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NGTB40N65IHRTG

Onsemi

NGTB40N65IHRTG by Onsemi

NGTB40N65IHRTG by Onsemi is an N-CHANNEL IGBT with VCEsat of 1.7V, IC of 80A, and toff of 316ns. Ideal for POWER CONTROL applications due to its high power dissipation of 405W and max VCE of 650V. The package style is FLANGE MOUNT with a COLLECTOR case connection.

Median Price

$2.148

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

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Mouser Electronics

USA . 10 parts In-Stock

1+ parts

$2.920

100+ parts

-

1k+ parts

$1.850

10k+ parts

$1.500

10

$2.920

-

$1.850

$1.500

DigiKey

USA . 80 parts In-Stock

1+ parts

$3.090

100+ parts

$1.807

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80

$3.090

$1.807

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Rochester

USA . 74,703 parts In-Stock

1+ parts

-

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$1.230

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$1.100

10k+ parts

$1.030

74,703

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$1.230

$1.100

$1.030

Verical

USA . 74,703 parts In-Stock

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-

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$1.375

10k+ parts

$1.288

74,703

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$1.375

$1.288

Flip Electronics (Authorized)

USA . 30 parts In-Stock

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30

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Digiode

USA . 2,238 parts In-Stock

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$1.302

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Vyrian

USA . 8,384 parts In-Stock

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USA . 30 parts In-Stock

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Corphita

USA . 1,291 parts In-Stock

1+ parts

$1.233

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$1.233

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Corohmni

South Africa . 463 parts In-Stock

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$1.370

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463

$1.370

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Component Stockers USA

USA . 66,437 parts In-Stock

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$1.410

100+ parts

$1.330

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$1.200

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$1.200

66,437

$1.410

$1.330

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$1.200

Microchip USA

USA . 5,479 parts In-Stock

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$18.785

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$18.785

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Perfect Parts

USA . 78,960 parts In-Stock

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Continental Prestige Electronics

USA . 74,703 parts In-Stock

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$1.720

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$1.720

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RC Electronics

USA . 15,142 parts In-Stock

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Kepictronics

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A-Z Elektronik GmbH

Germany . 6,893 parts In-Stock

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Authorized Procurement Solutions

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Kulean Microsystems

USA . 4,942 parts In-Stock

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Problanco Electronics

Mexico . 4,474 parts In-Stock

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SupplyDigital Components

Austria . 3,257 parts In-Stock

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TANS Electronics

Latvia . 3,024 parts In-Stock

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UHIMA Technologies

Türkiye . 162 parts In-Stock

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Overview

Unleash the power of innovation with the NGTB40N65IHRTG by Onsemi! Crafted with precision and expertise, this Insulated Gate Bipolar Transistor (IGBT) offers superior performance in power control applications. With a maximum VCEsat of 1.7V and a maximum operating temperature of 175°C, this transistor is designed to deliver efficiency and reliability like never before. Experience seamless power management with the single configuration and built-in diode feature. Elevate your projects to the next level with the NGTB40N65IHRTG - where quality meets excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides insulation and protection for the internal components, increasing the durability and reliability of the product.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs typically have lower conduction losses and higher efficiency compared to P-channel types, making them suitable for power control applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for better freewheeling performance and protection against voltage spikes in power control applications.

Maximum VCEsat: 1.7 V

Low VCEsat value indicates minimal voltage drop across the collector-emitter junction, leading to reduced power dissipation and improved efficiency.

Maximum Power Dissipation (Abs): 405 W

High power dissipation capability allows the IGBT to handle large amounts of electrical power without overheating, ensuring reliable operation.

Maximum Operating Temperature: 175 °C

Ability to operate at high temperatures without performance degradation, enabling use in demanding environments.

Maximum Collector-Emitter Voltage: 650 V

Capable of handling high voltage levels, making it suitable for power control applications where high voltages are involved.

Maximum Collector Current (IC): 80 A

High collector current rating allows the IGBT to carry large currents, making it suitable for high-power applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) NGTB40N65IHRTG attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Additional Features:

LOW CONDUCTION LOSS

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

650 V

Maximum Gate-Emitter Threshold Voltage:

6.5 V

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

316 ns

Maximum VCEsat:

1.7 V

Trade Compliance

NGTB40N65IHRTG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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