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BFP650H6327XTSA1

Infineon Technologies

BFP650H6327XTSA1 by Infineon Technologies

BFP650H6327XTSA1 by Infineon Technologies is a NPN RF Small Signal BJT with 4 terminals, suitable for X Band applications. It has a max fT of 42 GHz, max IC of 0.15 A, and max VCE of 4 V. Ideal for amplifier circuits in high-frequency communication systems due to its silicon germanium carbon element material.

Median Price

$0.270

Lifecycle Status

Suppliers In-Stock

22

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 1,124 parts In-Stock

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$0.150

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$0.150

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$0.150

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1,124

$0.150

$0.150

$0.150

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Arrow

USA . 1,794 parts In-Stock

1+ parts

$0.507

100+ parts

$0.257

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$0.199

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1,794

$0.507

$0.257

$0.199

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Mouser Electronics

USA . 622 parts In-Stock

1+ parts

$0.530

100+ parts

$0.272

1k+ parts

$0.249

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$0.230

622

$0.530

$0.272

$0.249

$0.230

EBV Elektronik

Germany . 21,000 parts In-Stock

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Verical

USA . 3,000 parts In-Stock

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$0.262

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Distrelec

Netherlands . 2,995 parts In-Stock

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RS (Exports)

UK . 2,950 parts In-Stock

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$0.432

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$0.281

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$0.259

2,950

-

$0.432

$0.281

$0.259

Element14

Singapore . 2,769 parts In-Stock

1+ parts

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$0.353

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$0.259

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$0.254

2,769

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$0.353

$0.259

$0.254

Chip1Stop

Japan . 1,420 parts In-Stock

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$0.136

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$0.130

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Farnell

UK . 637 parts In-Stock

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$0.270

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$0.253

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$0.221

637

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$0.221

DigiKey

USA . 387 parts In-Stock

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$0.266

387

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Digiode

USA . 384 parts In-Stock

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$0.130

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Nova Conductors

Japan . 650 parts In-Stock

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$0.231

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650

$0.231

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Chip Stock

USA . 340,500 parts In-Stock

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Vyrian

USA . 46,852 parts In-Stock

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Bristol Electronics

USA . 32,882 parts In-Stock

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NAC Semi

USA . 9,000 parts In-Stock

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$0.497

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$0.497

Greenchips

USA . 3,508 parts In-Stock

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3,508

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Rutronik

Germany . 3,000 parts In-Stock

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IBS Electronics

USA . 3,000 parts In-Stock

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$0.164

3,000

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$0.164

VNN

France . 1,795 parts In-Stock

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Cogito LLC

Ukraine . 58 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 43,306 parts In-Stock

1+ parts

$0.098

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$0.098

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Semicontronic

India . 27,691 parts In-Stock

1+ parts

$0.098

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$0.096

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$0.095

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27,691

$0.098

$0.096

$0.095

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Corphita

USA . 866 parts In-Stock

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$0.123

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$0.123

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Argo Parts USA

USA . 2,454 parts In-Stock

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$0.222

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$0.215

2,454

$0.222

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Netroflash

USA . 1,000 parts In-Stock

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$0.231

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$0.231

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Corohmni

South Africa . 175 parts In-Stock

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$0.425

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175

$0.425

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Modulus Dynamics

Lithuania . 8,279 parts In-Stock

1+ parts

$0.884

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$0.849

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$0.813

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8,279

$0.884

$0.849

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Aztec Data Supply Inc.

USA . 2,869 parts In-Stock

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$1.004

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2,869

$1.004

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Advanced Electronics

New Zealand . 270 parts In-Stock

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$1.554

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$1.414

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$1.274

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270

$1.554

$1.414

$1.274

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iodParts Technologies Inc.

India . 131,035 parts In-Stock

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Eastek

USA . 102,000 parts In-Stock

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Perfect Parts

USA . 32,319 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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GreenTree Electronics

Israel . 3,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 3,000 parts In-Stock

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Continental Prestige Electronics

USA . 2,469 parts In-Stock

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$0.248

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$0.150

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$0.118

2,469

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$0.248

$0.150

$0.118

Glotronic Ltd.

UK . 2,400 parts In-Stock

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Robosynatics

Brazil . 100 parts In-Stock

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100

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Lucentia Tech

USA . 100 parts In-Stock

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Overview

Experience the power of cutting-edge technology with the BFP650H6327XTSA1 by Infineon Technologies. Known for their superior quality and innovative designs, Infineon delivers top-of-the-line RF Small Signal Bipolar Junction Transistors (BJT) like no other. Perfect for amplifier applications in the X Band frequency range, this transistor offers unmatched performance and reliability. With Infineon's commitment to excellence, customers can trust in the value, benefits, and advantages that the BFP650H6327XTSA1 brings to their projects. Elevate your electronics with the best in the industry.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good durability and protection for the transistor, ensuring a longer lifespan.

Polarity or Channel Type: NPN

NPN transistors are commonly used for amplification and signal processing, making this transistor suitable for amplifier applications.

Configuration: SINGLE

Simplifies the circuit design and makes it easier to work with in amplifier applications.

Transistor Application: AMPLIFIER

Specifically designed for amplifier applications, ensuring optimal performance in such scenarios.

Surface Mount: YES

Enables easy and convenient mounting on circuit boards, saving space and simplifying manufacturing processes.

Maximum Collector-Base Capacitance: 0.4 pF

Low capacitance helps in reducing signal distortion and improving high-frequency performance.

Maximum Collector-Emitter Voltage: 4 V

Suitable for applications where low voltage operation is required, ensuring compatibility with various circuit designs.

Maximum Collector Current (IC): 0.15 A

Able to handle moderate current levels, making it suitable for a wide range of amplifier applications.

Nominal Transition Frequency (fT): 42000 MHz

High transition frequency allows for efficient amplification of high-frequency signals, making it ideal for X Band applications.

Technical Specifications

RF Small Signal Bipolar Junction Transistors (BJT) BFP650H6327XTSA1 attributes and parameters. Explore more RF Small Signal Bipolar Junction Transistors (BJT) devices from Infineon Technologies

Specs

Additional Features:

LOW NOISE

Maximum Collector Current (IC):

Maximum Collector-Base Capacitance:

.4 pF

Maximum Collector-Emitter Voltage:

4 V

Configuration:

Highest Frequency Band:

X BAND

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

4

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

NPN

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON GERMANIUM CARBON

Nominal Transition Frequency (fT):

Trade Compliance

BFP650H6327XTSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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