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MPF4392ZL1

Onsemi

MPF4392ZL1 by Onsemi

MPF4392ZL1 by Onsemi is a N-CHANNEL FET for SWITCHING applications. It features a 30V DS Breakdown Voltage, 60 ohm Drain-Source On Resistance, and 3.5 pF Feedback Capacitance. This DEPLETION MODE transistor has a ROUND package with THROUGH-HOLE terminals, ideal for various electronic circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 1,605 parts In-Stock

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Vyrian

USA . 352 parts In-Stock

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Problanco Electronics

Mexico . 6,982 parts In-Stock

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SupplyDigital Components

Austria . 4,912 parts In-Stock

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Kulean Microsystems

USA . 2,004 parts In-Stock

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TANS Electronics

Latvia . 1,923 parts In-Stock

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UHIMA Technologies

Türkiye . 442 parts In-Stock

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Corohmni

South Africa . 316 parts In-Stock

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Corphita

USA . 273 parts In-Stock

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Overview

Unlock the power of innovation with the MPF4392ZL1 by Onsemi. Crafted with precision and expertise, this Small Signal Field Effect Transistor (FET) offers unparalleled performance and reliability. From switching applications to depletion mode operation, this N-CHANNEL transistor provides seamless functionality in various scenarios. With a 30V minimum DS breakdown voltage and low on-resistance, the MPF4392ZL1 guarantees optimal efficiency and durability. Trust in Onsemi's legacy of excellence and elevate your projects with the ultimate in transistor technology. Experience the difference with the MPF4392ZL1 - where quality meets innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the transistor, ensuring a longer lifespan.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have better performance characteristics compared to P-channel transistors, making this product a good choice for various applications.

Configuration: SINGLE

The single configuration simplifies the circuit design and enhances the overall reliability of the transistor.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor offers fast switching speeds and efficient performance.

Minimum DS Breakdown Voltage: 30 V

With a minimum breakdown voltage of 30V, this transistor can handle higher voltage levels, making it suitable for a wide range of applications.

Package Shape: ROUND

The round package shape allows for easy integration into various circuit designs and applications.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide a secure and reliable connection, ensuring stable performance in different environments.

Operating Mode: DEPLETION MODE

Depletion mode transistors offer precise control over the current flow, making them ideal for specific circuit requirements.

No. of Terminals: 3

The 3-terminal design simplifies the connection process and enhances the overall efficiency of the transistor.

Package Style (Meter): CYLINDRICAL

The cylindrical package style allows for easy mounting and installation in various electronic devices.

Field Effect Transistor Technology: JUNCTION

Junction field-effect transistors offer high input impedance and low output impedance, providing excellent performance in various amplifier circuits.

Transistor Element Material: SILICON

Silicon transistors offer high temperature tolerance and reliability, making them suitable for demanding applications.

Terminal Finish: TIN LEAD

The tin-lead terminal finish ensures good solderability and electrical conductivity, enhancing the overall reliability of the transistor.

Maximum Drain-Source On Resistance: 60 ohm

With a low on-resistance of 60 ohms, this transistor minimizes power losses and improves the efficiency of the circuit.

Terminal Position: BOTTOM

The bottom terminal position simplifies the mounting process and ensures a secure connection in different circuit configurations.

Maximum Feedback Capacitance (Crss): 3.5 pF

The low feedback capacitance of 3.5 pF reduces the risk of signal distortion and improves the high-frequency performance of the transistor.

Technical Specifications

Small Signal Field Effect Transistors (FET) MPF4392ZL1 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

EUROPEAN PART NUMBER

Configuration:

Minimum DS Breakdown Voltage:

30 V

Maximum Drain-Source On Resistance:

60 ohm

Field Effect Transistor Technology:

JUNCTION

Maximum Feedback Capacitance (Crss):

3.5 pF

JEDEC-95 Code:

TO-92

JESD-30 Code:

O-PBCY-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

DEPLETION MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

CYLINDRICAL

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

BOTTOM

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

MPF4392ZL1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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