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MPSH17

Onsemi

MPSH17 by Onsemi

The Onsemi MPSH17 is an NPN RF BJT transistor with a max fT of 800 MHz. It has a max Vce of 15V and Pdiss of 0.625W, ideal for amplifier applications in the very high frequency band. The package is cylindrical with through-hole terminals, making it suitable for various electronic designs.

Median Price

$0.090

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 42,000 parts In-Stock

1+ parts

-

100+ parts

$0.079

1k+ parts

$0.066

10k+ parts

$0.059

42,000

-

$0.079

$0.066

$0.059

DigiKey

USA . 42,000 parts In-Stock

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-

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$0.100

42,000

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$0.100

Distributors (In-Stock)

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Digiode

USA . 285 parts In-Stock

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$0.062

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285

$0.062

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Vyrian

USA . 1,756 parts In-Stock

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$0.065

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1,756

$0.065

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TEDSS.com

USA . 96 parts In-Stock

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$0.140

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96

$0.140

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Ace Electronics

USA . 1,420 parts In-Stock

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$1.000

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$1.000

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American Microsemiconductor Inc.

USA . 899 parts In-Stock

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$1.250

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899

$1.250

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R&J Components

USA . 9,000 parts In-Stock

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9,000

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Bristol Electronics

USA . 2,000 parts In-Stock

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$0.113

1k+ parts

$0.068

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2,000

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$0.113

$0.068

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MISTER SPROCKETS

USA . 479 parts In-Stock

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479

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Electronic Expediters

USA . 385 parts In-Stock

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385

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Prism Electronics

USA . 167 parts In-Stock

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Extreme Components

USA . 109 parts In-Stock

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DF Sales Co.

USA . 90 parts In-Stock

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90

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DF Sales Co.

USA . 90 parts In-Stock

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90

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Distributors (Availability)

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Corphita

USA . 3,175 parts In-Stock

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$0.058

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$0.058

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Corohmni

South Africa . 319 parts In-Stock

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$0.065

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319

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Metaverse IC Inc.

Canada . 36,530 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 26,863 parts In-Stock

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SupplyDigital Components

Austria . 8,104 parts In-Stock

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Kulean Microsystems

USA . 7,308 parts In-Stock

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TANS Electronics

Latvia . 6,618 parts In-Stock

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Problanco Electronics

Mexico . 4,373 parts In-Stock

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Authorized Procurement Solutions

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UHIMA Technologies

Türkiye . 832 parts In-Stock

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Supply Digital

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Perfect Parts

USA . 179 parts In-Stock

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Overview

Unleash the power of high-quality RF Small Signal Bipolar Junction Transistors with the MPSH17 from Onsemi. This NPN transistor offers outstanding performance in amplifier applications within the very high-frequency band. With a robust package body material and maximum power dissipation, this transistor ensures reliability and efficiency. Whether you're designing communication systems or amplifiers, the MPSH17 provides the value, benefits, and advantages you need to take your projects to the next level. Trust Onsemi for superior quality and cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good insulation and durability, making the transistor suitable for various environmental conditions.

Polarity or Channel Type: NPN

NPN type transistor is commonly used in amplifier circuits, offering good performance in signal amplification.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150 °C, this transistor can handle higher temperatures without compromising its performance.

Nominal Transition Frequency (fT): 800 MHz

The high nominal transition frequency of 800 MHz indicates that this transistor can operate efficiently at high frequencies, making it suitable for amplifier applications.

Maximum Collector-Emitter Voltage: 15 V

The maximum collector-emitter voltage of 15V allows for a wide range of voltage applications while maintaining stability.

Technical Specifications

RF Small Signal Bipolar Junction Transistors (BJT) MPSH17 attributes and parameters. Explore more RF Small Signal Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Maximum Collector-Base Capacitance:

.9 pF

Maximum Collector-Emitter Voltage:

15 V

Configuration:

Minimum DC Current Gain (hFE):

25

Highest Frequency Band:

VERY HIGH FREQUENCY BAND

JEDEC-95 Code:

TO-92

JESD-30 Code:

O-PBCY-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

CYLINDRICAL

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

NPN

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

BOTTOM

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Trade Compliance

MPSH17 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

NSN

5961-01-052-3893, 5961010523893

NIIN

010523893

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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