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BFP405FH6327XTSA1

Infineon Technologies

BFP405FH6327XTSA1 by Infineon Technologies

BFP405FH6327XTSA1 by Infineon Technologies is a NPN RF BJT with built-in diode, ideal for amplifier applications in L Band. Featuring 4 terminals, it has a max fT of 25 GHz and VCE of 4.5V. This small outline transistor has a collector current of 0.012A and low capacitance at 0.1pF, meeting AEC-Q101 standards.

Median Price

$0.166

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 4,696 parts In-Stock

1+ parts

$0.277

100+ parts

$0.162

1k+ parts

-

10k+ parts

$0.134

4,696

$0.277

$0.162

-

$0.134

Rochester

USA . 700,261 parts In-Stock

1+ parts

-

100+ parts

$0.173

1k+ parts

$0.143

10k+ parts

$0.128

700,261

-

$0.173

$0.143

$0.128

Verical

USA . 192,731 parts In-Stock

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$0.160

192,731

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$0.160

RS (Exports)

UK . 6,000 parts In-Stock

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$0.124

6,000

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$0.124

DigiKey

USA . 190 parts In-Stock

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190

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Chip1Stop

Japan . 4 parts In-Stock

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4

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Digiode

USA . 399 parts In-Stock

1+ parts

$0.134

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-

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399

$0.134

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Nova Conductors

Japan . 10 parts In-Stock

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$0.197

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10

$0.197

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Vyrian

USA . 4,048 parts In-Stock

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VNN

France . 1,189 parts In-Stock

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Bristol Electronics

USA . 202 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 127,825 parts In-Stock

1+ parts

$0.105

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127,825

$0.105

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Semicontronic

India . 127,524 parts In-Stock

1+ parts

$0.105

100+ parts

$0.102

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$0.102

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127,524

$0.105

$0.102

$0.102

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Corphita

USA . 904 parts In-Stock

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$0.127

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904

$0.127

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Argo Parts USA

USA . 756 parts In-Stock

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$0.197

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$0.191

756

$0.197

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$0.191

Netroflash

USA . 500 parts In-Stock

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$0.197

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$0.193

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500

$0.197

$0.193

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Continental Prestige Electronics

USA . 2,805 parts In-Stock

1+ parts

$0.418

100+ parts

$0.215

1k+ parts

$0.141

10k+ parts

$0.121

2,805

$0.418

$0.215

$0.141

$0.121

Modulus Dynamics

Lithuania . 8,814 parts In-Stock

1+ parts

$0.779

100+ parts

$0.748

1k+ parts

$0.717

10k+ parts

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8,814

$0.779

$0.748

$0.717

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Aztec Data Supply Inc.

USA . 1,681 parts In-Stock

1+ parts

$1.744

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1,681

$1.744

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Corohmni

South Africa . 316 parts In-Stock

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$1.891

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316

$1.891

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QUARKTWIN TECHNOLOGY LTD

USA . 7,146 parts In-Stock

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Perfect Parts

USA . 3,220 parts In-Stock

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Microchip USA

USA . 1,705 parts In-Stock

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1,705

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Overview

Unlock the power of seamless connectivity with the BFP405FH6327XTSA1 by Infineon Technologies. Crafted with precision and expertise, this RF Small Signal Bipolar Junction Transistor offers unparalleled performance and reliability for amplifier applications in the L Band. With a single configuration and built-in diode, this transistor delivers exceptional value and benefits to customers seeking top-notch quality and efficiency. Discover the advantages of Infineon's cutting-edge technology and elevate your projects to new heights with the BFP405FH6327XTSA1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the transistor, ensuring a longer lifespan and reliable performance.

Polarity or Channel Type: NPN

NPN transistors are commonly used in amplification circuits, making this transistor suitable for amplifier applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode simplifies circuit design and can offer additional functionality in certain applications.

Transistor Application: AMPLIFIER

Designed specifically for amplification tasks, ensuring optimal performance in amplifier circuits.

Surface Mount: YES

Allows for easy integration onto circuit boards, saving space and facilitating mass production.

Package Shape: RECTANGULAR

Rectangular shape provides efficient use of space on circuit boards, contributing to overall compactness of electronic devices.

Transistor Element Material: SILICON

Silicon is a common semiconductor material known for its reliability and performance in electronic components.

Nominal Transition Frequency (fT): 25000 MHz

High transition frequency allows for high-speed operation, making the transistor suitable for applications requiring fast signal processing.

Technical Specifications

RF Small Signal Bipolar Junction Transistors (BJT) BFP405FH6327XTSA1 attributes and parameters. Explore more RF Small Signal Bipolar Junction Transistors (BJT) devices from Infineon Technologies

Specs

Additional Features:

HIGH RELIABILITY

Maximum Collector Current (IC):

Maximum Collector-Base Capacitance:

.1 pF

Maximum Collector-Emitter Voltage:

4.5 V

Highest Frequency Band:

L BAND

JESD-30 Code:

R-PDSO-F4

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

4

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

NPN

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

FLAT

Terminal Position:

DUAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Trade Compliance

BFP405FH6327XTSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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