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KSC1674O

Onsemi

KSC1674O by Onsemi

KSC1674O by Onsemi is an NPN RF BJT with a max VCEsat of 0.3V, ideal for amplifier applications in the UHF band. It has a min hFE of 70, max fT of 600MHz, and can handle a max IC of 0.02A.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 1,971 parts In-Stock

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Digiode

USA . 1,504 parts In-Stock

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Kulean Microsystems

USA . 8,058 parts In-Stock

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SupplyDigital Components

Austria . 4,847 parts In-Stock

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Problanco Electronics

Mexico . 3,426 parts In-Stock

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Corphita

USA . 3,037 parts In-Stock

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Supply Digital

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Assy Fe

Spain . 1,000 parts In-Stock

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TANS Electronics

Latvia . 885 parts In-Stock

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UHIMA Technologies

Türkiye . 658 parts In-Stock

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Corohmni

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Overview

Experience unparalleled performance with the KSC1674O by Onsemi. As a leader in RF Small Signal Bipolar Junction Transistors, Onsemi delivers top-quality products that guarantee reliability and efficiency. Ideal for amplifier applications in the ultra-high-frequency band, this NPN transistor offers a maximum VCEsat of 0.3V and a minimum DC current gain of 70. With a maximum operating temperature of 150 °C and a compact cylindrical package design, the KSC1674O provides unmatched value and performance for your electronic projects. Choose Onsemi for superior quality and innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the transistor, making it suitable for a variety of applications.

Polarity or Channel Type: NPN

NPN transistors are commonly used in amplification circuits, making this transistor suitable for amplifier applications.

Configuration: SINGLE

This single configuration simplifies circuit design and makes it easier to integrate into electronic devices.

Maximum VCEsat: 0.3 V

The low VCEsat value indicates efficient power usage and minimal voltage drop when the transistor is in saturation mode.

Package Shape: ROUND

The round package shape allows for easy mounting and installation in electronic circuits.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

This transistor is designed to operate in the ultra high frequency band, making it suitable for high-performance RF applications.

Maximum Power Dissipation (Abs): 0.25 W

With a maximum power dissipation of 0.25 W, this transistor can handle moderate power levels without overheating.

No. of Terminals: 3

The 3 terminals provide connectivity for input, output, and biasing, allowing for versatile circuit configurations.

Minimum DC Current Gain (hFE): 70

The high DC current gain of 70 ensures reliable and consistent amplification performance.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150 °C, this transistor can withstand high temperature environments.

Maximum Collector-Base Capacitance: 1.2 pF

The low collector-base capacitance reduces the risk of signal distortion and interference in RF applications.

Maximum Collector-Emitter Voltage: 20 V

The 20V collector-emitter voltage rating allows for safe operation in low voltage circuits.

Maximum Collector Current (IC): 0.02 A

The maximum collector current of 0.02 A enables the transistor to handle moderate current levels for amplification.

Nominal Transition Frequency (fT): 600 MHz

The high transition frequency of 600 MHz indicates fast switching speeds and high frequency performance.

Technical Specifications

RF Small Signal Bipolar Junction Transistors (BJT) KSC1674O attributes and parameters. Explore more RF Small Signal Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Maximum Collector Current (IC):

Maximum Collector-Base Capacitance:

1.2 pF

Maximum Collector-Emitter Voltage:

20 V

Configuration:

Minimum DC Current Gain (hFE):

70

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JEDEC-95 Code:

TO-92

JESD-30 Code:

O-PBCY-T3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

CYLINDRICAL

Polarity or Channel Type:

NPN

Maximum Power Dissipation Ambient:

.25 W

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

BOTTOM

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Maximum VCEsat:

.3 V

Trade Compliance

KSC1674O Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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