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MPF4392RLRA

Onsemi

MPF4392RLRA by Onsemi

MPF4392RLRA by Onsemi is a N-CHANNEL FET with 30V DS Breakdown Voltage, ideal for SWITCHING applications. Featuring a DEPLETION MODE, it has a low 60 ohm Drain-Source On Resistance and 3.5 pF Feedback Capacitance. This THROUGH-HOLE transistor in CYLINDRICAL package suits various electronic designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 1,452 parts In-Stock

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Vyrian

USA . 954 parts In-Stock

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Kulean Microsystems

USA . 7,872 parts In-Stock

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SupplyDigital Components

Austria . 3,177 parts In-Stock

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Problanco Electronics

Mexico . 3,076 parts In-Stock

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TANS Electronics

Latvia . 2,855 parts In-Stock

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Corphita

USA . 2,038 parts In-Stock

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UHIMA Technologies

Türkiye . 962 parts In-Stock

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Corohmni

South Africa . 51 parts In-Stock

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Overview

Unlock the potential of your electronic projects with the MPF4392RLRA by Onsemi. Crafted with precision and expertise, this small signal Field Effect Transistor offers unparalleled performance and reliability for switching applications. Whether you're a hobbyist or a professional, this N-channel transistor provides seamless functionality with its depletion mode operation. With a minimum DS breakdown voltage of 30V and maximum drain-source on resistance of 60 ohm, the MPF4392RLRA ensures optimal efficiency and durability. Elevate your projects with this high-quality component from Onsemi and experience the difference in performance and value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protects the internal components from damage, making the transistor reliable for long-term use.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs generally have better performance characteristics than P-Channel FETs, offering lower on-resistance and faster switching speeds.

Configuration: SINGLE

Simplifies circuit design and integration, making it easy to use in various applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, providing efficient and reliable switching performance.

Minimum DS Breakdown Voltage: 30 V

With a breakdown voltage of 30V, this FET can handle higher voltages without failure, making it suitable for a wide range of applications.

Package Shape: ROUND

The round package shape allows for easy mounting and integration into circuits, making it convenient to use.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical connections, ensuring reliable performance under various operating conditions.

Operating Mode: DEPLETION MODE

Depletion mode operation allows for easy control of the transistor, providing flexibility in circuit design and operation.

No. of Terminals: 3

Having 3 terminals enables versatile connectivity options and allows for easy interfacing with other components in the circuit.

Package Style (Meter): CYLINDRICAL

The cylindrical package style offers compact and space-saving design, making it suitable for applications where size is a constraint.

Field Effect Transistor Technology: JUNCTION

Junction FET technology provides high gain and low noise performance, ensuring optimal signal amplification and stability.

Transistor Element Material: SILICON

Silicon-based FETs offer high performance and reliability, with excellent thermal stability and low leakage current.

Terminal Finish: TIN LEAD

Tin lead terminal finish provides good solderability and conductivity, ensuring reliable electrical connections in the circuit.

Maximum Drain-Source On Resistance: 60 ohm

With a low on-resistance of 60 ohms, this FET offers efficient power handling and reduced power losses during operation.

Terminal Position: BOTTOM

Bottom terminal positioning allows for easy soldering and secure mounting on the circuit board, enhancing reliability and performance.

Maximum Feedback Capacitance (Crss): 3.5 pF

Low feedback capacitance ensures minimal signal loss and distortion, enabling high-frequency operation and improved signal integrity.

Technical Specifications

Small Signal Field Effect Transistors (FET) MPF4392RLRA attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Minimum DS Breakdown Voltage:

30 V

Maximum Drain-Source On Resistance:

60 ohm

Field Effect Transistor Technology:

JUNCTION

Maximum Feedback Capacitance (Crss):

3.5 pF

JEDEC-95 Code:

TO-92

JESD-30 Code:

O-PBCY-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

DEPLETION MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

CYLINDRICAL

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

BOTTOM

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

MPF4392RLRA Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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