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BFP410H6327XTSA1

Infineon Technologies

BFP410H6327XTSA1 by Infineon Technologies

NPN; Configuration: SINGLE; Surface Mount: YES; Nominal Transition Frequency (fT): 25000 MHz; Maximum Collector Current (IC): .04 A; Package Shape: RECTANGULAR;

Median Price

$0.362

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 2,269 parts In-Stock

1+ parts

$0.480

100+ parts

$0.263

1k+ parts

$0.223

10k+ parts

$0.199

2,269

$0.480

$0.263

$0.223

$0.199

Mouser Electronics

USA . 330 parts In-Stock

1+ parts

$0.540

100+ parts

$0.320

1k+ parts

$0.209

10k+ parts

$0.165

330

$0.540

$0.320

$0.209

$0.165

Newark

USA . 64 parts In-Stock

1+ parts

$0.557

100+ parts

$0.335

1k+ parts

$0.297

10k+ parts

-

64

$0.557

$0.335

$0.297

-

Rochester

USA . 11,418 parts In-Stock

1+ parts

-

100+ parts

$0.244

1k+ parts

$0.203

10k+ parts

$0.181

11,418

-

$0.244

$0.203

$0.181

Verical

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.226

3,000

-

-

-

$0.226

Chip1Stop

Japan . 2,990 parts In-Stock

1+ parts

-

100+ parts

$0.239

1k+ parts

-

10k+ parts

-

2,990

-

$0.239

-

-

Distrelec

Netherlands . 2,982 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,982

-

-

-

-

Element14

Singapore . 214 parts In-Stock

1+ parts

-

100+ parts

$26.620

1k+ parts

$14.830

10k+ parts

$13.760

214

-

$26.620

$14.830

$13.760

Farnell

UK . 64 parts In-Stock

1+ parts

-

100+ parts

$0.204

1k+ parts

$0.186

10k+ parts

$0.171

64

-

$0.204

$0.186

$0.171

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 95 parts In-Stock

1+ parts

$0.160

100+ parts

-

1k+ parts

-

10k+ parts

-

95

$0.160

-

-

-

Digiode

USA . 242 parts In-Stock

1+ parts

$0.161

100+ parts

-

1k+ parts

-

10k+ parts

-

242

$0.161

-

-

-

NAC Semi

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.530

3,000

-

-

-

$0.530

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 777 parts In-Stock

1+ parts

$0.152

100+ parts

-

1k+ parts

-

10k+ parts

-

777

$0.152

-

-

-

Modulus Dynamics

Lithuania . 21,422 parts In-Stock

1+ parts

$1.472

100+ parts

$1.413

1k+ parts

$1.354

10k+ parts

-

21,422

$1.472

$1.413

$1.354

-

Epart123

USA . 90,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.104

90,000

-

-

-

$0.104

RC Electronics

USA . 70,000 parts In-Stock

1+ parts

-

100+ parts

$0.240

1k+ parts

$0.230

10k+ parts

$0.220

70,000

-

$0.240

$0.230

$0.220

QUARKTWIN TECHNOLOGY LTD

USA . 6,920 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,920

-

-

-

-

Perfect Parts

USA . 3,343 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,343

-

-

-

-

GreenTree Electronics

Israel . 2,980 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,980

-

-

-

-

iodParts Technologies Inc.

India . 2,965 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.367

10k+ parts

-

2,965

-

-

$0.367

-

Continental Prestige Electronics

USA . 2,014 parts In-Stock

1+ parts

-

100+ parts

$0.302

1k+ parts

$0.197

10k+ parts

$0.174

2,014

-

$0.302

$0.197

$0.174

Native Components

USA . 911 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.182

10k+ parts

-

911

-

-

$3.182

-

Northwest PG Solutions

USA . 464 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.214

10k+ parts

-

464

-

-

$3.214

-

Technical Specifications

RF Small Signal Bipolar Junction Transistors (BJT) BFP410H6327XTSA1 attributes and parameters. Explore more RF Small Signal Bipolar Junction Transistors (BJT) devices from Infineon Technologies

Specs

Maximum Collector Current (IC):

Maximum Collector-Base Capacitance:

.17 pF

Maximum Collector-Emitter Voltage:

4.5 V

Configuration:

Highest Frequency Band:

L BAND

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

4

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

NPN

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Trade Compliance

BFP410H6327XTSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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