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MMBT918

Onsemi

MMBT918 by Onsemi

MMBT918 by Onsemi is a NPN RF BJT transistor with a max fT of 600 MHz. It has a max IC of 0.05 A and hFE of 20, ideal for amplifier applications in the VHF band. This small outline package with gull wing terminals operates up to 150 °C, making it suitable for high-frequency amplification needs.

Median Price

$0.137

Lifecycle Status

Suppliers In-Stock

26

In-Stock Inventory

1k+

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Rochester

USA . 2,650 parts In-Stock

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DigiKey

USA . 2,154 parts In-Stock

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$0.249

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Digiode

USA . 2,773 parts In-Stock

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Vyrian

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Forefront Electronics and Design

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ComSIT Distribution GmbH

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Bristol Electronics

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Pride Electronics

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Voyager Components

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Atlantic Semiconductor

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Electro Mavin

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Mil-Aero Solutions, Inc.

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Anansix

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First Choice Components Inc.

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Semi Source

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DigiKey Marketplace

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ACDS - Activité Composants Distribution Service

France . 2,108 parts In-Stock

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Resion

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Prism Electronics

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American Microsemiconductor Inc.

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Connector Distribution Corp

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Right Parts Inc.

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Electronic Expediters

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MISTER SPROCKETS

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Corphita

USA . 3,521 parts In-Stock

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Corohmni

South Africa . 81 parts In-Stock

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RC Electronics

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Metaverse IC Inc.

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QUARKTWIN TECHNOLOGY LTD

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A-Z Elektronik GmbH

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Cyclops Electronics Ltd (Excess)

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Kulean Microsystems

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Problanco Electronics

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SupplyDigital Components

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GreenTree Electronics

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TANS Electronics

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UHIMA Technologies

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Glotronic Ltd.

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Overview

Elevate your RF signal amplification with the MMBT918 by Onsemi – a top-tier manufacturer known for excellence in small signal BJT transistors. This NPN transistor, designed for very high frequency bands, comes in a compact plastic/epoxy package that is perfect for surface mount applications. With a minimum DC current gain of 20 and a nominal transition frequency of 600 MHz, this transistor offers superior performance and reliability. Whether you are working on amplifier circuits or other high-frequency applications, the MMBT918 provides the value, benefits, and advantages you need to take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the transistor easy to handle and resistant to environmental factors.

Polarity or Channel Type: NPN

NPN transistors are commonly used in amplification circuits, making this transistor suitable for amplifier applications.

Configuration: SINGLE

SINGLE configuration simplifies circuit design and integration, making the transistor easy to use.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and effort during manufacturing.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this transistor can withstand elevated temperatures without compromising performance.

Maximum Collector-Emitter Voltage: 15 V

The high maximum collector-emitter voltage rating ensures reliable operation and protection against voltage spikes.

Maximum Collector Current (IC): 0.05 A

The high collector current rating allows the transistor to handle large currents, making it suitable for a variety of applications.

Nominal Transition Frequency (fT): 600 MHz

With a high transition frequency, this transistor can amplify signals up to 600 MHz, making it ideal for high-frequency applications.

Technical Specifications

RF Small Signal Bipolar Junction Transistors (BJT) MMBT918 attributes and parameters. Explore more RF Small Signal Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Maximum Collector Current (IC):

Maximum Collector-Base Capacitance:

3 pF

Maximum Collector-Emitter Voltage:

15 V

Configuration:

Minimum DC Current Gain (hFE):

20

Highest Frequency Band:

VERY HIGH FREQUENCY BAND

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

NPN

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Trade Compliance

MMBT918 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

NSN

5961-01-251-3545, 5961012513545

NIIN

012513545

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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