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NSVF5488SKT3G

Onsemi

NSVF5488SKT3G by Onsemi

NSVF5488SKT3G by Onsemi is an NPN BJT transistor with a max fT of 7000 MHz. It has a max IC of 0.07 A and hFE of 90, ideal for amplifier applications in the UHF band. The package is a small outline with flat terminals, suitable for surface mount assembly.

Median Price

$1.140

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

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DigiKey

USA . 5,393 parts In-Stock

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$0.410

100+ parts

$0.218

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$0.184

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$0.175

5,393

$0.410

$0.218

$0.184

$0.175

Chip1Stop

Japan . 1,675 parts In-Stock

1+ parts

$1.870

100+ parts

$0.548

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$0.366

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1,675

$1.870

$0.548

$0.366

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Flip Electronics (Authorized)

USA . 7,610 parts In-Stock

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7,610

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Vyrian

USA . 1,774 parts In-Stock

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$0.228

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1,774

$0.228

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Digiode

USA . 1,055 parts In-Stock

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$0.494

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$0.494

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Flip Electronics

USA . 280 parts In-Stock

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280

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Corohmni

South Africa . 385 parts In-Stock

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$0.228

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385

$0.228

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Corphita

USA . 1,323 parts In-Stock

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$0.468

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Perfect Parts

USA . 68,236 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 23,438 parts In-Stock

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Kepictronics

USA . 7,925 parts In-Stock

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Authorized Procurement Solutions

USA . 7,825 parts In-Stock

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GreenTree Electronics

Israel . 7,775 parts In-Stock

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Kulean Microsystems

USA . 7,239 parts In-Stock

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TANS Electronics

Latvia . 4,782 parts In-Stock

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Problanco Electronics

Mexico . 4,084 parts In-Stock

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SupplyDigital Components

Austria . 1,964 parts In-Stock

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UHIMA Technologies

Türkiye . 273 parts In-Stock

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Overview

Enhance your electronic projects with the NSVF5488SKT3G by Onsemi, a top-tier manufacturer of RF Small Signal Bipolar Junction Transistors. This NPN transistor, ideal for amplifier applications in the ultra-high frequency band, offers exceptional quality and reliability in a compact package. With a minimum DC current gain of 90 and maximum collector-emitter voltage of 10V, this transistor delivers superior performance and efficiency. Trust Onsemi for cutting-edge technology that brings your designs to life. Upgrade to the NSVF5488SKT3G and experience the difference in your projects today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the transistor, making it suitable for a variety of applications.

Transistor Application: AMPLIFIER

Designed specifically for amplifier applications, ensuring reliable performance in amplifying signals.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Ideal for applications requiring high-frequency operation, such as radio frequency communication systems.

Minimum DC Current Gain (hFE): 90

High DC current gain ensures efficient amplification of signals with minimal input current.

Maximum Collector-Emitter Voltage: 10 V

With a high collector-emitter voltage rating, this transistor can handle high voltage applications.

Maximum Operating Temperature: 150 °C

Can operate effectively in high-temperature environments, suitable for demanding industrial applications.

Technical Specifications

RF Small Signal Bipolar Junction Transistors (BJT) NSVF5488SKT3G attributes and parameters. Explore more RF Small Signal Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Maximum Collector Current (IC):

Maximum Collector-Base Capacitance:

1.2 pF

Maximum Collector-Emitter Voltage:

10 V

Configuration:

Minimum DC Current Gain (hFE):

90

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-PDSO-F3

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

NPN

Maximum Power Dissipation Ambient:

.1 W

Maximum Power Dissipation (Abs):

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

TIN BISMUTH

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Trade Compliance

NSVF5488SKT3G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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