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CD4043BD

Texas Instruments

CD4043BD by Texas Instruments

CD4043BD by Texas Instruments is a 4-bit latch/flip-flop with a propagation delay of 140 ns. It operates at a nominal voltage of 5V and has a max operating temperature of 125°C. This IC is commonly used in military-grade applications due to its small outline package and CMOS technology.

Median Price

$0.514

Lifecycle Status

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16

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1k+

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Mouser Electronics

USA . 333 parts In-Stock

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$1.060

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$0.482

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$0.363

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$1.060

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$0.482

$0.363

Rochester

USA . 2,483 parts In-Stock

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$0.496

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$0.411

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$0.367

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$0.496

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$0.367

DigiKey

USA . 2,483 parts In-Stock

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$0.620

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Verical

USA . 2,483 parts In-Stock

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$0.514

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$0.459

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$0.459

Avnet

USA . 656 parts In-Stock

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$0.127

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Freelance Electronics

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Digiode

USA . 4,506 parts In-Stock

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$0.318

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$0.318

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TME

Poland . 2 parts In-Stock

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$0.393

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$0.393

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Nova Conductors

Japan . 50 parts In-Stock

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$0.531

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50

$0.531

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Component Electronics Inc.

Canada . 34 parts In-Stock

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$0.650

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$0.490

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$0.430

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$0.650

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Vyrian

USA . 1,422 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 36 parts In-Stock

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Bristol Electronics

USA . 36 parts In-Stock

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$0.720

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Dan-Mar Components

USA . 36 parts In-Stock

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Florida Circuit

USA . 30 parts In-Stock

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Speed Components Ltd

Israel . 5 parts In-Stock

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Semicontronic

India . 1,435 parts In-Stock

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$0.108

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$0.105

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$0.105

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$0.105

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Ampacity Inc.

Singapore . 1,358 parts In-Stock

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$0.108

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Corphita

USA . 3,587 parts In-Stock

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$0.302

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Continental Prestige Electronics

USA . 6,207 parts In-Stock

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$0.531

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$0.520

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Argo Parts USA

USA . 3,126 parts In-Stock

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$0.531

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$0.515

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Bastille Electronics

Australia . 3,957 parts In-Stock

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$0.531

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$0.504

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$0.479

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$0.473

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$0.504

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$0.473

Parana Technologies

USA . 952 parts In-Stock

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$9.443

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$10.057

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Corohmni

South Africa . 14 parts In-Stock

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$10.203

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DigiPath Technology Company

USA . 1,673 parts In-Stock

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$10.398

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ChromeModa Solutions

Germany . 5,307 parts In-Stock

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$10.610

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$8.700

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IDEA Electronic Components Group

UK . 141 parts In-Stock

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$10.610

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$10.080

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$9.549

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QUARKTWIN TECHNOLOGY LTD

USA . 25,681 parts In-Stock

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Authorized Procurement Solutions

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Perfect Parts

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Microchip USA

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Supply Digital

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GreenTree Electronics

Israel . 656 parts In-Stock

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Overview

Experience superior performance and reliability with the CD4043BD by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-notch quality and innovation in latches & flip-flops. This product offers countless applications, making it a versatile choice for your projects. From its compact design to its true output polarity, this small outline package delivers exceptional value and benefits to customers. With its high-level trigger type and 3-STATE output characteristics, the CD4043BD guarantees optimal functionality and seamless integration. Trust Texas Instruments for all your electronic needs and unlock a world of possibilities with the CD4043BD.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the internal components of the latch or flip-flop.

Propagation Delay At Nominal Supply: 140 ns

The low propagation delay ensures quick response time, making this product suitable for applications requiring fast switching speeds.

Surface Mount: YES

The surface mount capability allows for easy and efficient PCB assembly, saving time and effort during manufacturing.

Package Shape: RECTANGULAR

The rectangular package shape helps in efficient space utilization on the PCB, making it convenient for compact design layouts.

Nominal Supply Voltage / Vsup (V): 5

The 5V nominal supply voltage ensures compatibility with common power sources, making integration into existing systems straightforward.

Load Capacitance (CL): 50 pF

The specified load capacitance value ensures stable operation and prevents signal degradation, maintaining reliability in the circuit.

Power Supplies (V): 5/15

The availability of multiple power supply options (5V and 15V) offers flexibility in design and compatibility with different system requirements.

No. of Terminals: 16

The 16 terminals provide ample connection points for interfacing with other circuit components, enabling versatile usage in various applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, making it ideal for applications with limited board real estate.

Output Characteristics: 3-STATE

The 3-state output allows for high impedance state when not actively driving the load, reducing power consumption and enabling bus sharing.

Technical Specifications

Latches & Flip-Flops CD4043BD attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

2.4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Maximum Power Supply Current (ICC):

.06 mA

Propagation Delay At Nominal Supply:

140 ns

Propagation Delay (tpd):

300 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.75 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

HIGH LEVEL

Width:

3.9 mm

Trade Compliance

CD4043BD Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-00-592-4794, 5962005924794, 5962-01-171-9678, 5962011719678

NIIN

005924794, 011719678

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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