Loading...

MC100EP139DTR2

Onsemi

MC100EP139DTR2 by Onsemi

MC100EP139DTR2 clock driver by Onsemi has 1.1 ns propagation delay, operates at -40 to 85 °C, and supports 3.3V nominal voltage. It is used in industrial applications requiring high-speed signal conditioning with differential inputs and ECL technology.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,053 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,053

-

-

-

-

Digiode

USA . 1,192 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,192

-

-

-

-

Prism Electronics

USA . 83 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

83

-

-

-

-

PC Components Company LLC

USA . 48 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

48

-

-

-

-

Bristol Electronics

USA . 48 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

48

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 568 parts In-Stock

1+ parts

$9.890

100+ parts

-

1k+ parts

-

10k+ parts

-

568

$9.890

-

-

-

Advanced Electronics

New Zealand . 450 parts In-Stock

1+ parts

$10.100

100+ parts

$9.191

1k+ parts

$8.282

10k+ parts

-

450

$10.100

$9.191

$8.282

-

Problanco Electronics

Mexico . 5,810 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,810

-

-

-

-

SupplyDigital Components

Austria . 5,306 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,306

-

-

-

-

TANS Electronics

Latvia . 2,674 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,674

-

-

-

-

Kulean Microsystems

USA . 2,468 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,468

-

-

-

-

Corohmni

South Africa . 499 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

499

-

-

-

-

Corphita

USA . 324 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

324

-

-

-

-

Microchip USA

USA . 133 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

133

-

-

-

-

Perfect Parts

USA . 93 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

93

-

-

-

-

UHIMA Technologies

Türkiye . 86 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

86

-

-

-

-

Overview

Experience next-level performance and reliability with the MC100EP139DTR2 clock driver by Onsemi. As a trusted manufacturer in the industry, Onsemi delivers top-quality products that are designed to enhance your applications in the Clock Drivers & Buffers category. With fast propagation delay and differential input conditioning, this product offers unparalleled precision and efficiency. Say goodbye to delays and errors with the MC100EP139DTR2, providing you with the value and benefits you need for optimal performance. Elevate your projects with this innovative solution today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection for the internal components of the clock driver & buffer, ensuring long-term reliability.

Propagation Delay At Nominal Supply: 1.1 ns

Fast propagation delay allows for efficient data transmission and synchronization within the circuit, crucial for high-performance applications.

Surface Mount: YES

Surface mount capability simplifies the assembly process and reduces overall space requirements, making it ideal for compact electronic designs.

Input Conditioning: DIFFERENTIAL

Differential input conditioning helps in reducing noise and improving signal integrity, ensuring accurate data processing in the system.

Nominal Supply Voltage / Vsup (V): 3.3

Operates efficiently at a standard voltage of 3.3V, making it compatible with a wide range of electronic systems and power supplies.

No. of True Outputs: 4

Having multiple true outputs allows for driving multiple components simultaneously, enhancing the productivity and versatility of the product.

Minimum fmax: 1000 MHz

With a high maximum frequency of 1000 MHz, this clock driver & buffer can support fast data processing speeds, suitable for high-speed communication systems.

Technical Specifications

Clock Drivers & Buffers MC100EP139DTR2 attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -3V TO -5.5V

Family:

100E

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Logic IC Type:

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

20

No. of True Outputs:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

-3.0/-5.5/3.3/5.0

Propagation Delay At Nominal Supply:

1.1 ns

Propagation Delay (tpd):

.9 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.1 ns

Maximum Seated Height:

1.2 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Minimum fmax:

1000 MHz

Trade Compliance

MC100EP139DTR2 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20