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MMBTH24-7-F

Diodes Incorporated

MMBTH24-7-F by Diodes Incorporated

Diodes Inc. MMBTH24-7-F is a NPN BJT transistor for RF applications. Features include 400MHz fT, 40V VCEO, and 0.3W Ptot. Ideal for ultra-high frequency amplification in compact SOT package with Gull Wing terminals.

Median Price

$0.029

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 2,498 parts In-Stock

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$0.029

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$0.029

Distributors (In-Stock)

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Nova Conductors

Japan . 10 parts In-Stock

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$0.052

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10

$0.052

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Vyrian

USA . 2,629 parts In-Stock

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2,629

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Sensible Micro Corp

USA . 373 parts In-Stock

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Ampacity Inc.

Singapore . 2,150 parts In-Stock

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$0.025

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$0.025

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Continental Prestige Electronics

USA . 6,250 parts In-Stock

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$0.052

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Argo Parts USA

USA . 152 parts In-Stock

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$0.052

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$0.050

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$0.050

AZTECH Wire

Italy . 911 parts In-Stock

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$16.360

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911

$16.360

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RC Electronics

USA . 36,900 parts In-Stock

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$0.060

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$0.060

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$0.060

Perfect Parts

USA . 34,168 parts In-Stock

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Lixinc

USA . 15,853 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 7,609 parts In-Stock

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7,609

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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iodParts Technologies Inc.

India . 900 parts In-Stock

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900

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Netroflash

USA . 100 parts In-Stock

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100+ parts

$0.051

1k+ parts

$0.049

10k+ parts

$0.048

100

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$0.051

$0.049

$0.048

Overview

Unlock the power of ultra-high frequency band amplification with the MMBTH24-7-F by Diodes Incorporated. Crafted with precision and expertise, this RF Small Signal Bipolar Junction Transistor offers unparalleled quality and performance. Ideal for a range of applications, from amplifiers to signal processing, this NPN transistor is designed to elevate your projects to new heights. Experience the benefits of superior design and reliability with Diodes Incorporated - trust in innovation, trust in excellence. Choose the MMBTH24-7-F for exceptional value and unmatched results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the transistor.

Polarity or Channel Type: NPN

Commonly used for amplification circuits, making it versatile for various applications.

Configuration: SINGLE

Simplifies circuit design and makes installation easier.

Transistor Application: AMPLIFIER

Specifically designed for amplification tasks, ensuring optimal performance in this application.

Surface Mount: YES

Allows for easy and efficient PCB mounting, saving space and simplifying assembly.

Maximum Operating Temperature: 150 °C

Can withstand high temperatures, making it suitable for various operating environments.

Maximum Collector Current (IC): 0.05 A

Provides sufficient current handling capability for most small signal applications.

Nominal Transition Frequency (fT): 400 MHz

High transition frequency allows for fast switching speeds and high-frequency performance.

Technical Specifications

RF Small Signal Bipolar Junction Transistors (BJT) MMBTH24-7-F attributes and parameters. Explore more RF Small Signal Bipolar Junction Transistors (BJT) devices from Diodes Incorporated

Specs

Maximum Collector Current (IC):

Maximum Collector-Base Capacitance:

.7 pF

Maximum Collector-Emitter Voltage:

40 V

Configuration:

Minimum DC Current Gain (hFE):

30

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

NPN

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Trade Compliance

MMBTH24-7-F Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Diodes Incorporated

Diodes Incorporated is an international leader in the design and production of high-grade application specific standard products utilized in a wide variety of industries. The company has developed cutting-edge technology that enhances the performance and reliability of components for consumer, industrial, automotive and communication applications. Established in 1959, Diodes Incorporated has been providing superior services to its customers by creating innovative solutions from their world-class manufacturing centers located around the world. Their commitment to delivering quality products extends to their selection of materials which are carefully chosen to meet the demand of both commercial and military requirements.

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Management team

Chairman and CEO

Keh-Shew Lu 

CFO

Brett R. Whitmire 

Lead Director

Angie Chen Button

Manufacturer fab locations 11

Fab name Location Fab Initiation Wafer Capacity

Fab 1

Fabrication

Fab Initiation

1987

China

Shanghai

Wafer Capacity

40,000

1987

40,000

Zizhu Fab 1

Fabrication

Fab Initiation

2013

China

Shanghai

Wafer Capacity

18,500

2013

18,500

G Fab

Fabrication

Fab Initiation

2008

UK

Greenock

Wafer Capacity

8,000

2008

8,000

Keelung Fab

Fabrication

Fab Initiation

1990

Taiwan

Keelung

Wafer Capacity

58,000

1990

58,000

Wuxi Fab

Fabrication

Fab Initiation

2004

China

Wuxi

Wafer Capacity

190,000

2004

190,000

Shanghai Fab

Fabrication

Fab Initiation

1993

China

Shanghai

Wafer Capacity

110,000

1993

110,000

G Fab

Fabrication

Fab Initiation

1970

UK

Greenock

Wafer Capacity

22,000

1970

22,000

Hsinchu Fab

Fabrication

Fab Initiation

1998

Taiwan

Hsinchu

Wafer Capacity

38,000

1998

38,000

Fab 2

Fabrication

Fab Initiation

2003

China

Shanghai

Wafer Capacity

20,000

2003

20,000

SPFAB

Fabrication

Fab Initiation

1995

USA

South Portland

Wafer Capacity

17,000

1995

17,000

N/A

Fabrication

Fab Initiation

1982

UK

Oldham

Wafer Capacity

4,000

1982

4,000

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