,958 parts In-Stock

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Parana Technologies

USA . 1,984 parts In-Stock

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$29.647

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$61.584

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DigiPath Technology Company

USA . 1,914 parts In-Stock

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$32.645

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$30.033

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ChromeModa Solutions

Germany . 5,614 parts In-Stock

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$33.311

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$27.315

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IDEA Electronic Components Group

UK . 531 parts In-Stock

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$33.311

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$31.645

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$29.980

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Kepictronics

USA . 13,420 parts In-Stock

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Authorized Procurement Solutions

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Infinite Electronics LLP (Excess)

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A-Z Elektronik GmbH

Germany . 1,211 parts In-Stock

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Overview

Unlock the potential of your electronics with the SN74AUC74RGYR by Texas Instruments. Crafted with precision and expertise, this latches & flip-flops device offers superior performance and reliability. Perfect for a wide range of applications, this product provides customers with unmatched value and benefits. Experience fast propagation delay, low power consumption, and seamless integration, all in a compact and durable package. Trust in Texas Instruments to deliver cutting-edge technology that exceeds expectations. Elevate your projects with the SN74AUC74RGYR today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good protection for internal components and ensures durability of the latch or flip-flop.

Propagation Delay At Nominal Supply: 4 ns

Fast propagation delay ensures quick response time for the latch or flip-flop operation.

Surface Mount: YES

Allows for easy installation and integration onto circuit boards, saving space and reducing assembly time.

Nominal Supply Voltage / Vsup (V): 1.2

Operates at a low voltage, making it energy efficient and suitable for low power applications.

No. of Functions: 2

Provides flexibility and versatility in terms of functionality and operations.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, making it suitable for industrial environments.

Trigger Type: POSITIVE EDGE

Allows for precise triggering and control of the latch or flip-flop operation.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity.

Technical Specifications

Latches & Flip-Flops SN74AUC74RGYR attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

AUC

JESD-30 Code:

S-PQCC-N14

JESD-609 Code:

e4

Length:

3.5 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

225000000 Hz

Maximum I (ol):

9 Amp

Moisture Sensitivity Level (MSL):

2

No. of Bits:

1

No. of Functions:

2

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC14/18,.14SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2/2.5

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

4 ns

Propagation Delay (tpd):

4 ns

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

2.7 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage / Vsup (V):

1.2

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

3.5 mm

Minimum fmax:

350 MHz

Trade Compliance

SN74AUC74RGYR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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