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MC100EP139DWG

Onsemi

MC100EP139DWG by Onsemi

MC100EP139DWG clock driver by Onsemi features 1.1ns propagation delay, 3.3V nominal voltage, and 1500MHz min fmax. Ideal for industrial applications requiring differential input conditioning and 4 true outputs with ECL technology in a small outline package.

Median Price

$19.372

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

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Arrow

USA . 2 parts In-Stock

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$9.068

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Chip1Stop

Japan . 25 parts In-Stock

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$12.142

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$12.142

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Mouser Electronics

USA . 42 parts In-Stock

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$31.420

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$20.820

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$19.660

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42

$31.420

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$19.660

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DigiKey

USA . 39 parts In-Stock

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$31.420

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$23.375

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$21.468

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Rochester

USA . 11,833 parts In-Stock

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$19.310

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$17.280

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$16.260

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$16.260

Flip Electronics (Authorized)

USA . 7,790 parts In-Stock

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Verical

USA . 4,864 parts In-Stock

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$19.434

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Distributors (In-Stock)

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Digiode

USA . 1,979 parts In-Stock

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$11.535

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Flip Electronics

USA . 12,271 parts In-Stock

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Vyrian

USA . 4,829 parts In-Stock

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Pegasus Components GmbH

Germany . 145 parts In-Stock

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Semi Source

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Resion

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Elcom Components

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Distributors (Availability)

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Ampacity Inc.

Singapore . 3,937 parts In-Stock

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$10.320

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Corphita

USA . 1,017 parts In-Stock

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$10.928

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$10.928

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Corohmni

South Africa . 160 parts In-Stock

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$12.142

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Component Stockers USA

USA . 9,168 parts In-Stock

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$20.100

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$20.440

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$18.480

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$18.480

9,168

$20.100

$20.440

$18.480

$18.480

Microchip USA

USA . 2,905 parts In-Stock

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$72.700

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$71.440

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$70.810

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$70.170

2,905

$72.700

$71.440

$70.810

$70.170

QUARKTWIN TECHNOLOGY LTD

USA . 28,476 parts In-Stock

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Continental Prestige Electronics

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Lixinc

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TANS Electronics

Latvia . 6,936 parts In-Stock

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Problanco Electronics

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Authorized Procurement Solutions

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Kulean Microsystems

USA . 2,902 parts In-Stock

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SupplyDigital Components

Austria . 2,429 parts In-Stock

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UHIMA Technologies

Türkiye . 694 parts In-Stock

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Metaverse IC Inc.

Canada . 408 parts In-Stock

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GreenTree Electronics

Israel . 114 parts In-Stock

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Perfect Parts

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Kepictronics

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Overview

Enhance your clock signal distribution with the MC100EP139DWG by Onsemi. This high-quality Clock Driver & Buffer promises superior performance and reliability, thanks to Onsemi's reputation for top-notch manufacturing. Ideal for a variety of applications, this product offers fast propagation delay and precise output characteristics. Upgrade your system with the MC100EP139DWG and experience the value of smooth operation and enhanced efficiency in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the clock driver, ensuring long-term reliability.

Propagation Delay At Nominal Supply: 1.1 ns

The low propagation delay ensures fast signal transmission, making this clock driver suitable for high-speed applications.

Surface Mount: YES

Surface mount capability allows for easy and convenient integration onto circuit boards, saving space and simplifying assembly.

Input Conditioning: DIFFERENTIAL

Differential input conditioning helps to reduce noise and improve signal integrity, enabling accurate and reliable clock signal generation.

Nominal Supply Voltage / Vsup (V): 3.3

The 3.3V nominal supply voltage is a common standard in many electronic devices, making this clock driver compatible with a wide range of applications.

No. of Terminals: 20

Having 20 terminals allows for versatile connectivity options and compatibility with various circuit configurations.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance in demanding industrial environments.

Technical Specifications

Clock Drivers & Buffers MC100EP139DWG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -3V TO -5.5V

Family:

100E

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3

Length:

12.8 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

20

No. of True Outputs:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

OPEN-EMITTER

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

-3.0/-5.5/3.3/5.0

Propagation Delay At Nominal Supply:

1.1 ns

Propagation Delay (tpd):

.9 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.1 ns

Maximum Seated Height:

2.65 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Minimum fmax:

1500 MHz

Trade Compliance

MC100EP139DWG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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