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BFP420H6327XTSA1

Infineon Technologies

BFP420H6327XTSA1 by Infineon Technologies

Infineon's BFP420H6327XTSA1 is an NPN RF BJT transistor with a max fT of 25 GHz. It is ideal for X Band applications, featuring a max VCE of 4.5V and IC of 0.035A. The transistor operates in temperatures as low as -65°C and complies with AEC-Q101 standards.

Median Price

$0.312

Lifecycle Status

Suppliers In-Stock

22

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 2,892 parts In-Stock

1+ parts

$0.163

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2,892

$0.163

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Newark

USA . 225 parts In-Stock

1+ parts

$0.410

100+ parts

$0.210

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$0.163

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225

$0.410

$0.210

$0.163

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Distrelec

Netherlands . 3,000 parts In-Stock

1+ parts

$0.501

100+ parts

$0.447

1k+ parts

$0.370

10k+ parts

-

3,000

$0.501

$0.447

$0.370

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DigiKey

USA . 577 parts In-Stock

1+ parts

$0.550

100+ parts

$0.296

1k+ parts

$0.251

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577

$0.550

$0.296

$0.251

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Rochester

USA . 470,568 parts In-Stock

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$0.233

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$0.193

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$0.172

470,568

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$0.233

$0.193

$0.172

Chip1Stop

Japan . 5,680 parts In-Stock

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5,680

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Verical

USA . 5,680 parts In-Stock

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$0.304

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$0.258

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$0.234

5,680

-

$0.304

$0.258

$0.234

Element14

Singapore . 3,659 parts In-Stock

1+ parts

-

100+ parts

$0.312

1k+ parts

$0.289

10k+ parts

$0.272

3,659

-

$0.312

$0.289

$0.272

Farnell

UK . 3,094 parts In-Stock

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$0.204

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$0.160

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$0.151

3,094

-

$0.204

$0.160

$0.151

RS (Exports)

UK . 3,000 parts In-Stock

1+ parts

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$0.458

1k+ parts

$0.390

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3,000

-

$0.458

$0.390

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 678 parts In-Stock

1+ parts

$0.180

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678

$0.180

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TME

Poland . 4,759 parts In-Stock

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$0.210

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$0.193

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4,759

$0.210

$0.193

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Nova Conductors

Japan . 300 parts In-Stock

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$0.268

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300

$0.268

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Chip Stock

USA . 367,500 parts In-Stock

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367,500

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NAC Semi

USA . 90,000 parts In-Stock

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$0.387

90,000

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$0.387

Vyrian

USA . 24,701 parts In-Stock

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24,701

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IBS Electronics

USA . 12,000 parts In-Stock

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$0.233

12,000

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$0.233

Semi Source

USA . 9,772 parts In-Stock

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9,772

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Rutronik

Germany . 3,000 parts In-Stock

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Elcom Components

USA . 2,815 parts In-Stock

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2,815

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Schukat

Germany . 1,400 parts In-Stock

1+ parts

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$0.272

1k+ parts

$0.188

10k+ parts

$0.181

1,400

-

$0.272

$0.188

$0.181

VNN

France . 800 parts In-Stock

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800

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 23,953 parts In-Stock

1+ parts

$0.151

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23,953

$0.151

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Semicontronic

India . 23,802 parts In-Stock

1+ parts

$0.151

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$0.147

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$0.146

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23,802

$0.151

$0.147

$0.146

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Corphita

USA . 464 parts In-Stock

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$0.171

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464

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Argo Parts USA

USA . 1,524 parts In-Stock

1+ parts

$0.268

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$0.260

1,524

$0.268

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$0.260

Netroflash

USA . 100 parts In-Stock

1+ parts

$0.268

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$0.255

10k+ parts

$0.249

100

$0.268

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$0.255

$0.249

Aztec Data Supply Inc.

USA . 1,809 parts In-Stock

1+ parts

$0.354

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1,809

$0.354

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Continental Prestige Electronics

USA . 10,474 parts In-Stock

1+ parts

$0.514

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$0.305

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$0.200

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10,474

$0.514

$0.305

$0.200

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Modulus Dynamics

Lithuania . 9,027 parts In-Stock

1+ parts

$0.964

100+ parts

$0.925

1k+ parts

$0.887

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9,027

$0.964

$0.925

$0.887

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Corohmni

South Africa . 99 parts In-Stock

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$1.368

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Perfect Parts

USA . 155,857 parts In-Stock

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155,857

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Eastek

USA . 138,000 parts In-Stock

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$0.330

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$0.330

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Glotronic Ltd.

UK . 105,600 parts In-Stock

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S.R.D Solutions

India . 60,000 parts In-Stock

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Alle Elektronik GmbH

Germany . 7,393 parts In-Stock

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7,393

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iodParts Technologies Inc.

India . 2,615 parts In-Stock

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2,615

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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2,500

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GreenTree Electronics

Israel . 614 parts In-Stock

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614

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Robosynatics

Brazil . 300 parts In-Stock

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300

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Lucentia Tech

USA . 300 parts In-Stock

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300

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Overview

Discover the power and precision of the BFP420H6327XTSA1 by Infineon Technologies, a top-quality RF Small Signal Bipolar Junction Transistor designed for amplifier applications in the X Band frequency range. With a single NPN configuration and small outline package, this transistor offers high performance in a compact design. Infineon Technologies' reputation for excellence ensures that you're getting a reliable and efficient product. Experience seamless integration with its surface mount capability and maximize your projects with the superior technology of the BFP420H6327XTSA1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material of the package body provides durability and protection for the transistor, making it a reliable choice for various applications.

Polarity or Channel Type: NPN

The NPN polarity or channel type allows for easy integration into circuits, making this transistor versatile and compatible with a wide range of electronic devices.

Configuration: SINGLE

The single configuration simplifies the design and installation process, making this transistor user-friendly and ideal for DIY projects.

Transistor Application: AMPLIFIER

Designed specifically for amplifier applications, this transistor ensures high performance and efficiency in signal amplification tasks.

Surface Mount: YES

The surface mount capability makes this transistor easy to install and saves valuable space on circuit boards, making it a practical choice for compact designs.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy integration into circuit layouts, enhancing the overall efficiency and performance of the transistor.

Terminal Form: GULL WING

The gull wing terminal form ensures secure connections and reliable performance, making this transistor a dependable choice for critical electronic systems.

Highest Frequency Band: X BAND

The X band frequency range enables high-speed signal processing and transmission, making this transistor ideal for applications requiring fast data transfer.

No. of Terminals: 4

With 4 terminals, this transistor offers flexibility in circuit connections and configurations, allowing for versatile use in a variety of electronic projects.

Package Style (Meter): SMALL OUTLINE

The small outline package style provides space-saving benefits and ease of handling, making this transistor a convenient choice for compact electronic designs.

Technical Specifications

RF Small Signal Bipolar Junction Transistors (BJT) BFP420H6327XTSA1 attributes and parameters. Explore more RF Small Signal Bipolar Junction Transistors (BJT) devices from Infineon Technologies

Specs

Additional Features:

HIGH RELIABILITY, LOW NOISE

Maximum Collector Current (IC):

Maximum Collector-Base Capacitance:

.3 pF

Maximum Collector-Emitter Voltage:

4.5 V

Configuration:

Highest Frequency Band:

X BAND

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

4

Minimum Operating Temperature:

-65 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

NPN

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Trade Compliance

BFP420H6327XTSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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