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MMBTH81LT3

Onsemi

MMBTH81LT3 by Onsemi

The Onsemi MMBTH81LT3 is a PNP RF BJT with 600 MHz fT, 20V VCEO, and 0.85pF CCB. Ideal for UHF applications, it features a Gull Wing terminal form in a small outline package. Suitable for high-frequency designs requiring compact size and low capacitance.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

Distributors (In-Stock)

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Vyrian

USA . 698 parts In-Stock

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698

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Digiode

USA . 259 parts In-Stock

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259

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Kulean Microsystems

USA . 8,322 parts In-Stock

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8,322

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SupplyDigital Components

Austria . 6,274 parts In-Stock

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Problanco Electronics

Mexico . 3,981 parts In-Stock

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3,981

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TANS Electronics

Latvia . 1,249 parts In-Stock

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1,249

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UHIMA Technologies

Türkiye . 639 parts In-Stock

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639

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Corphita

USA . 380 parts In-Stock

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380

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Corohmni

South Africa . 150 parts In-Stock

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Overview

Unleash the power of innovation with the MMBTH81LT3 by Onsemi. As a leading manufacturer in RF Small Signal Bipolar Junction Transistors (BJT), Onsemi delivers top-notch quality and reliability. This PNP transistor is perfect for applications in the ultra-high frequency band. Experience seamless performance with its single configuration and gull wing terminal form. Elevate your projects with the MMBTH81LT3 and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides good insulation and protection for the transistor, making it durable and reliable.

Polarity or Channel Type: PNP

PNP type transistors are commonly used in amplifier circuits, making this transistor suitable for various applications.

Configuration: SINGLE

Single configuration transistors are easy to implement and troubleshoot in circuits.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly.

Package Shape: RECTANGULAR

Rectangular shape makes it easy to align and place the transistor on the PCB.

Terminal Form: GULL WING

Gull wing terminals provide better mechanical strength and reliability during PCB assembly and soldering.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Ultra high frequency band is suitable for high-speed and high-frequency applications.

No. of Terminals: 3

Three terminals provide the necessary connections for the transistor to function effectively in a circuit.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB and allows for high-density circuit designs.

Maximum Collector-Base Capacitance: 0.85 pF

Low collector-base capacitance helps in achieving high-frequency performance and stability in the circuit.

Maximum Collector-Emitter Voltage: 20 V

With a maximum collector-emitter voltage of 20V, this transistor can be used in low voltage applications with safety margin.

Transistor Element Material: SILICON

Silicon material offers good performance characteristics such as low leakage and high gain, making it ideal for small signal applications.

Terminal Finish: TIN LEAD

Tin lead finish provides good solderability and prevents oxidation of the terminals.

Terminal Position: DUAL

Dual terminal position allows for easy mounting and connection in the circuit.

Nominal Transition Frequency (fT): 600 MHz

High transition frequency of 600 MHz enables high-speed switching and amplification in the circuit.

Technical Specifications

RF Small Signal Bipolar Junction Transistors (BJT) MMBTH81LT3 attributes and parameters. Explore more RF Small Signal Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Maximum Collector-Base Capacitance:

.85 pF

Maximum Collector-Emitter Voltage:

20 V

Configuration:

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JEDEC-95 Code:

TO-236AB

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

PNP

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Trade Compliance

MMBTH81LT3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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