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54F109LM

Texas Instruments

54F109LM by Texas Instruments

Texas Instruments 54F109LM is a TTL technology chip carrier with 2 functions, 2 bits, and 20 terminals. It operates b/w -55 to 125 °C, with a propagation delay of 10.5 ns at max supply voltage of 5.5 V. Ideal for military-grade applications requiring positive edge trigger latches & flip-flops in a compact square package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,989 parts In-Stock

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Digiode

USA . 4,880 parts In-Stock

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Anansix

USA . 311 parts In-Stock

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One Stop Electronics

USA . 1,415 parts In-Stock

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$11.000

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$11.000

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AZTECH Wire

Italy . 864 parts In-Stock

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$15.278

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864

$15.278

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Parana Technologies

USA . 2,075 parts In-Stock

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$17.752

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$17.934

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$17.752

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DigiPath Technology Company

USA . 409 parts In-Stock

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$19.547

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409

$19.547

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IDEA Electronic Components Group

UK . 1,872 parts In-Stock

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$19.946

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$18.949

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$17.951

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$18.949

$17.951

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ChromeModa Solutions

Germany . 165 parts In-Stock

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$19.946

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$16.356

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Northwest PG Solutions

USA . 1,390 parts In-Stock

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Native Components

USA . 379 parts In-Stock

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Corphita

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Overview

Unlock the power of seamless data transfer with the 54F109LM by Texas Instruments. Crafted with precision and expertise, this latches & flip-flops device offers unparalleled reliability and performance in a variety of applications. With a focus on quality and innovation, Texas Instruments delivers a product that exceeds expectations. Experience the value of quick propagation delay, temperature resilience, and 3-state output characteristics. Elevate your projects with the 54F109LM and discover the difference that superior technology can make.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material ensures high durability and resistance to extreme temperatures, making the product suitable for harsh environments.

No. of Functions: 2

Having 2 functions in one component saves space and reduces the complexity of the circuit design.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard voltage of 5V makes this latch and flip-flop compatible with most electronic systems.

Propagation Delay (tpd): 10.5 ns

Low propagation delay ensures fast response times and efficient operation of the latch and flip-flop.

Output Characteristics: 3-STATE

3-state output allows for flexible control and connection options, enhancing the versatility of the product.

Technology: TTL

Using TTL technology ensures compatibility with a wide range of devices and provides reliable performance.

Technical Specifications

Latches & Flip-Flops 54F109LM attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

F/FAST

JESD-30 Code:

S-CQCC-N20

Length:

8.89 mm

Logic IC Type:

No. of Bits:

2

No. of Functions:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

COMPLEMENTARY

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Propagation Delay (tpd):

10.5 ns

Maximum Seated Height:

1.905 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Trigger Type:

POSITIVE EDGE

Width:

8.89 mm

Minimum fmax:

70 MHz

Trade Compliance

54F109LM Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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