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MC100LVE210FNR2G

Onsemi

MC100LVE210FNR2G by Onsemi

MC100LVE210FNR2G clock driver by Onsemi features 0.75ns propagation delay, 3.3V nominal voltage, and -40 to 85°C operating temperature range. Ideal for industrial applications requiring differential input conditioning and quad terminal position in a square chip carrier package.

Median Price

$5.614

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 808 parts In-Stock

1+ parts

-

100+ parts

$4.990

1k+ parts

$4.460

10k+ parts

$4.200

808

-

$4.990

$4.460

$4.200

Verical

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$6.237

1k+ parts

$5.575

10k+ parts

$5.250

500

-

$6.237

$5.575

$5.250

Distributors (In-Stock)

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Digiode

USA . 148 parts In-Stock

1+ parts

$5.282

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148

$5.282

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Vyrian

USA . 3,204 parts In-Stock

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Sea View Technologies

USA . 514 parts In-Stock

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514

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Bristol Electronics

USA . 514 parts In-Stock

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514

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Distributors (Availability)

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Corphita

USA . 396 parts In-Stock

1+ parts

$5.004

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-

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396

$5.004

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Corohmni

South Africa . 350 parts In-Stock

1+ parts

$5.560

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350

$5.560

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Component Stockers USA

USA . 1,040 parts In-Stock

1+ parts

$5.670

100+ parts

$5.330

1k+ parts

-

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1,040

$5.670

$5.330

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Ampacity Inc.

Singapore . 688 parts In-Stock

1+ parts

$10.290

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$10.290

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AZTECH Wire

Italy . 654 parts In-Stock

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$12.830

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$12.830

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QUARKTWIN TECHNOLOGY LTD

USA . 13,605 parts In-Stock

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Kulean Microsystems

USA . 7,491 parts In-Stock

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SupplyDigital Components

Austria . 7,060 parts In-Stock

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TANS Electronics

Latvia . 4,065 parts In-Stock

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Problanco Electronics

Mexico . 1,922 parts In-Stock

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Continental Prestige Electronics

USA . 808 parts In-Stock

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$4.730

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808

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$4.730

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UHIMA Technologies

Türkiye . 594 parts In-Stock

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Microchip USA

USA . 336 parts In-Stock

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Overview

Enhance your electronic projects with the MC100LVE210FNR2G by Onsemi! As a leading manufacturer in the industry, Onsemi delivers top-quality clock drivers & buffers that offer exceptional performance and reliability. Ideal for applications requiring precise timing and signal synchronization, this chip carrier package is designed to meet industrial standards with a wide operating temperature range. With differential input conditioning and minimal propagation delay, this clock driver is perfect for demanding tasks where timing accuracy is crucial. Upgrade your projects with the MC100LVE210FNR2G today and experience the superior quality and value Onsemi products have to offer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and reliability for long-term use.

Propagation Delay At Nominal Supply: 0.75 ns

Ensures fast and efficient signal processing.

Surface Mount: YES

Allows for easy and compact integration onto circuit boards.

Input Conditioning: DIFFERENTIAL

Ensures accurate signal transmission and reception.

No. of Functions: 2

Provides multiple functions in a single device, saving space and cost.

Nominal Supply Voltage / Vsup (V): 3.3

Compatible with standard voltage requirements for many electronic devices.

Power Supplies (V): -3.3

Allows for dual power supply operation.

No. of Terminals: 28

Provides ample connection points for versatile applications.

Package Style (Meter): CHIP CARRIER

Offers a compact and efficient package design.

Minimum Operating Temperature: -40 °C

Suitable for use in extreme temperature conditions.

Technical Specifications

Clock Drivers & Buffers MC100LVE210FNR2G attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -3V TO -3.8V

Family:

100LVE

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e3

Length:

11.505 mm

Logic IC Type:

No. of Functions:

2

No. of Inverted Outputs:

0

No. of Terminals:

28

No. of True Outputs:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

-3.3

Propagation Delay At Nominal Supply:

.75 ns

Propagation Delay (tpd):

.9 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.075 ns

Maximum Seated Height:

4.57 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.8 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.505 mm

Trade Compliance

MC100LVE210FNR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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