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MC100LVEP210FAG

Onsemi

MC100LVEP210FAG by Onsemi

MC100LVEP210FAG clock driver by Onsemi features 0.75 ns propagation delay, 2.5V nominal voltage, and ECL technology. Ideal for industrial applications requiring differential input conditioning and 32 terminals in a flatpack package style.

Median Price

$14.200

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 118 parts In-Stock

1+ parts

$19.640

100+ parts

$14.600

1k+ parts

$14.260

10k+ parts

-

118

$19.640

$14.600

$14.260

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DigiKey

USA . 218 parts In-Stock

1+ parts

$21.820

100+ parts

$15.178

1k+ parts

$14.265

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218

$21.820

$15.178

$14.265

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Rochester

USA . 10,365 parts In-Stock

1+ parts

-

100+ parts

$12.980

1k+ parts

$11.610

10k+ parts

$10.930

10,365

-

$12.980

$11.610

$10.930

Flip Electronics (Authorized)

USA . 6,000 parts In-Stock

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Verical

USA . 2,132 parts In-Stock

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$16.225

1k+ parts

$14.512

10k+ parts

$13.662

2,132

-

$16.225

$14.512

$13.662

Arrow

USA . 250 parts In-Stock

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-

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$12.150

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250

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$12.150

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Chip1Stop

Japan . 250 parts In-Stock

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$14.200

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250

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$14.200

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Avnet

USA . 15 parts In-Stock

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-

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$13.555

10k+ parts

$12.979

15

-

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$13.555

$12.979

Distributors (In-Stock)

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Digiode

USA . 611 parts In-Stock

1+ parts

$13.699

100+ parts

-

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611

$13.699

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DF Sales Co.

USA . 25 parts In-Stock

1+ parts

$14.000

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25

$14.000

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DF Sales Co.

USA . 25 parts In-Stock

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$14.000

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25

$14.000

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Vyrian

USA . 6,691 parts In-Stock

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Flip Electronics

USA . 6,000 parts In-Stock

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Velocity Electronics

USA . 194 parts In-Stock

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Inventory MP

USA . 100 parts In-Stock

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100

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Bristol Electronics

USA . 100 parts In-Stock

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100

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Distributors (Availability)

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Ampacity Inc.

Singapore . 2,985 parts In-Stock

1+ parts

$10.330

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$10.330

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Corohmni

South Africa . 338 parts In-Stock

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$12.440

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338

$12.440

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Corphita

USA . 794 parts In-Stock

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$12.978

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794

$12.978

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Microchip USA

USA . 2,362 parts In-Stock

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$48.852

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$48.852

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Continental Prestige Electronics

USA . 9,242 parts In-Stock

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Problanco Electronics

Mexico . 8,385 parts In-Stock

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SupplyDigital Components

Austria . 6,528 parts In-Stock

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TANS Electronics

Latvia . 4,805 parts In-Stock

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Kulean Microsystems

USA . 3,180 parts In-Stock

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Kepictronics

USA . 2,000 parts In-Stock

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Perfect Parts

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UHIMA Technologies

Türkiye . 11 parts In-Stock

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Overview

Discover the MC100LVEP210FAG Clock Drivers & Buffers by Onsemi, a top-quality product designed to enhance your electronic devices with precision and reliability. With a reputable manufacturer like Onsemi behind it, you can trust in the durability and performance of this component. Ideal for a wide range of applications, this clock driver offers fast propagation delay, differential input conditioning, and multiple functions in a compact square package. Elevate your projects with the value and benefits that the MC100LVEP210FAG brings, ensuring optimal functionality and efficiency every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and reliability to the product, making it suitable for various applications and environments.

Propagation Delay At Nominal Supply: 0.75 ns

The fast propagation delay ensures efficient operation and timely signal transmission, making this product ideal for high-speed applications.

Surface Mount: YES

Being surface mountable makes installation convenient and saves space, making it suitable for compact designs and PCB layouts.

Input Conditioning: DIFFERENTIAL

The use of differential input conditioning helps in reducing noise and improving signal integrity, making the product suitable for critical applications.

Nominal Supply Voltage / Vsup (V): 2.5

The nominal supply voltage of 2.5V provides a stable power source for the product, ensuring reliable performance within the specified voltage range.

Minimum Operating Temperature: -40 °C

The wide operating temperature range of -40 to 85°C allows the product to function effectively in various environmental conditions, making it versatile and reliable.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures proper soldering and reflow processes during manufacturing, contributing to product quality and reliability.

Moisture Sensitivity Level (MSL): 2

With a moisture sensitivity level of 2, the product is less prone to moisture-related damage, enhancing its durability and longevity in diverse operating environments.

Technical Specifications

Clock Drivers & Buffers MC100LVEP210FAG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -2.375V TO -3.8V

Family:

100LVE

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

S-PQFP-G32

JESD-609 Code:

e3

Length:

7 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

2

No. of Functions:

2

No. of Inverted Outputs:

0

No. of Terminals:

32

No. of True Outputs:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

+-2.375/+-3.8

Propagation Delay At Nominal Supply:

.75 ns

Propagation Delay (tpd):

.43 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.025 ns

Maximum Seated Height:

1.6 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.8 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

MC100LVEP210FAG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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