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BFR99A

STMicroelectronics

BFR99A by STMicroelectronics

BFR99A by STMicroelectronics is a PNP RF small signal BJT designed for amplifier applications. It features a max power dissipation of 0.36 W, operates at frequencies up to 2300 MHz, and withstands temperatures up to 200 °C. Its cylindrical metal package ensures durability in ultra-high frequency environments.

Median Price

$8.810

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,203 parts In-Stock

1+ parts

$8.810

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1,203

$8.810

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Anansix

USA . 1,535 parts In-Stock

1+ parts

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1,535

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Digiode

USA . 1,492 parts In-Stock

1+ parts

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1,492

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Fibra_Brandt Electronic GMBH

Germany . 20 parts In-Stock

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20

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 483 parts In-Stock

1+ parts

$0.298

100+ parts

-

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-

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$0.286

483

$0.298

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-

$0.286

Northwest PG Solutions

USA . 1,030 parts In-Stock

1+ parts

$0.328

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$0.289

1,030

$0.328

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$0.289

IDEA Electronic Components Group

UK . 705 parts In-Stock

1+ parts

$0.617

100+ parts

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$0.556

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705

$0.617

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$0.556

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MKK Technologies

India . 920 parts In-Stock

1+ parts

$1.161

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920

$1.161

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DigiPath Technology Company

USA . 920 parts In-Stock

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$1.161

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920

$1.161

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Assy Fe

Spain . 8,915 parts In-Stock

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8,915

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Corphita

USA . 2,012 parts In-Stock

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2,012

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Parana Technologies

USA . 664 parts In-Stock

1+ parts

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100+ parts

$0.738

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664

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$0.738

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Overview

Elevate your projects with the BFR99A from STMicroelectronics, a trusted leader in semiconductor innovation. This high-performance PNP RF small signal transistor is designed for optimal amplification in ultra-high frequency applications, ensuring exceptional reliability and efficiency. Its robust metal package and superior thermal performance make it ideal for demanding environments. Unlock new possibilities in communication systems with the quality and precision that only STMicroelectronics can deliver.

Feature Benefit Bullets

Package Body Material: METAL

The metal package provides excellent thermal conductivity, aiding in heat dissipation and enhancing reliability.

Polarity or Channel Type: PNP

PNP transistors are ideal for high-performance applications, allowing for better signal control and amplification.

Configuration: SINGLE

A single configuration simplifies circuit design, making it easier to integrate into various applications.

Transistor Application: AMPLIFIER

Optimized for amplification, making it a perfect choice for audio and radio frequency applications.

Package Shape: ROUND

The round shape allows for efficient use of board space and helps with consistent heat distribution.

Terminal Form: WIRE

Wire terminals facilitate easy handling and soldering, accommodating various assembly techniques.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

This capability is crucial for modern communication systems, allowing for high-speed signal transmission.

No. of Terminals: 4

Having four terminals enhances the connection options, providing greater flexibility in circuit design.

Maximum Power Dissipation (Abs): 0.36 W

A maximum power dissipation of 0.36 W ensures the transistor can handle significant workloads without overheating.

Package Style (Meter): CYLINDRICAL

The cylindrical package style is compact and provides better mechanical stability during operation.

Minimum DC Current Gain (hFE): 25

A minimum hFE of 25 guarantees adequate amplification, vital for ensuring a strong output signal.

Maximum Operating Temperature: 200 °C

Withstand high temperatures up to 200 °C, making it suitable for demanding environments.

Maximum Collector-Emitter Voltage: 25 V

The ability to handle up to 25 V enhances its versatility across different circuit designs.

Transistor Element Material: SILICON

Silicon transistors are known for their reliability and efficiency in a wide range of applications.

Maximum Collector Current (IC): 0.05 A

Supports a collector current of 0.05 A, ensuring it can perform effectively in small-signal environments.

Terminal Finish: TIN LEAD

Tin lead finish provides excellent solderability, which contributes to long-term stability in connections.

Terminal Position: BOTTOM

Bottom terminals allow for compact placement on PCBs, optimizing space and layout efficiency.

Nominal Transition Frequency (fT): 2300 MHz

A high transition frequency of 2300 MHz ensures excellent performance in RF applications, offering low distortion and high gain.

Technical Specifications

RF Small Signal Bipolar Junction Transistors (BJT) BFR99A attributes and parameters. Explore more RF Small Signal Bipolar Junction Transistors (BJT) devices from STMicroelectronics

Specs

Additional Features:

LOW NOISE

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

25 V

Configuration:

Minimum DC Current Gain (hFE):

25

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JEDEC-95 Code:

TO-72

JESD-30 Code:

O-MBCY-W4

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

4

Maximum Operating Temperature:

200 Cel

Package Body Material:

METAL

Package Shape:

ROUND

Package Style (Meter):

CYLINDRICAL

Polarity or Channel Type:

PNP

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

WIRE

Terminal Position:

BOTTOM

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Trade Compliance

BFR99A Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

NSN

5961-99-882-1197, 5961998821197

NIIN

998821197

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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