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BFR93A,215

NXP Semiconductors

BFR93A,215 by NXP Semiconductors

NXP Semiconductors' BFR93A,215 is a NPN RF BJT transistor with max. freq. of 6000 MHz and hFE of 40, ideal for L Band applications like amplifiers. It has a max. power dissipation of 0.35 W, operates up to 175°C, and features a small outline package with gull wing terminals for surface mount assembly.

Median Price

$1.000

Lifecycle Status

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15

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1k+

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Nova Conductors

Japan . 50 parts In-Stock

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$0.117

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DF Sales Co.

USA . 1,980 parts In-Stock

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$1.000

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DF Sales Co.

USA . 1,980 parts In-Stock

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Vyrian

USA . 5,729 parts In-Stock

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Cyclops Electronics Ltd

UK . 2,902 parts In-Stock

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A&K Electronics

USA . 1,980 parts In-Stock

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Rotakorn

Sweden . 1,980 parts In-Stock

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Bristol Electronics

USA . 1,980 parts In-Stock

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Digiode

USA . 1,820 parts In-Stock

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Anansix

USA . 1,631 parts In-Stock

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VNN

France . 1,503 parts In-Stock

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ComSIT Distribution GmbH

Germany . 1,236 parts In-Stock

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Ashlea Components Ltd

UK . 117 parts In-Stock

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Cogito LLC

Ukraine . 15 parts In-Stock

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Prism Electronics

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Distributors (Availability)

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Continental Prestige Electronics

USA . 4,056 parts In-Stock

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$0.117

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$0.115

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Argo Parts USA

USA . 2,863 parts In-Stock

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$0.117

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$0.113

2,863

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Corohmni

South Africa . 175 parts In-Stock

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$0.338

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Advanced Electronics

New Zealand . 101 parts In-Stock

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$1.192

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$1.132

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Aztec Data Supply Inc.

USA . 148 parts In-Stock

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$1.840

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AZTECH Wire

Italy . 626 parts In-Stock

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Semicontronic

India . 508 parts In-Stock

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$47.050

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$45.874

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$45.638

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One Stop Electronics

USA . 843 parts In-Stock

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Perfect Parts

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QUARKTWIN TECHNOLOGY LTD

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Microchip USA

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GreenTree Electronics

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UNI Independent Distributors

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Authorized Procurement Solutions

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Corphita

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Netroflash

USA . 100 parts In-Stock

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Overview

Enhance your electronic projects with the BFR93A,215 from NXP Semiconductors. As a leading manufacturer in the industry, NXP delivers top-quality RF Small Signal Bipolar Junction Transistors. This versatile NPN transistor is perfect for amplifier applications in the L Band frequency range. With its small outline package and high transition frequency of 6000 MHz, this transistor offers excellent performance and reliability. Trust NXP Semiconductors to provide the cutting-edge technology you need for your next project. Elevate your designs with the BFR93A,215 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and resistance to environmental factors, making this transistor suitable for a wide range of applications.

Polarity or Channel Type: NPN

NPN transistors are commonly used for amplification and switching applications, enhancing the versatility of this product.

Configuration: SINGLE

A single configuration simplifies circuit designs, making this transistor easy to integrate into various electronic systems.

Transistor Application: AMPLIFIER

Designed specifically for amplification, this transistor ensures optimal performance in amplifier circuits.

Surface Mount: YES

The surface-mount capability allows for easy and efficient installation on circuit boards, saving space and reducing assembly time.

Package Shape: RECTANGULAR

The rectangular shape of the package provides stability and ease of placement in electronic circuits.

Terminal Form: GULL WING

The gull wing terminals offer secure connections and facilitate soldering, ensuring a reliable electrical connection.

Highest Frequency Band: L BAND

With a high frequency band coverage, this transistor is ideal for applications in the L band range.

No. of Elements: 1

The single-element design simplifies circuit layouts and provides consistent performance in a variety of setups.

No. of Terminals: 3

The three terminals offer flexibility in connection options and ensure compatibility with different circuit configurations.

Maximum Power Dissipation (Abs): 0.35 W

The high power dissipation capability allows this transistor to handle demanding applications without overheating.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on circuit boards, making this transistor suitable for compact electronic designs.

Maximum Power Dissipation Ambient: 0.3 W

With a high ambient power dissipation rating, this transistor can operate efficiently in various environmental conditions.

Minimum DC Current Gain (hFE): 40

The minimum DC current gain ensures consistent amplification performance and reliable signal processing.

Maximum Operating Temperature: 175 °C

The high operating temperature range allows this transistor to function reliably in challenging thermal conditions.

Maximum Collector-Emitter Voltage: 12 V

The high collector-emitter voltage rating provides robustness and protects the transistor against voltage spikes.

Transistor Element Material: SILICON

Silicon material offers excellent performance, reliability, and stability, ensuring long-lasting operation of the transistor.

Maximum Collector Current (IC): 0.035 A

The maximum collector current rating allows this transistor to handle high current loads, making it suitable for power applications.

Terminal Finish: TIN

The tin terminal finish offers corrosion resistance and facilitates soldering, ensuring a secure and durable electrical connection.

Terminal Position: DUAL

The dual terminal position allows for versatile mounting options and provides flexibility in circuit design.

Moisture Sensitivity Level (MSL): 1

The low moisture sensitivity level ensures reliable performance and longevity, even in humid environments.

Maximum Time At Peak Reflow Temperature (s): 30

This transistor can withstand peak reflow temperatures for up to 30 seconds, ensuring proper soldering during assembly.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature, this transistor can be soldered efficiently using standard reflow processes.

Reference Standard: CECC

Compliant with the CECC reference standard, this transistor meets industry quality and performance requirements.

Nominal Transition Frequency (fT): 6000 MHz

The high nominal transition frequency allows for fast switching speeds and efficient signal processing, making this transistor suitable for high-frequency applications.

Technical Specifications

RF Small Signal Bipolar Junction Transistors (BJT) BFR93A,215 attributes and parameters. Explore more RF Small Signal Bipolar Junction Transistors (BJT) devices from NXP Semiconductors

Specs

Additional Features:

LOW NOISE

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

12 V

Configuration:

Minimum DC Current Gain (hFE):

40

Highest Frequency Band:

L BAND

JEDEC-95 Code:

TO-236AB

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

NPN

Maximum Power Dissipation Ambient:

.3 W

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Reference Standard:

CECC

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Trade Compliance

BFR93A,215 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.21.00.75

SB

8541.21.00.80

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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