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MMBT918LT1G

Onsemi

MMBT918LT1G by Onsemi

MMBT918LT1G by Onsemi is an NPN RF BJT with a max fT of 600 MHz. It has a Pdiss of 0.3W and VCEO of 15V, ideal for UHF applications. This transistor comes in a small outline package suitable for surface mount designs.

Median Price

$0.039

Lifecycle Status

Suppliers In-Stock

22

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 10 parts In-Stock

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$0.028

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Mouser Electronics

USA . 327 parts In-Stock

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$0.140

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$0.058

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$0.039

327

$0.140

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$0.039

Chip1Stop

Japan . 64 parts In-Stock

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$0.634

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$0.634

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Arrow

USA . 27,000 parts In-Stock

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$0.033

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Verical

USA . 27,000 parts In-Stock

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$0.032

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Farnell

UK . 52 parts In-Stock

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$0.039

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$0.035

Element14

Singapore . 52 parts In-Stock

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52

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$0.061

Distributors (In-Stock)

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Nova Conductors

Japan . 300 parts In-Stock

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$0.067

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300

$0.067

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TME

Poland . 2,326 parts In-Stock

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$0.110

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$0.052

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2,326

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Digiode

USA . 1,386 parts In-Stock

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$0.276

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Chip Stock

USA . 184,367 parts In-Stock

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IBS Electronics

USA . 47,430 parts In-Stock

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Cyclops Electronics Ltd

UK . 26,341 parts In-Stock

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NAC Semi

USA . 18,000 parts In-Stock

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$0.098

18,000

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Vyrian

USA . 9,972 parts In-Stock

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Infinite Electronics LLP

India . 9,000 parts In-Stock

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Speed Components Ltd

Israel . 6,000 parts In-Stock

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Bristol Electronics

USA . 3,737 parts In-Stock

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Flip Electronics

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LWI Electronics Inc

India . 2,900 parts In-Stock

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2,900

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Inventory MP

USA . 2,767 parts In-Stock

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Atlantic Semiconductor

USA . 970 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 10,079 parts In-Stock

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$0.037

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$0.037

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Semicontronic

India . 9,826 parts In-Stock

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Corohmni

South Africa . 364 parts In-Stock

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$0.057

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364

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Netroflash

USA . 2,000 parts In-Stock

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$0.067

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$0.065

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Argo Parts USA

USA . 1,373 parts In-Stock

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$0.067

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Corphita

USA . 1,040 parts In-Stock

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$0.261

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Continental Prestige Electronics

USA . 11,545 parts In-Stock

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$0.278

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$0.097

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$0.052

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Aztec Data Supply Inc.

USA . 619 parts In-Stock

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$0.527

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Metaverse IC Inc.

Canada . 180,000 parts In-Stock

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Perfect Parts

USA . 161,784 parts In-Stock

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Allen Electronics Distributors

USA . 29,900 parts In-Stock

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$0.041

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Authorized Procurement Solutions

USA . 18,000 parts In-Stock

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Eastek

USA . 18,000 parts In-Stock

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GreenTree Electronics

Israel . 18,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 11,288 parts In-Stock

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SupplyDigital Components

Austria . 8,019 parts In-Stock

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Legend Electronics Inc. (Excess)

USA . 5,388 parts In-Stock

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Speed Components Ltd (Excess)

Israel . 5,388 parts In-Stock

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Problanco Electronics

Mexico . 3,592 parts In-Stock

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Kepictronics

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TANS Electronics

Latvia . 2,959 parts In-Stock

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Kulean Microsystems

USA . 2,827 parts In-Stock

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Lixinc

USA . 1,497 parts In-Stock

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Futuretech Components

Singapore . 700 parts In-Stock

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UHIMA Technologies

Türkiye . 47 parts In-Stock

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Overview

Experience unparalleled performance with the MMBT918LT1G by Onsemi, a top-of-the-line RF Small Signal Bipolar Junction Transistor that delivers exceptional quality and reliability. With Onsemi's reputation for excellence in semiconductor manufacturing, this product ensures superior functionality and durability. Ideal for a wide range of applications in the ultra-high-frequency band, this NPN transistor offers customers unmatched value and benefits. Trust in Onsemi's expertise and choose the MMBT918LT1G for all your RF small signal needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the transistor, ensuring reliable performance in various operating conditions.

Polarity or Channel Type: NPN

Commonly used in amplification circuits, making it versatile for a wide range of applications.

Configuration: SINGLE

Simplified design with only one transistor in the package, making it easier to integrate into circuits.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards, saving space and simplifying assembly processes.

Package Shape: RECTANGULAR

Efficient use of space on the circuit board, enabling compact designs.

Terminal Form: GULL WING

Facilitates reliable soldering and connection to the circuit board.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Suitable for high-frequency applications such as radio frequency communication systems.

No. of Terminals: 3

Simple and straightforward connection to the circuit, reducing complexity in circuit design.

Maximum Power Dissipation (Abs): 0.3 W

Can handle moderate power levels, suitable for low to medium power applications.

Package Style (Meter): SMALL OUTLINE

Compact package size saves space on the circuit board.

Minimum DC Current Gain (hFE): 20

Ensures stable and consistent amplification performance.

Maximum Operating Temperature: 150 °C

Can operate effectively in elevated temperatures without compromising performance.

Maximum Collector-Base Capacitance: 3 pF

Low capacitance helps in high-frequency applications by reducing signal distortion.

Maximum Collector-Emitter Voltage: 15 V

Can handle moderate voltage levels, suitable for various circuit requirements.

Transistor Element Material: SILICON

Silicon transistors are known for their reliability and performance in electronic circuits.

Maximum Collector Current (IC): 0.05 A

Can handle moderate current levels, suitable for low to medium power circuits.

Terminal Finish: MATTE TIN

Provides a reliable and corrosion-resistant finish on the terminals for long-term performance.

Terminal Position: DUAL

Facilitates easy and secure connection to the circuit board.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for safe and efficient soldering during assembly processes.

Peak Reflow Temperature °C: 260

Withstands high-temperature reflow soldering processes without damage.

Nominal Transition Frequency (fT): 600 MHz

High transition frequency allows for high-speed signal processing in communication and RF circuits.

Technical Specifications

RF Small Signal Bipolar Junction Transistors (BJT) MMBT918LT1G attributes and parameters. Explore more RF Small Signal Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Maximum Collector Current (IC):

Maximum Collector-Base Capacitance:

3 pF

Maximum Collector-Emitter Voltage:

15 V

Configuration:

Minimum DC Current Gain (hFE):

20

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JEDEC-95 Code:

TO-236

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

NPN

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Trade Compliance

MMBT918LT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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