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BF240RLRE

Onsemi

BF240RLRE by Onsemi

BF240RLRE by Onsemi is an NPN RF BJT transistor with a max collector-emitter voltage of 40V and a max operating temperature of 150 °C. It is commonly used as an amplifier in various applications due to its high transition frequency of 600MHz and low collector current of 0.025A.

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Vyrian

USA . 323 parts In-Stock

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Digiode

USA . 105 parts In-Stock

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Native Components

USA . 870 parts In-Stock

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$0.275

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$0.264

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Northwest PG Solutions

USA . 1,108 parts In-Stock

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$0.303

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$0.267

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Problanco Electronics

Mexico . 7,396 parts In-Stock

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SupplyDigital Components

Austria . 3,984 parts In-Stock

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Kulean Microsystems

USA . 2,729 parts In-Stock

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Corphita

USA . 1,451 parts In-Stock

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TANS Electronics

Latvia . 961 parts In-Stock

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UHIMA Technologies

Türkiye . 181 parts In-Stock

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Corohmni

South Africa . 131 parts In-Stock

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Overview

Unlock the full potential of your RF applications with the BF240RLRE by Onsemi. Crafted with precision and expertise, this NPN amplifier transistor offers unparalleled performance and reliability. Whether you're looking to enhance your signal amplification or improve the efficiency of your electronic devices, this product delivers unmatched value and benefits. Trust in Onsemi's reputation for excellence and take your projects to the next level with the BF240RLRE.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the transistor, making it suitable for various operating conditions.

Polarity or Channel Type: NPN

The NPN configuration allows for easy integration into existing circuit designs and provides reliable performance in amplifier applications.

Configuration: SINGLE

The single configuration simplifies circuit design and ensures ease of use for applications requiring a single transistor.

Transistor Application: AMPLIFIER

Designed specifically for amplifier applications, this transistor provides high performance and efficiency in signal amplification.

Package Shape: ROUND

The round package shape allows for easy mounting and integration into circuit boards, making it a versatile choice for various applications.

Terminal Form: THROUGH-HOLE

The through-hole terminal form offers secure connections and easy soldering, ensuring reliable performance in circuit design.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150 °C, this transistor can withstand high temperature environments, making it suitable for various industrial applications.

Maximum Collector-Base Capacitance: 0.34 pF

The low collector-base capacitance of 0.34 pF ensures minimal signal distortion and high-frequency performance in amplifier circuits.

Maximum Collector-Emitter Voltage: 40 V

The maximum collector-emitter voltage of 40 V allows for safe and reliable operation in a wide range of voltage applications.

Transistor Element Material: SILICON

The silicon material used in the transistor element provides high conductivity and reliability, ensuring long-term performance in amplifier circuits.

Maximum Collector Current (IC): 0.025 A

With a maximum collector current of 0.025 A, this transistor can handle moderate current loads in amplifier applications.

Terminal Finish: TIN LEAD

The tin lead terminal finish offers excellent solderability and durability, ensuring reliable connections and long-term performance.

Terminal Position: BOTTOM

The bottom terminal position simplifies circuit layout and ensures easy mounting on circuit boards, making it a convenient choice for designers.

Nominal Transition Frequency (fT): 600 MHz

With a nominal transition frequency of 600 MHz, this transistor offers high-speed switching and amplification, making it suitable for high-frequency applications.

Technical Specifications

RF Small Signal Bipolar Junction Transistors (BJT) BF240RLRE attributes and parameters. Explore more RF Small Signal Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Maximum Collector Current (IC):

Maximum Collector-Base Capacitance:

.34 pF

Maximum Collector-Emitter Voltage:

40 V

Configuration:

JEDEC-95 Code:

TO-92

JESD-30 Code:

O-PBCY-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

CYLINDRICAL

Polarity or Channel Type:

NPN

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

BOTTOM

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Trade Compliance

BF240RLRE Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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