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BF240RLRA

Onsemi

BF240RLRA by Onsemi

BF240RLRA by Onsemi is an NPN RF BJT transistor with a max collector-emitter voltage of 40V and max operating temp of 150 °C. Ideal for amplifier applications, it has a fT of 600MHz and low collector-base capacitance at 0.34pF.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 1,975 parts In-Stock

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Vyrian

USA . 912 parts In-Stock

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SupplyDigital Components

Austria . 7,321 parts In-Stock

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Kulean Microsystems

USA . 5,392 parts In-Stock

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Corphita

USA . 1,875 parts In-Stock

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Northwest PG Solutions

USA . 1,737 parts In-Stock

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TANS Electronics

Latvia . 1,383 parts In-Stock

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Problanco Electronics

Mexico . 658 parts In-Stock

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Native Components

USA . 417 parts In-Stock

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UHIMA Technologies

Türkiye . 363 parts In-Stock

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Corohmni

South Africa . 218 parts In-Stock

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Overview

Unleash the power of innovation with the BF240RLRA by Onsemi. As a leading manufacturer in the industry, Onsemi consistently delivers top-notch quality products, and this RF Small Signal Bipolar Junction Transistor is no exception. Perfect for amplifier applications, this NPN transistor offers exceptional performance and reliability. With a maximum operating temperature of 150 °C and a nominal transition frequency of 600 MHz, the BF240RLRA provides unparalleled value and benefits to our customers. Upgrade your projects with the best in the business - choose Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material that can withstand harsh environments and prolong the lifespan of the transistor.

Polarity or Channel Type: NPN

Commonly used type of bipolar junction transistor that allows for high efficiency in amplification applications.

Configuration: SINGLE

Simplified design with only one transistor, making it easy to integrate into circuits.

Transistor Application: AMPLIFIER

Specifically designed for amplification purposes, ensuring high performance in signal processing.

Maximum Operating Temperature: 150 °C

Can operate at higher temperatures without compromising performance, ideal for demanding applications.

Maximum Collector-Base Capacitance: 0.34 pF

Low capacitance minimizes signal distortion and improves high-frequency response.

Maximum Collector-Emitter Voltage: 40 V

Adequate voltage rating for a wide range of applications, ensuring reliable operation.

Maximum Collector Current (IC): 0.025 A

Sufficient current handling capability for small signal amplification tasks.

Nominal Transition Frequency (fT): 600 MHz

High transition frequency enables fast signal processing, suitable for high-frequency applications.

Technical Specifications

RF Small Signal Bipolar Junction Transistors (BJT) BF240RLRA attributes and parameters. Explore more RF Small Signal Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Maximum Collector Current (IC):

Maximum Collector-Base Capacitance:

.34 pF

Maximum Collector-Emitter Voltage:

40 V

Configuration:

JEDEC-95 Code:

TO-92

JESD-30 Code:

O-PBCY-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

CYLINDRICAL

Polarity or Channel Type:

NPN

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

BOTTOM

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Trade Compliance

BF240RLRA Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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