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MPSH10G

Onsemi

MPSH10G by Onsemi

MPSH10G by Onsemi is an NPN RF BJT transistor with a max collector-emitter voltage of 25V and fT of 650MHz. Ideal for amplifier applications, it has a max power dissipation of 0.35W and operates in the ultra-high frequency band.

Median Price

$0.380

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

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Component Electronics Inc.

Canada . 35 parts In-Stock

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$0.380

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$0.290

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$0.250

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35

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Vyrian

USA . 7,414 parts In-Stock

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Chip Stock

USA . 5,250 parts In-Stock

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5,250

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Digiode

USA . 676 parts In-Stock

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676

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ComSIT Distribution GmbH

Germany . 150 parts In-Stock

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150

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ComSIT USA

USA . 150 parts In-Stock

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150

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Nova Conductors

Japan . 69 parts In-Stock

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69

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Distributors (Availability)

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Corohmni

South Africa . 273 parts In-Stock

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$0.380

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273

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Ampacity Inc.

Singapore . 733 parts In-Stock

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$4.050

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733

$4.050

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AZTECH Wire

Italy . 346 parts In-Stock

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$18.224

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346

$18.224

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Component Stockers USA

USA . 488 parts In-Stock

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$99.990

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488

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Perfect Parts

USA . 14,676 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,621 parts In-Stock

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TANS Electronics

Latvia . 4,196 parts In-Stock

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Kulean Microsystems

USA . 3,410 parts In-Stock

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Problanco Electronics

Mexico . 2,882 parts In-Stock

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Continental Prestige Electronics

USA . 2,161 parts In-Stock

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Argo Parts USA

USA . 2,043 parts In-Stock

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Corphita

USA . 790 parts In-Stock

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SupplyDigital Components

Austria . 224 parts In-Stock

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UHIMA Technologies

Türkiye . 137 parts In-Stock

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137

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Aranea Global

USA . 100 parts In-Stock

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Overview

Unleash the power of advanced technology with the MPSH10G by Onsemi. This RF Small Signal Bipolar Junction Transistor offers unparalleled quality and performance, thanks to its cutting-edge design and superior manufacturing standards. Ideal for amplifier applications in the ultra-high frequency band, this NPN transistor guarantees optimal functionality and reliability. Experience seamless integration and enhanced efficiency with the MPSH10G, setting new benchmarks in the world of electronic components. Elevate your projects with Onsemi's innovative solutions today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good mechanical strength and protection for the internal components of the transistor.

Polarity or Channel Type: NPN

Commonly used for amplification applications, ensuring compatibility with many circuits.

Configuration: SINGLE

Simplifies circuit design and integration, making it easier to incorporate into electronic systems.

Transistor Application: AMPLIFIER

Specifically designed for amplification purposes, ensuring optimal performance in such applications.

No. of Terminals: 3

Provides the necessary connections for proper operation and integration within a circuit.

Maximum Power Dissipation (Abs): 0.35 W

Can handle a substantial amount of power, making it suitable for many high-frequency applications.

Maximum Collector-Base Capacitance: 0.7 pF

Low capacitance minimizes signal distortion and ensures high-frequency performance.

Maximum Collector-Emitter Voltage: 25 V

Allows for higher voltage operation, expanding the range of potential applications.

Maximum Collector Current (IC): 0.1 A

Able to handle moderate current levels, suitable for various amplification tasks.

Nominal Transition Frequency (fT): 650 MHz

High transition frequency enables efficient amplification of high-frequency signals.

Technical Specifications

RF Small Signal Bipolar Junction Transistors (BJT) MPSH10G attributes and parameters. Explore more RF Small Signal Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Maximum Collector Current (IC):

Maximum Collector-Base Capacitance:

.7 pF

Maximum Collector-Emitter Voltage:

25 V

Configuration:

Minimum DC Current Gain (hFE):

60

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JEDEC-95 Code:

TO-92

JESD-30 Code:

O-PBCY-T3

JESD-609 Code:

e1

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

CYLINDRICAL

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

NPN

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

NO

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

THROUGH-HOLE

Terminal Position:

BOTTOM

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Trade Compliance

MPSH10G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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