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SN74LS76J

Texas Instruments

SN74LS76J by Texas Instruments

SN74LS76J by Texas Instruments is a TTL technology latch with 2 bits, operating at 5V. It features negative edge triggering and complementary output polarity. This dual-terminal device comes in a ceramic rectangular package and is ideal for commercial applications requiring reliable flip-flop functionality.

Median Price

$18.630

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

American Microsemiconductor Inc.

USA . 4 parts In-Stock

1+ parts

$18.630

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4

$18.630

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Digiode

USA . 4,376 parts In-Stock

1+ parts

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4,376

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Vyrian

USA . 3,901 parts In-Stock

1+ parts

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3,901

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Distributors (Availability)

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AZTECH Wire

Italy . 668 parts In-Stock

1+ parts

$5.580

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668

$5.580

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Semicontronic

India . 1,647 parts In-Stock

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$10.000

100+ parts

$9.750

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$9.700

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1,647

$10.000

$9.750

$9.700

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Ampacity Inc.

Singapore . 652 parts In-Stock

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$13.000

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652

$13.000

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Parana Technologies

USA . 1,570 parts In-Stock

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$23.720

100+ parts

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$24.346

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1,570

$23.720

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$24.346

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DigiPath Technology Company

USA . 436 parts In-Stock

1+ parts

$26.119

100+ parts

$24.029

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436

$26.119

$24.029

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ChromeModa Solutions

Germany . 4,542 parts In-Stock

1+ parts

$26.652

100+ parts

$21.855

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4,542

$26.652

$21.855

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IDEA Electronic Components Group

UK . 1,324 parts In-Stock

1+ parts

$26.652

100+ parts

$25.319

1k+ parts

$23.987

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1,324

$26.652

$25.319

$23.987

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Corohmni

South Africa . 27 parts In-Stock

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$33.324

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27

$33.324

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One Stop Electronics

USA . 1,021 parts In-Stock

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$57.000

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1,021

$57.000

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Continental Prestige Electronics

USA . 5,992 parts In-Stock

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Argo Parts USA

USA . 4,406 parts In-Stock

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Corphita

USA . 811 parts In-Stock

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Bastille Electronics

Australia . 120 parts In-Stock

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120

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Assy Fe

Spain . 17 parts In-Stock

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Overview

Enhance your electronic projects with the SN74LS76J by Texas Instruments, a top-quality latches & flip-flops component that offers reliability and precision. Manufactured by industry leader Texas Instruments, this product ensures superior performance and durability. Perfect for a wide range of applications, this versatile component provides customers with unmatched value and benefits. Upgrade your designs with the SN74LS76J and experience the difference in quality and efficiency.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic packages provide excellent thermal properties, making them suitable for high temperature environments.

No. of Functions: 2

Having 2 functions in one component can help save board space and simplify circuit design.

Package Shape: RECTANGULAR

Rectangular packages are typically easier to handle and incorporate into a circuit compared to irregular shapes.

No. of Bits: 2

Having 2 bits allows for basic binary operations and data storage.

Nominal Supply Voltage / Vsup (V): 5

Operating at a common 5V supply voltage makes integration with other components straightforward.

Power Supplies (V): 5

Consistent power supply voltage ensures stable operation of the latch or flip-flop.

No. of Terminals: 16

Having 16 terminals provides flexibility for interfacing with other components or circuits.

Package Style (Meter): IN-LINE

The in-line package style makes it easier to incorporate into existing circuits or systems.

Maximum Operating Temperature: 70 °C

Being able to operate at up to 70°C allows for use in a wide range of environments.

Trigger Type: NEGATIVE EDGE

Negative edge triggering can help prevent glitches and errors in the signal transition.

Minimum Operating Temperature: 0 °C

The ability to operate at temperatures as low as 0°C increases the versatility of the product.

Terminal Position: DUAL

Dual terminal position allows for multiple connection options, increasing flexibility in circuit layout.

Output Polarity: COMPLEMENTARY

Complementary output polarity simplifies circuit design and compatibility with other components.

Temperature Grade: COMMERCIAL

Designed for commercial temperature ranges, making it suitable for most standard applications.

Technology: TTL

Using TTL technology ensures fast switching speeds and compatibility with other TTL components.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide a secure and reliable connection to the PCB, suitable for various mounting methods.

Terminal Pitch: 2.54 mm

A standard terminal pitch of 2.54mm allows for easy integration into common prototyping boards and PCBs.

Technical Specifications

Latches & Flip-Flops SN74LS76J attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

LS

JESD-30 Code:

R-XDIP-T16

Logic IC Type:

No. of Bits:

2

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

FF/Latches

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

NEGATIVE EDGE

Trade Compliance

SN74LS76J Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-050-0915, 5962010500915

NIIN

010500915

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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