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BFT92E6327

Infineon Technologies

BFT92E6327 by Infineon Technologies

BFT92E6327 by Infineon Technologies is a PNP RF BJT transistor with a max operating temperature of 150°C. It has a min DC current gain of 15 and a nominal transition frequency of 5000 MHz, making it suitable for amplifier applications in the L Band. This surface-mount transistor features a small outline package with gull wing terminals and can handle up to 0.025 A collector current.

Median Price

$0.809

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Adafruit Industries

USA . 600 parts In-Stock

1+ parts

$0.809

100+ parts

$0.768

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$0.768

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600

$0.809

$0.768

$0.768

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Distributors (In-Stock)

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Digiode

USA . 434 parts In-Stock

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$0.769

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434

$0.769

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Chip Stock

USA . 14,500 parts In-Stock

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14,500

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VNN

France . 4,361 parts In-Stock

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Vyrian

USA . 353 parts In-Stock

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Mil-Aero Solutions, Inc.

USA . 37 parts In-Stock

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37

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Nova Conductors

Japan . 10 parts In-Stock

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ComSIT Distribution GmbH

Germany . 6 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 163 parts In-Stock

1+ parts

$0.652

100+ parts

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163

$0.652

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Ampacity Inc.

Singapore . 290 parts In-Stock

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$0.690

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290

$0.690

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Corphita

USA . 769 parts In-Stock

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$0.728

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769

$0.728

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Advanced Electronics

New Zealand . 600 parts In-Stock

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$0.809

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$0.768

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$0.768

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600

$0.809

$0.768

$0.768

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Aztec Data Supply Inc.

USA . 107 parts In-Stock

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$0.883

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107

$0.883

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Modulus Dynamics

Lithuania . 13,228 parts In-Stock

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$1.322

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$1.269

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$1.216

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13,228

$1.322

$1.269

$1.216

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Semicontronic

India . 425 parts In-Stock

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$1.500

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$1.462

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$1.455

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425

$1.500

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$1.455

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AZTECH Wire

Italy . 358 parts In-Stock

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$6.100

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Andel Nordic

Denmark . 5,338 parts In-Stock

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$31.100

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$21.771

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$21.771

5,338

$31.100

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$21.771

Component Stockers USA

USA . 227 parts In-Stock

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$99.990

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227

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A-Z Elektronik GmbH

Germany . 6,947 parts In-Stock

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Assy Fe

Spain . 5,095 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,631 parts In-Stock

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Continental Prestige Electronics

USA . 1,054 parts In-Stock

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Bastille Electronics

Australia . 300 parts In-Stock

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Perfect Parts

USA . 136 parts In-Stock

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Argo Parts USA

USA . 110 parts In-Stock

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Overview

Elevate your RF amplifier performance with the BFT92E6327 by Infineon Technologies. Crafted with precision and expertise, this RF Small Signal Bipolar Junction Transistor offers unparalleled quality and reliability. Ideal for applications in the L Band, this PNP transistor provides superior amplification capabilities without compromising on power dissipation. Whether you're looking to enhance your communication systems or elevate your audio equipment, the BFT92E6327 delivers exceptional value and performance. Trust in Infineon Technologies to provide you with cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy package body material makes the transistor lightweight and cost-effective.

Polarity or Channel Type: PNP

The PNP polarity makes it suitable for amplification applications in electronic circuits.

Configuration: SINGLE

Single configuration simplifies the circuit design and makes it easier to integrate into existing systems.

Transistor Application: AMPLIFIER

Designed specifically for amplifier applications, ensuring optimal performance in signal amplification.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards.

Package Shape: RECTANGULAR

Rectangular package shape provides a compact form factor for space-constrained applications.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering onto PCBs, enhancing the reliability of connections.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, the transistor can withstand demanding operating conditions.

Minimum Operating Temperature: -65 °C

The wide temperature range ensures the transistor's functionality in various environmental conditions.

Nominal Transition Frequency (fT): 5000 MHz

High transition frequency allows for fast switching speeds, making this transistor ideal for high-frequency applications.

Technical Specifications

RF Small Signal Bipolar Junction Transistors (BJT) BFT92E6327 attributes and parameters. Explore more RF Small Signal Bipolar Junction Transistors (BJT) devices from Infineon Technologies

Specs

Maximum Collector Current (IC):

Maximum Collector-Base Capacitance:

.8 pF

Maximum Collector-Emitter Voltage:

15 V

Configuration:

Minimum DC Current Gain (hFE):

15

Highest Frequency Band:

L BAND

JESD-30 Code:

R-PDSO-G3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-65 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

PNP

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Trade Compliance

BFT92E6327 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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