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KSC1730O

Onsemi

KSC1730O by Onsemi

KSC1730O by Onsemi is an NPN RF BJT transistor with a max VCEsat of 0.5V, ideal for amplifier applications in the UHF band. It has a min hFE of 70, max fT of 1100MHz, and can handle a max IC of 0.05A.

Median Price

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Lifecycle Status

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1k+

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Vyrian

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Digiode

USA . 1,268 parts In-Stock

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Problanco Electronics

Mexico . 4,805 parts In-Stock

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SupplyDigital Components

Austria . 3,028 parts In-Stock

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Supply Digital

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Corphita

USA . 2,222 parts In-Stock

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TANS Electronics

Latvia . 623 parts In-Stock

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Kulean Microsystems

USA . 222 parts In-Stock

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Corohmni

South Africa . 147 parts In-Stock

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UHIMA Technologies

Türkiye . 106 parts In-Stock

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Overview

Unlock the power of advanced technology with the KSC1730O RF Small Signal Bipolar Junction Transistor by Onsemi. As a trusted manufacturer in the industry, Onsemi delivers unparalleled quality and reliability in their products. This versatile NPN transistor is perfect for amplifier applications in the ultra-high frequency band, offering customers exceptional performance and efficiency. Experience seamless integration and superior functionality with the KSC1730O, a game-changer in the world of electronic components.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material for the package body, ensuring longevity and easy handling.

Polarity or Channel Type: NPN

NPN type allows for easy integration into various circuit designs and compatibility with common amplifier configurations.

Configuration: SINGLE

Simplified circuit design with a single transistor configuration, making it easy to implement in amplifier applications.

Transistor Application: AMPLIFIER

Specifically designed for amplifier applications, ensuring optimal performance in amplifying signals.

Maximum VCEsat: 0.5 V

Low saturation voltage helps in minimizing power losses and improving efficiency of the amplifier circuit.

Package Shape: ROUND

Round package shape facilitates easy mounting and handling, making it convenient for installation.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure connections and easy soldering, ensuring reliable performance in circuits.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Optimized for ultra high frequency applications, providing high-speed performance in signal processing.

No. of Terminals: 3

Simple 3-terminal design for easy integration into circuit boards and minimal complexity in wiring.

Maximum Power Dissipation (Abs): 0.25 W

Efficient power dissipation capability for reliable operation and thermal management in amplifier circuits.

Package Style (Meter): CYLINDRICAL

Cylindrical package style for compact and space-saving design, suitable for various amplifier applications.

Maximum Power Dissipation Ambient: 0.25 W

Ability to handle ambient power dissipation of 0.25 W, ensuring stable performance under varying environmental conditions.

Minimum DC Current Gain (hFE): 70

Minimum DC current gain of 70 ensures stable and consistent amplification of signals in the circuit.

Maximum Operating Temperature: 150 °C

Wide operating temperature range of up to 150 °C, allowing for reliable performance in various environments.

Maximum Collector-Base Capacitance: 1.5 pF

Low collector-base capacitance of 1.5 pF minimizes unwanted feedback and ensures high-frequency performance.

Maximum Collector-Emitter Voltage: 15 V

Maximum collector-emitter voltage of 15 V for safe operation and protection against voltage surges in the circuit.

Transistor Element Material: SILICON

Silicon material for the transistor element ensures high reliability, performance, and durability in amplifier applications.

Maximum Collector Current (IC): 0.05 A

Maximum collector current of 0.05 A allows for adequate current handling capacity in amplifier circuits.

Terminal Position: BOTTOM

Bottom terminal position for easy mounting and secure connections on circuit boards or PCBs.

Nominal Transition Frequency (fT): 1100 MHz

High nominal transition frequency of 1100 MHz ensures high-speed signal processing and fidelity in amplifier applications.

Technical Specifications

RF Small Signal Bipolar Junction Transistors (BJT) KSC1730O attributes and parameters. Explore more RF Small Signal Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Maximum Collector Current (IC):

Maximum Collector-Base Capacitance:

1.5 pF

Maximum Collector-Emitter Voltage:

15 V

Configuration:

Minimum DC Current Gain (hFE):

70

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JEDEC-95 Code:

TO-92

JESD-30 Code:

O-PBCY-T3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

CYLINDRICAL

Polarity or Channel Type:

NPN

Maximum Power Dissipation Ambient:

.25 W

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

BOTTOM

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Maximum VCEsat:

.5 V

Trade Compliance

KSC1730O Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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