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BFP640H6327XTSA1

Infineon Technologies

BFP640H6327XTSA1 by Infineon Technologies

BFP640H6327XTSA1 by Infineon Technologies is a NPN RF BJT transistor with 4 terminals, suitable for C band applications. It has a max fT of 40 GHz, IC of 0.05 A, and VCE of 4 V. Ideal for amplifier circuits in high-frequency communication systems due to its small outline package and silicon germanium material.

Median Price

$0.262

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 1,913 parts In-Stock

1+ parts

$0.185

100+ parts

$0.176

1k+ parts

$0.168

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-

1,913

$0.185

$0.176

$0.168

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DigiKey

USA . 1,915 parts In-Stock

1+ parts

$0.510

100+ parts

$0.280

1k+ parts

$0.238

10k+ parts

$0.216

1,915

$0.510

$0.280

$0.238

$0.216

Distrelec

Netherlands . 2,925 parts In-Stock

1+ parts

$0.629

100+ parts

$0.575

1k+ parts

$0.466

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2,925

$0.629

$0.575

$0.466

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Rochester

USA . 26,848 parts In-Stock

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$0.261

1k+ parts

$0.216

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$0.193

26,848

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$0.261

$0.216

$0.193

Future Electronics

Canada . 24,000 parts In-Stock

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$0.167

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$0.167

Verical

USA . 24,000 parts In-Stock

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$0.262

24,000

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$0.262

Element14

Singapore . 3,817 parts In-Stock

1+ parts

-

100+ parts

$0.366

1k+ parts

$0.348

10k+ parts

$0.334

3,817

-

$0.366

$0.348

$0.334

Farnell

UK . 3,772 parts In-Stock

1+ parts

-

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$0.217

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$0.207

10k+ parts

$0.198

3,772

-

$0.217

$0.207

$0.198

RS (Exports)

UK . 2,950 parts In-Stock

1+ parts

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$0.282

10k+ parts

$0.222

2,950

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$0.282

$0.222

Chip1Stop

Japan . 1,762 parts In-Stock

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1,762

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Digiode

USA . 709 parts In-Stock

1+ parts

$0.160

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709

$0.160

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Nova Conductors

Japan . 10 parts In-Stock

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$0.215

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10

$0.215

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TME

Poland . 2,617 parts In-Stock

1+ parts

$0.480

100+ parts

$0.264

1k+ parts

$0.244

10k+ parts

$0.230

2,617

$0.480

$0.264

$0.244

$0.230

NAC Semi

USA . 57,000 parts In-Stock

1+ parts

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$0.452

57,000

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$0.452

Vyrian

USA . 26,145 parts In-Stock

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26,145

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IBS Electronics

USA . 24,000 parts In-Stock

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$0.237

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$0.237

VNN

France . 120 parts In-Stock

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120

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Distributors (Availability)

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Ampacity Inc.

Singapore . 22,574 parts In-Stock

1+ parts

$0.104

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22,574

$0.104

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Semicontronic

India . 22,527 parts In-Stock

1+ parts

$0.104

100+ parts

$0.101

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$0.101

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22,527

$0.104

$0.101

$0.101

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Corphita

USA . 162 parts In-Stock

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$0.151

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162

$0.151

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Argo Parts USA

USA . 4,103 parts In-Stock

1+ parts

$0.214

100+ parts

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$0.208

4,103

$0.214

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$0.208

Netroflash

USA . 100 parts In-Stock

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$0.215

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$0.205

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$0.200

100

$0.215

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$0.205

$0.200

Continental Prestige Electronics

USA . 16,035 parts In-Stock

1+ parts

$0.397

100+ parts

$0.257

1k+ parts

$0.156

10k+ parts

$0.123

16,035

$0.397

$0.257

$0.156

$0.123

Modulus Dynamics

Lithuania . 10,164 parts In-Stock

1+ parts

$0.794

100+ parts

$0.762

1k+ parts

$0.730

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10,164

$0.794

$0.762

$0.730

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Aztec Data Supply Inc.

USA . 4,272 parts In-Stock

1+ parts

$1.389

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4,272

$1.389

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Corohmni

South Africa . 76 parts In-Stock

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$1.816

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$1.816

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Perfect Parts

USA . 265,755 parts In-Stock

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265,755

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Glotronic Ltd.

UK . 33,600 parts In-Stock

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S.R.D Solutions

India . 7,930 parts In-Stock

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GreenTree Electronics

Israel . 3,000 parts In-Stock

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iodParts Technologies Inc.

India . 2,646 parts In-Stock

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$0.274

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2,646

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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2,500

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Overview

Unlock the power of seamless connectivity with the BFP640H6327XTSA1 by Infineon Technologies. Crafted with precision and expertise, this RF Small Signal Bipolar Junction Transistor (BJT) offers unmatched quality and reliability. Whether it's for amplifier applications or data transmission, this NPN transistor in a compact rectangular package delivers exceptional performance in the C band frequency range. With its high transition frequency and low collector-base capacitance, this transistor is a game-changer in the world of wireless communication. Elevate your projects with the value and benefits that only the BFP640H6327XTSA1 can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides a durable and cost-effective packaging solution for this transistor.

Polarity or Channel Type: NPN

NPN polarity allows for easy integration into various circuit designs, making this transistor versatile.

Configuration: SINGLE

The single configuration simplifies circuit layouts and makes it suitable for individual amplifier applications.

Transistor Application: AMPLIFIER

Designed specifically for amplifier purposes, ensuring optimal performance in amplification tasks.

Surface Mount: YES

Surface mount compatibility enables easy and efficient assembly onto circuit boards.

Package Shape: RECTANGULAR

The rectangular shape offers space-saving advantages and easy integration into compact electronic devices.

Terminal Form: GULL WING

Gull wing terminal form provides secure connections and reliability in circuit connections.

Highest Frequency Band: C BAND

C-band frequency capabilities make this transistor ideal for high-frequency applications.

No. of Terminals: 4

The 4 terminals offer flexibility in circuit connections and compatibility with various electronic setups.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space and facilitates efficient circuit board designs.

Maximum Collector-Base Capacitance: 0.2 pF

The low collector-base capacitance enhances overall performance and stability in the transistor's operation.

Maximum Collector-Emitter Voltage: 4 V

With a maximum voltage of 4V, this transistor can handle a wide range of voltage applications effectively.

Transistor Element Material: SILICON GERMANIUM

Silicon Germanium material ensures high performance and reliability in various operating conditions.

Maximum Collector Current (IC): 0.05 A

The maximum collector current of 0.05A allows for reliable power handling capabilities in the transistor.

Terminal Finish: TIN

Tin terminal finish provides corrosion resistance and ensures long-term durability in circuit connections.

Terminal Position: DUAL

Dual terminal position allows for versatile mounting options and ease of integration into different circuit layouts.

Reference Standard: AEC-Q101

Compliance with the AEC-Q101 standard ensures high reliability and quality standards in automotive applications.

Nominal Transition Frequency (fT): 40000 MHz

With a high nominal transition frequency of 40000MHz, this transistor offers excellent high-frequency performance.

Technical Specifications

RF Small Signal Bipolar Junction Transistors (BJT) BFP640H6327XTSA1 attributes and parameters. Explore more RF Small Signal Bipolar Junction Transistors (BJT) devices from Infineon Technologies

Specs

Additional Features:

LOW NOISE, HIGH RELIABILITY

Maximum Collector Current (IC):

Maximum Collector-Base Capacitance:

.2 pF

Maximum Collector-Emitter Voltage:

4 V

Configuration:

Highest Frequency Band:

C BAND

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

4

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

NPN

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON GERMANIUM

Nominal Transition Frequency (fT):

Trade Compliance

BFP640H6327XTSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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