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NGTB15N120IHLWG

Onsemi

NGTB15N120IHLWG by Onsemi

NGTB15N120IHLWG by Onsemi is an N-CHANNEL IGBT with a max collector-emitter voltage of 1200V and a max gate-emitter voltage of 20V. It has a nominal turn off time of 440ns, making it suitable for power control applications requiring high voltage handling and fast switching capabilities. The transistor's package style is flange mount with through-hole terminals, ideal for applications where efficient heat dissipation is crucial.

Median Price

$1.290

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 125 parts In-Stock

1+ parts

-

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$1.290

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$1.160

10k+ parts

$1.090

125

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$1.290

$1.160

$1.090

Distributors (In-Stock)

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Digiode

USA . 2,085 parts In-Stock

1+ parts

$1.368

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2,085

$1.368

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Vyrian

USA . 456 parts In-Stock

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$1.440

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456

$1.440

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Speed Components Ltd

Israel . 130 parts In-Stock

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130

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Corphita

USA . 1,713 parts In-Stock

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$1.296

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$1.296

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Corohmni

South Africa . 487 parts In-Stock

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$1.440

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487

$1.440

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AZTECH Wire

Italy . 680 parts In-Stock

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$22.080

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680

$22.080

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A-Z Elektronik GmbH

Germany . 7,457 parts In-Stock

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TANS Electronics

Latvia . 5,977 parts In-Stock

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SupplyDigital Components

Austria . 5,406 parts In-Stock

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Problanco Electronics

Mexico . 5,116 parts In-Stock

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Kulean Microsystems

USA . 1,792 parts In-Stock

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Perfect Parts

USA . 584 parts In-Stock

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UHIMA Technologies

Türkiye . 149 parts In-Stock

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Overview

Unleash the power of innovation with the NGTB15N120IHLWG by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Insulated Gate Bipolar Transistors (IGBT) designed for power control applications. With a single configuration and built-in diode, this transistor offers unmatched reliability and performance. The NGTB15N120IHLWG is the perfect solution for your power needs, providing a maximum collector-emitter voltage of 1200V and a maximum gate-emitter voltage of 20V. Trust Onsemi to deliver cutting-edge technology that exceeds expectations. Elevate your projects with the NGTB15N120IHLWG today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good insulation and protection for the internal components of the IGBT, ensuring reliable performance and durability.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode allows for easier implementation in power control circuits, simplifying the overall design and reducing the need for additional components.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, ensuring efficient and precise control over power distribution and consumption.

Maximum Power Dissipation (Abs): 156 W

High power dissipation capability allows for handling of heavy load requirements, making it suitable for high-power applications.

Maximum Collector-Emitter Voltage: 1200 V

High collector-emitter voltage rating allows for use in high voltage circuits, providing flexibility in circuit design and application.

Maximum Collector Current (IC): 30 A

High collector current rating enables the IGBT to handle high current flows, making it suitable for applications requiring high power output.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) NGTB15N120IHLWG attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Maximum Gate-Emitter Threshold Voltage:

6.5 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

440 ns

Trade Compliance

NGTB15N120IHLWG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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